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74HC1G125GW,118

NXP Semiconductors

74HC1G125GW,118 by NXP Semiconductors

NXP Semiconductors' 74HC1G125GW,118 is a CMOS bus driver with 150 ns propagation delay. It operates b/w -40 to 125 °C and supports a supply voltage range of 2-6 V. Ideal for automotive applications, this IC features a small outline package with dual terminals and true output polarity.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Anansix

USA . 2,859 parts In-Stock

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Vyrian

USA . 1,965 parts In-Stock

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Digiode

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Nova Conductors

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France . 46 parts In-Stock

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Ampacity Inc.

Singapore . 869 parts In-Stock

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$5.000

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Andel Nordic

Denmark . 490 parts In-Stock

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$4.852

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$4.852

AZTECH Wire

Italy . 5,307 parts In-Stock

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Corohmni

South Africa . 1,051 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Aztec Data Supply Inc.

USA . 25,960 parts In-Stock

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$33.320

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One Stop Electronics

USA . 685 parts In-Stock

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Semicontronic

India . 1,231 parts In-Stock

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UNI Independent Distributors

Spain . 7,220 parts In-Stock

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Corphita

USA . 1,909 parts In-Stock

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Supply Digital

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Overview

Unlock the power of seamless data transmission with the 74HC1G125GW,118 by NXP Semiconductors. This high-quality bus driver and transceiver offers reliable performance and versatility for a wide range of applications. With a small outline, thin profile package design and true output polarity, this product is ideal for automotive use, ensuring optimal functionality even in extreme temperatures. Experience the value and benefits of NXP Semiconductors' cutting-edge technology with the 74HC1G125GW,118, delivering efficient propagation delay and 3-state output characteristics. Elevate your projects with this top-of-the-line component that guarantees superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and resources during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with many common power sources and systems.

Propagation Delay (tpd): 150 ns

Low propagation delay of 150ns ensures fast and efficient signal transmission, improving overall performance of the bus driver & transceiver.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures of up to 125°C, making it ideal for automotive applications and other demanding environments.

Technology: CMOS

Utilizes CMOS technology, known for its low power consumption and reliable operation, ensuring energy efficiency and longevity of the product.

Technical Specifications

Bus Driver & Transceivers 74HC1G125GW,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

150 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74HC1G125GW,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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