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SN74LVC1G240DBVR

Texas Instruments

SN74LVC1G240DBVR by Texas Instruments

SN74LVC1G240DBVR by Texas Instruments is a CMOS bus driver with 4.5 ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and has a max operating temperature of 125°C. With a small outline package style, it features dual terminal position and inverted output polarity for efficient signal transmission in tight spaces.

Median Price

$0.194

Lifecycle Status

Suppliers In-Stock

39

In-Stock Inventory

1k+

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Texas Instruments

USA . 208,818 parts In-Stock

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Arrow

USA . 1,404 parts In-Stock

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DigiKey

USA . 40,017 parts In-Stock

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Mouser Electronics

USA . 836 parts In-Stock

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Newark

USA . 2,585 parts In-Stock

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RS (Exports)

UK . 6,300 parts In-Stock

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Rochester

USA . 4,774 parts In-Stock

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Chip1Stop

Japan . 2,430 parts In-Stock

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Farnell

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Verical

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DF Sales Co.

USA . 1,440 parts In-Stock

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DF Sales Co.

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Digiode

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Greenchips

USA . 4,918 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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TME

Poland . 340 parts In-Stock

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Maritex

Poland . 1,446 parts In-Stock

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Chip Stock

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Vyrian

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Connector Distribution Corp

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Cyclops Electronics Ltd

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Prism Electronics

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Semicontronic

India . 27,997 parts In-Stock

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Ampacity Inc.

Singapore . 27,799 parts In-Stock

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Corphita

USA . 3,494 parts In-Stock

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Corohmni

South Africa . 103 parts In-Stock

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Continental Prestige Electronics

USA . 5,833 parts In-Stock

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Argo Parts USA

USA . 2,243 parts In-Stock

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Microchip USA

USA . 5,171 parts In-Stock

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Parana Technologies

USA . 365 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$15.703

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DigiPath Technology Company

USA . 2,149 parts In-Stock

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ChromeModa Solutions

Germany . 6,850 parts In-Stock

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IDEA Electronic Components Group

UK . 1,132 parts In-Stock

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Andel Nordic

Denmark . 3,657 parts In-Stock

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Lixinc

USA . 17,900 parts In-Stock

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Alle Elektronik GmbH

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Netroflash

USA . 50 parts In-Stock

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Kepictronics

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Overview

Unlock seamless communication and data transmission with the Texas Instruments SN74LVC1G240DBVR, a top-of-the-line Bus Driver & Transceiver designed to elevate your electronic projects. With a reputation for unparalleled quality and innovation, Texas Instruments ensures that this product delivers on reliability and performance. Whether you're working on automotive applications or industrial systems, this compact and efficient component offers a range of benefits, from fast propagation delay to low power consumption. Elevate your designs with the SN74LVC1G240DBVR and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver, ensuring a longer lifespan and reliable performance.

Propagation Delay At Nominal Supply: 4.5 ns

The low propagation delay ensures fast signal transmission, making this bus driver efficient for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto a circuit board, saving time and effort in production.

Nominal Supply Voltage / Vsup (V): 1.8

The low supply voltage requirement contributes to energy efficiency and can be suitable for battery-powered applications.

Output Characteristics: 3-STATE

The 3-state output allows for flexible control over the output signal, making it versatile for various system configurations.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G240DBVR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G240DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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