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SN74HC245PWRE4

Texas Instruments

SN74HC245PWRE4 by Texas Instruments

SN74HC245PWRE4 by Texas Instruments is a CMOS bus driver & transceiver with 8 bits. It has a propagation delay of 22 ns and operates at a nominal voltage of 6V. This IC is commonly used for bidirectional data transfer in industrial applications.

Median Price

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4

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1k+

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Chip Stock

USA . 73,440 parts In-Stock

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Digiode

USA . 4,061 parts In-Stock

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Vyrian

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Nova Conductors

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Andel Nordic

Denmark . 4,711 parts In-Stock

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$3.646

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$3.500

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One Stop Electronics

USA . 443 parts In-Stock

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$6.000

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Parana Technologies

USA . 867 parts In-Stock

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DigiPath Technology Company

USA . 1,261 parts In-Stock

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$8.807

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ChromeModa Solutions

Germany . 1,719 parts In-Stock

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$8.987

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$7.369

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IDEA Electronic Components Group

UK . 66 parts In-Stock

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$8.538

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$8.088

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Corohmni

South Africa . 205 parts In-Stock

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Advanced Electronics

New Zealand . 77 parts In-Stock

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AZTECH Wire

Italy . 766 parts In-Stock

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Ampacity Inc.

Singapore . 471 parts In-Stock

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Semicontronic

India . 1,063 parts In-Stock

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Continental Prestige Electronics

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Microchip USA

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Argo Parts USA

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Corphita

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Bastille Electronics

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Overview

Looking for a high-quality bus driver and transceiver? Look no further than the SN74HC245PWRE4 by Texas Instruments. Known for their exceptional manufacturing standards and reliability, Texas Instruments offers a wide range of applications in this category. With its compact design and advanced features, the SN74HC245PWRE4 delivers unmatched value and benefits to customers. Whether you need to drive or receive signals between different parts of your circuit, this product ensures efficient and accurate data transfer. Experience seamless connectivity and enhanced performance with the SN74HC245PWRE4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made of durable plastic/epoxy material, providing resistance to damage and ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 22 ns

With a low propagation delay, this product guarantees fast and efficient communication between bus drivers and transceivers, resulting in reliable data transmission.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into various electronic systems, increasing versatility and saving valuable board space.

No. of Functions: 1

This product combines multiple functions into a single device, streamlining the design and simplifying circuitry, reducing complexity and cost.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard board layouts, facilitating easy and convenient PCB assembly.

No. of Bits: 8

With 8 bits, this bus driver and transceiver product enables high-resolution data transmission, making it ideal for applications requiring precise and accurate signal control.

Translation: N/A

The absence of translation capability in this product ensures straightforward data transfer between bus systems without any conversions, ensuring reliability and efficiency.

Nominal Supply Voltage / Vsup (V): 6

The 6V nominal supply voltage allows this product to operate optimally within a wide range of systems, enhancing compatibility and flexibility.

Power Supplies (V): 2/6

With support for both 2V and 6V power supplies, this product accommodates different voltage requirements, enabling seamless integration into diverse electronic setups.

No. of Terminals: 20

Featuring 20 terminals, this bus driver and transceiver product provides sufficient connectivity options for seamless data exchange and control in complex systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this product suitable for space-constrained applications, allowing for compact and efficient system designs.

Maximum I (ol): 7.8 Amp

With a maximum output current of 7.8 Amp, this product can handle high power loads, ensuring reliable and robust operation even in demanding situations.

Propagation Delay (tpd): 170 ns

The propagation delay of 170 ns ensures minimal lag in data transmission, contributing to efficient communication and real-time control capabilities.

Maximum Operating Temperature: 85 °C

Designed to withstand temperatures up to 85°C, this product excels in harsh operating conditions, ensuring reliable performance in demanding environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide enhanced flexibility by allowing the bus driver and transceiver to disconnect from the bus, minimizing power consumption and enabling efficient multi-point communication.

Minimum Operating Temperature: -40 °C

Capable of operating in temperatures as low as -40°C, this product is well-suited for use in extreme cold environments, providing reliable functionality in challenging conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances the product's resistance to corrosion, ensuring long-term reliability and maintaining excellent electrical connectivity.

Terminal Position: DUAL

With dual terminal positions, this product offers versatile installation options, allowing for easy integration into various circuit board designs and enabling efficient system configurations.

No. of Ports: 2

Featuring two ports, this bus driver and transceiver product provides connectivity to multiple devices or systems simultaneously, enabling efficient data exchange and control.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this product offers a compact profile, contributing to space-saving designs and reducing overall system dimensions.

Width: 4.4 mm

The 4.4 mm width of this product ensures compatibility with standard board layouts, facilitating easy integration and enabling efficient usage of available space.

Output Polarity: TRUE

The true output polarity of this product ensures compatibility with other components and systems, allowing for seamless integration and reliable signal transmission.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, this product provides flexibility for low-power applications, enabling efficient operation even in energy-constrained systems.

Maximum Time At Peak Reflow Temperature (s): 30

Designed to withstand peak reflow temperatures for up to 30 seconds, this product ensures reliable solder joint integrity during the assembly process, guaranteeing long-lasting performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can endure high-temperature assembly processes, ensuring proper soldering and maintaining operational integrity.

Length: 6.5 mm

The 6.5 mm length of this product allows for easy integration into various board designs, maximizing flexibility in system layouts and ensuring efficient use of available space.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature range, this product operates reliably in demanding environments with wide temperature variations, suitable for rugged applications.

Technology: CMOS

Utilizing CMOS technology, this bus driver and transceiver product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an excellent choice for modern applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connections and excellent mechanical strength, ensuring reliable electrical contact and facilitating easy soldering during assembly.

Packing Method: TR

Packaged in tape and reel format, this product simplifies handling and storage during manufacturing, promoting efficient assembly processes and reducing production time.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product allows for precise placement and easy soldering, ensuring accurate connection and mechanical stability during assembly.

Count Direction: BIDIRECTIONAL

The bidirectional count direction capability of this product allows for seamless data exchange in both forward and reverse directions, delivering efficient communication and versatility.

Control Type: COMMON CONTROL

Featuring a common control mechanism, this bus driver and transceiver product enables centralized management and control of multiple connected devices, simplifying system operation and facilitating convenient data manipulation.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product is highly resistant to moisture-induced damage, ensuring reliability and longevity in humid environments.

Maximum Supply Voltage (Vsup): 6 V

Built to operate with a maximum supply voltage of 6V, this product delivers robust performance, accommodating high-voltage power sources and providing compatibility with a wide range of systems.

Maximum Power Supply Current (ICC): 0.08 mA

With a maximum power supply current of 0.08 mA, this product exhibits low power consumption, contributing to energy-efficient system designs and prolonging battery life.

Technical Specifications

Bus Driver & Transceivers SN74HC245PWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

170 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

6

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74HC245PWRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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