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NLVVHC1GT126DF2G

Onsemi

NLVVHC1GT126DF2G by Onsemi

NLVVHC1GT126DF2G by Onsemi is a 3.3/5V bus driver with 16ns propagation delay and 8A max I (ol). Ideal for military applications, it operates in temperatures ranging from -55 to 125 °C and features a small outline package style.

Median Price

$0.039

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 27,000 parts In-Stock

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Arrow

USA . 6,000 parts In-Stock

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Verical

USA . 6,000 parts In-Stock

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Rochester

USA . 3,000 parts In-Stock

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$0.044

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$0.037

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$0.033

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$0.044

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$0.033

Mouser Electronics

USA . 477 parts In-Stock

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Chip Stock

USA . 87,499 parts In-Stock

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Flip Electronics

USA . 9,000 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 5,995 parts In-Stock

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Bristol Electronics

USA . 5,197 parts In-Stock

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$0.113

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$0.068

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$0.045

5,197

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$0.068

$0.045

IBS Electronics

USA . 3,000 parts In-Stock

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$0.049

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Digiode

USA . 1,219 parts In-Stock

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Microfarads

USA . 1,117 parts In-Stock

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Contempo Components LLC

USA . 109 parts In-Stock

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Corohmni

South Africa . 144 parts In-Stock

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$0.033

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$13.314

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$12.116

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$10.917

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100

$13.314

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$10.917

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RC Electronics

USA . 86,082 parts In-Stock

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Futuretech Components

Singapore . 29,980 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,797 parts In-Stock

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Lixinc

USA . 11,677 parts In-Stock

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Authorized Procurement Solutions

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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TANS Electronics

Latvia . 3,496 parts In-Stock

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Problanco Electronics

Mexico . 3,380 parts In-Stock

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Kepictronics

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Formix International (Excess)

India . 3,000 parts In-Stock

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Corphita

USA . 2,353 parts In-Stock

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Kulean Microsystems

USA . 2,233 parts In-Stock

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Continental Prestige Electronics

USA . 1,345 parts In-Stock

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Computer Components Inc. - USA

USA . 698 parts In-Stock

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UHIMA Technologies

Türkiye . 565 parts In-Stock

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SupplyDigital Components

Austria . 495 parts In-Stock

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495

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Vigor

Singapore . 484 parts In-Stock

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Overview

Enhance your electronic designs with the NLVVHC1GT126DF2G by Onsemi, a top-of-the-line bus driver & transceiver that guarantees high-quality performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers unparalleled value and benefits to customers. Ideal for a wide range of applications, this component boasts a sleek design and advanced technology. Elevate your projects with the NLVVHC1GT126DF2G and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for rugged environments and reduces the overall weight of the device.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and providing a more efficient design.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes the device energy-efficient and compatible with low-power applications.

Maximum I (ol): 8 Amp

High output current capability of 8A allows the device to drive heavy loads without compromising performance.

Propagation Delay (tpd): 16 ns

Low propagation delay of 16ns ensures fast data transmission and reduces latency in communication.

Temperature Grade: MILITARY

Military-grade temperature specifications make the product suitable for harsh environments and ensure reliable operation under extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, contributing to the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers NLVVHC1GT126DF2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLVVHC1GT126DF2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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