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SN74HCT245DWG4

Texas Instruments

SN74HCT245DWG4 by Texas Instruments

SN74HCT245DWG4 by Texas Instruments is an 8-bit bus driver with 28ns propagation delay at 5V. It features a small outline package, operates in industrial temperature range (-40 to 85°C), and has dual terminal position. Commonly used for bidirectional data transmission in various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,085 parts In-Stock

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Digiode

USA . 1,316 parts In-Stock

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Nova Conductors

Japan . 62 parts In-Stock

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62

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Distributors (Availability)

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AZTECH Wire

Italy . 522 parts In-Stock

1+ parts

$14.050

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522

$14.050

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Ampacity Inc.

Singapore . 360 parts In-Stock

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$18.000

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360

$18.000

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Corohmni

South Africa . 980 parts In-Stock

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$21.767

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$21.767

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One Stop Electronics

USA . 701 parts In-Stock

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$23.000

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701

$23.000

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Parana Technologies

USA . 740 parts In-Stock

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$26.463

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$27.047

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740

$26.463

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$27.047

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$27.376

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$26.008

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$26.008

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1,000

$27.376

$26.008

$26.008

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DigiPath Technology Company

USA . 1,956 parts In-Stock

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$29.139

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$26.808

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$29.139

$26.808

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ChromeModa Solutions

Germany . 6,217 parts In-Stock

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$29.734

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$24.382

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$29.734

$24.382

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IDEA Electronic Components Group

UK . 1,511 parts In-Stock

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$29.734

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$28.247

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$26.761

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1,511

$29.734

$28.247

$26.761

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Semicontronic

India . 1,467 parts In-Stock

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$48.000

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$46.800

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$46.560

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$48.000

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$46.560

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Argo Parts USA

USA . 4,169 parts In-Stock

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Corphita

USA . 3,881 parts In-Stock

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Continental Prestige Electronics

USA . 3,367 parts In-Stock

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Bastille Electronics

Australia . 650 parts In-Stock

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650

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Overview

Enhance your electronic designs with the high-quality SN74HCT245DWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and efficient bus drivers & transceivers that cater to a wide range of applications. This versatile component offers customers exceptional value, benefits, and advantages, making it the ideal choice for ensuring seamless data transmission in your projects. Upgrade your systems with the SN74HCT245DWG4 and experience top-notch performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 28 ns

Fast propagation delay ensures quick signal transmission and response time, essential for efficient communication in a bus system.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, making installation and maintenance convenient.

No. of Bits: 8

Sufficient number of bits for data transmission and processing in bus applications.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage ensures reliable operation of the bus driver & transceivers.

Power Supplies (V): 5

Optimal power supply voltage for efficient performance of the device.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for various environmental conditions in bus systems.

Width: 7.5 mm

Compact size allows for space-efficient integration into bus system designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for reliable operation in bus applications.

Maximum Supply Voltage (Vsup): 5.5 V

Slight voltage margin above nominal supply voltage ensures safe operation and prevents damage to the device.

Technical Specifications

Bus Driver & Transceivers SN74HCT245DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74HCT245DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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