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SN74AHC1G125DCKR

Texas Instruments

SN74AHC1G125DCKR by Texas Instruments

SN74AHC1G125DCKR by Texas Instruments is a 3-STATE bus driver with 14ns propagation delay at 3.3V, suitable for automotive applications. It features a small outline package with dual terminals and operates in the temperature range of -40 to 125°C. With a max supply voltage of 5.5V and peak reflow temperature of 260°C, it offers reliable performance in various electronic systems.

Median Price

$0.072

Lifecycle Status

Suppliers In-Stock

46

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,347,480 parts In-Stock

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Mouser Electronics

USA . 43,758 parts In-Stock

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$0.120

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$0.061

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$0.044

43,758

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$0.061

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$0.044

DigiKey

USA . 32,341 parts In-Stock

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$0.120

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$0.060

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32,341

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Newark

USA . 2,780 parts In-Stock

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Arrow

USA . 42,000 parts In-Stock

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Chip1Stop

Japan . 4,229 parts In-Stock

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Element14

Singapore . 2,615 parts In-Stock

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Rochester

USA . 436 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 4,797 parts In-Stock

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Maritex

Poland . 47,490 parts In-Stock

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47,490

$0.087

$0.043

$0.039

$0.034

TME

Poland . 1,282 parts In-Stock

1+ parts

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1,282

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$0.080

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$0.042

Voyager Components

USA . 500 parts In-Stock

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$0.100

Nova Conductors

Japan . 27 parts In-Stock

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Vyrian

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Bristol Electronics

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Inventory MP

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India . 901,195 parts In-Stock

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Ampacity Inc.

Singapore . 772,503 parts In-Stock

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Argo Parts USA

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Corohmni

South Africa . 1,136 parts In-Stock

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Netroflash

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Denmark . 1,987 parts In-Stock

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Parana Technologies

USA . 44 parts In-Stock

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$16.667

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$1,547.787

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$15.000

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DigiPath Technology Company

USA . 2,108 parts In-Stock

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$18.352

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Germany . 3,282 parts In-Stock

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IDEA Electronic Components Group

UK . 1,635 parts In-Stock

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$18.727

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$17.791

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$16.854

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$18.734

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$17.048

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Perfect Parts

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Continental Prestige Electronics

USA . 760 parts In-Stock

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Overview

Enhance your electronic designs with the SN74AHC1G125DCKR by Texas Instruments, a high-quality bus driver and transceiver that offers unparalleled reliability and performance. Manufactured by industry-leading Texas Instruments, this compact and versatile component is perfect for a wide range of applications. With fast propagation delays and 3-state output characteristics, this product ensures efficient data transmission while maintaining low power consumption. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the SN74AHC1G125DCKR and experience the difference today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Durable material suitable for various environments.

Propagation Delay At Nominal Supply

14 ns - Fast response time for efficient data transmission.

Surface Mount

YES - Easy installation on circuit boards.

Package Shape

RECTANGULAR - Compact design for space-saving applications.

Nominal Supply Voltage/Vsup (V)

3.3 - Compatible with common supply voltages.

Load Capacitance (CL)

50 pF - Ensures stable operation with connected devices.

Power Supplies (V)

2/5.5 - Wide range of compatible power supplies for flexibility.

No. of Terminals

5 - Simple connectivity and integration into systems.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Ideal for compact designs with limited space.

Maximum I (ol)

8 Amp - Capable of driving high-power loads.

Propagation Delay (tpd)

13 ns - Minimal delay for quick data transmission.

Maximum Operating Temperature

125 °C - Suitable for use in high-temperature environments.

Output Characteristics

3-STATE - Offers versatile output options for different applications.

Minimum Operating Temperature

40 °C - Can operate in extreme cold conditions.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Corrosion-resistant finish for long-lasting performance.

Terminal Position

DUAL - Ease of connection and stable signal transmission.

No. of Ports

2 - Versatile connectivity options for multiple devices.

Maximum Seated Height

1.1 mm - Low profile design for compact installations.

Width

1.25 mm - Slim form factor for space-efficient applications.

Output Polarity

TRUE - Accurate signal transmission without distortion.

Minimum Supply Voltage (Vsup)

2 V - Can operate with low power input.

Peak Reflow Temperature °C

260 - Can withstand high-temperature soldering processes.

Length

2 mm - Compact size for tight spaces.

Temperature Grade

AUTOMOTIVE - Suitable for automotive applications with varying temperature conditions.

Technology

CMOS - Efficient and low-power consumption technology.

Terminal Form

GULL WING - Easy to solder and durable terminal design.

Packing Method

TR - Convenient packaging for storage and transport.

Terminal Pitch

0.65 mm - Fine pitch for precise connections.

Count Direction

UNIDIRECTIONAL - Simple data flow direction for clear communication.

Control Type

ENABLE LOW - Easy to control and integrate into systems.

Maximum Supply Voltage (Vsup)

5.5 V - Compatible with higher voltage systems.

Maximum Power Supply Current (ICC)

0.01 mA - Low power consumption for energy-efficient operation.

Technical Specifications

Bus Driver & Transceivers SN74AHC1G125DCKR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74AHC1G125DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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