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SN74LVC16T245DLG4

Texas Instruments

SN74LVC16T245DLG4 by Texas Instruments

SN74LVC16T245DLG4 by Texas Instruments is a bus driver & transceiver with 2 functions, 8 bits, and 3-state output characteristics. It operates at a nominal voltage of 1.8V with a propagation delay of 23.8ns, suitable for bidirectional communication in industrial applications requiring translation b/w 1.8V and 5V systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,843 parts In-Stock

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Digiode

USA . 4,738 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 396 parts In-Stock

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$5.279

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396

$5.279

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Andel Nordic

Denmark . 381 parts In-Stock

1+ parts

$7.053

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-

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$6.771

10k+ parts

$6.771

381

$7.053

-

$6.771

$6.771

Parana Technologies

USA . 441 parts In-Stock

1+ parts

$16.044

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-

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$16.380

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441

$16.044

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$16.380

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Corohmni

South Africa . 58 parts In-Stock

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$17.106

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58

$17.106

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DigiPath Technology Company

USA . 2,211 parts In-Stock

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$17.666

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$17.666

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ChromeModa Solutions

Germany . 1,328 parts In-Stock

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$18.027

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$14.782

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$18.027

$14.782

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IDEA Electronic Components Group

UK . 73 parts In-Stock

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$18.027

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$17.126

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$16.224

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73

$18.027

$17.126

$16.224

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Advanced Electronics

New Zealand . 769 parts In-Stock

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$30.788

100+ parts

$30.480

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$29.248

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769

$30.788

$30.480

$29.248

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Ampacity Inc.

Singapore . 1,051 parts In-Stock

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$37.000

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1,051

$37.000

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Semicontronic

India . 830 parts In-Stock

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$41.000

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$39.975

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$39.770

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830

$41.000

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One Stop Electronics

USA . 565 parts In-Stock

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$44.000

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Continental Prestige Electronics

USA . 6,081 parts In-Stock

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Corphita

USA . 3,936 parts In-Stock

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Argo Parts USA

USA . 3,661 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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$21.531

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$21.531

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$21.531

300

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$21.531

$21.531

$21.531

Bastille Electronics

Australia . 58 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVC16T245DLG4 by Texas Instruments, a high-quality bus driver and transceiver that combines reliability with performance. Manufactured by the reputable Texas Instruments, this versatile component offers seamless translation between different voltage levels, making it ideal for a wide range of applications. With its compact package and efficient design, this product provides exceptional value and benefits to customers looking for a reliable solution for their circuitry needs. Elevate your projects with the SN74LVC16T245DLG4 and experience superior quality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material makes the product durable and resistant to external factors, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 23.8 ns

Low propagation delay at nominal supply ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single device increases functionality and versatility, making it a cost-effective solution.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor for easy integration into existing designs and systems.

No. of Bits: 8

8-bit resolution allows for precise and accurate data transmission, suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage of 1.8V allows for efficient power consumption and compatibility with low-power systems.

Load Capacitance (CL): 15 pF

Optimal load capacitance ensures stability and reliability in signal transmission, especially in high-frequency operations.

Power Supplies (V): 1.8/5

Support for dual power supplies (1.8V and 5V) offers flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 48

Ample number of terminals provide connectivity options and allow for easy integration with other components in the system.

Technical Specifications

Bus Driver & Transceivers SN74LVC16T245DLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER SUPPLY FOR PORT A AND PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

23.8 ns

Propagation Delay (tpd):

23.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/5V&1.8/5V

Width:

7.49 mm

Trade Compliance

SN74LVC16T245DLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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