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NLVVHC1GT126DT1G

Onsemi

NLVVHC1GT126DT1G by Onsemi

NLVVHC1GT126DT1G by Onsemi is a 3-STATE bus driver with 5 terminals, operating at -55 to 125 °C. It has a load capacitance of 50 pF and max I (ol) of 8 Amp, suitable for military-grade applications requiring true output polarity control.

Median Price

$0.170

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 12,000 parts In-Stock

1+ parts

$0.247

100+ parts

$0.170

1k+ parts

$0.130

10k+ parts

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12,000

$0.247

$0.170

$0.130

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Chip1Stop

Japan . 57,000 parts In-Stock

1+ parts

-

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$0.142

57,000

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$0.142

Verical

USA . 12,000 parts In-Stock

1+ parts

-

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$0.170

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$0.130

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12,000

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$0.170

$0.130

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Distributors (In-Stock)

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Vyrian

USA . 4,620 parts In-Stock

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4,620

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Cyclops Electronics Ltd

UK . 2,904 parts In-Stock

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Digiode

USA . 2,010 parts In-Stock

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2,010

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Bristol Electronics

USA . 1,791 parts In-Stock

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-

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$0.338

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$0.135

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1,791

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$0.338

$0.135

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Microfarads

USA . 1,247 parts In-Stock

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1,247

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Distributors (Availability)

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Corohmni

South Africa . 322 parts In-Stock

1+ parts

$0.142

100+ parts

-

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322

$0.142

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Vigor

Singapore . 513 parts In-Stock

1+ parts

$0.180

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513

$0.180

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AZTECH Wire

Italy . 139 parts In-Stock

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$16.050

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139

$16.050

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Kepictronics

USA . 38,527 parts In-Stock

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Perfect Parts

USA . 22,361 parts In-Stock

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22,361

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TANS Electronics

Latvia . 6,725 parts In-Stock

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6,725

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Kulean Microsystems

USA . 5,124 parts In-Stock

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SupplyDigital Components

Austria . 4,532 parts In-Stock

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Problanco Electronics

Mexico . 3,818 parts In-Stock

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Formix International (Excess)

India . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 2,705 parts In-Stock

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2,705

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Authorized Procurement Solutions

USA . 2,605 parts In-Stock

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2,605

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iodParts Technologies Inc.

India . 1,127 parts In-Stock

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UHIMA Technologies

Türkiye . 842 parts In-Stock

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842

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Microchip USA

USA . 747 parts In-Stock

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747

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Corphita

USA . 212 parts In-Stock

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Overview

Discover the NLVVHC1GT126DT1G by Onsemi, a top-of-the-line Bus Driver & Transceiver that promises unparalleled quality and reliability. With a robust construction and AEC-Q100 screening level, this product is designed to excel in demanding environments. Ideal for a wide range of applications, this versatile component offers customers a cost-effective solution with its high performance and low power consumption. Trust Onsemi's reputation for innovation and excellence, and unlock the potential of your projects with the NLVVHC1GT126DT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for use in automotive applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and space.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this product energy efficient and compatible with a wide range of systems.

Propagation Delay (tpd): 16 ns

With a fast propagation delay of 16 ns, this bus driver ensures quick and reliable data transmission.

Temperature Grade: MILITARY

Being military-grade ensures high reliability and performance in harsh environmental conditions.

Maximum Power Supply Current (ICC): 50 mA

With a low power supply current of 50 mA, this product is energy efficient and helps in minimizing power consumption.

Technical Specifications

Bus Driver & Transceivers NLVVHC1GT126DT1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NLVVHC1GT126DT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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