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SN74ABT245BDWR

Texas Instruments

SN74ABT245BDWR by Texas Instruments

SN74ABT245BDWR by Texas Instruments is a bus driver & transceiver with 8 bits and a propagation delay of 3.9 ns. It operates at a nominal voltage of 5V and has a small outline package style. This IC is commonly used in bidirectional control applications requiring fast data transmission.

Median Price

$0.670

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Mouser Electronics

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DigiKey

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Chip1Stop

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Verical

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Greenchips

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Digiode

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Nova Conductors

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ECAB

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Inland Empire Components Inc.

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Semicontronic

India . 4,141 parts In-Stock

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Continental Prestige Electronics

USA . 6,291 parts In-Stock

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Argo Parts USA

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Corphita

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Ampacity Inc.

Singapore . 4,263 parts In-Stock

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Microchip USA

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Andel Nordic

Denmark . 3,046 parts In-Stock

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Corohmni

South Africa . 658 parts In-Stock

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Parana Technologies

USA . 1,477 parts In-Stock

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DigiPath Technology Company

USA . 1,712 parts In-Stock

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IDEA Electronic Components Group

UK . 1,749 parts In-Stock

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$29.869

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$28.376

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$26.882

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ChromeModa Solutions

Germany . 226 parts In-Stock

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$24.493

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Perfect Parts

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Lixinc

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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A-Plus Industry Inc.

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Speed Components Ltd (Excess)

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Overview

Looking for a reliable and high-quality Bus Driver & Transceiver? Look no further than the SN74ABT245BDWR by Texas Instruments. With its advanced BICMOS technology and durable plastic/epoxy package, this product offers unmatched performance and reliability. Whether you need to drive or receive signals, this versatile device with 8 bits capability has got you covered. Its true output polarity and 3-STATE output characteristics ensure clear and accurate data transmission. Plus, with a wide operating temperature range and small outline package, it's perfect for industrial applications. Trust Texas Instruments for all your bus driver needs and experience the value and benefits of this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection for the internal components, making it a reliable choice for long-term use in challenging environments.

Propagation Delay At Nominal Supply: 3.9 ns

With a low propagation delay of 3.9 ns, this bus driver & transceiver provides fast signal transmission, reducing latency and improving overall system performance.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into electronic circuits, making it convenient for manufacturers and reducing assembly time.

No. of Functions: 1

Featuring a single function, this bus driver & transceiver simplifies circuit design, reducing complexity and eliminating the need for multiple components.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient space utilization, making it ideal for applications where board space is limited.

No. of Bits: 8

With 8 bits, this bus driver & transceiver can handle a higher data capacity, making it suitable for use in communication systems or data-intensive applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, providing ease of integration and versatility.

Load Capacitance (CL): 50 pF

The specified load capacitance of 50 pF allows for reliable signal transmission, maintaining signal integrity over longer distances.

Power Supplies (V): 5

Supporting power supplies of 5V ensures compatibility with common voltage sources, facilitating easy integration into existing systems.

No. of Terminals: 20

With 20 terminals, this bus driver & transceiver offers ample connection options, enabling versatile connectivity and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it suitable for space-constrained applications, providing a compact yet efficient solution.

Maximum I (ol): 64 Amp

Boasting a maximum output current of 64 Amp, this bus driver & transceiver can handle high current loads, making it suitable for power-hungry applications.

Propagation Delay (tpd): 3.9 ns

The low propagation delay of 3.9 ns ensures fast and reliable signal transmission, making it ideal for high-speed communication systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand elevated temperature environments, ensuring reliable operation even in harsh conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide greater flexibility and control over the output signals, allowing for efficient bus sharing and multiplexing.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this bus driver & transceiver can perform reliably even in extremely cold environments, expanding its range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish provides excellent corrosion resistance and ensures reliable electrical connections, enhancing the durability and longevity of the product.

Terminal Position: DUAL

Having a dual terminal position allows for flexible mounting options, enabling both top and bottom side connections, catering to various circuit board layouts and requirements.

No. of Ports: 2

Featuring two ports, this bus driver & transceiver supports bidirectional communication and provides additional connectivity options, enhancing system versatility.

Maximum Seated Height: 2.65 mm

With a low maximum seated height of 2.65 mm, this product is compact and suitable for applications with height restrictions or limited space availability.

Width: 7.5 mm

Measuring 7.5 mm in width, this bus driver & transceiver offers a space-efficient solution, ideal for compact system designs where space is a premium.

Output Polarity: TRUE

The true output polarity ensures correct signal representation, minimizing signal manipulation and maximizing data integrity, making it an excellent choice for precise data transmission.

Minimum Supply Voltage (Vsup): 4.5 V

Supporting a minimum supply voltage of 4.5V ensures compatibility with lower voltage systems, providing flexibility in various power supply configurations.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, simplifying manufacturing processes and ensuring proper solder joints.

Length: 12.8 mm

With a length of 12.8 mm, this bus driver & transceiver offers a compact form factor, allowing for space-efficient installation and integration into electronic circuits.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product operates reliably in challenging environments, making it suitable for demanding industrial automation or control systems.

Technology: BICMOS

Utilizing BiCMOS technology, this bus driver & transceiver combines the advantages of bipolar and CMOS technologies, offering high-speed operation, low power consumption, and improved noise immunity.

Terminal Form: GULL WING

The gull wing terminal form facilitates smooth surface mount soldering, ensuring reliable and robust connections, enhancing overall product reliability.

Packing Method: TR

The Tape and Reel (TR) packing method simplifies the manufacturing process by enabling efficient automated pick-and-place assembly, reducing production time and costs.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product provides compatibility with standard PCB layouts and enables easy integration into existing circuits.

Count Direction: BIDIRECTIONAL

Supporting bidirectional operation, this bus driver & transceiver allows for efficient data transmission in both directions, enhancing communication flexibility and system performance.

Control Type: COMMON CONTROL

Featuring a common control interface, this bus driver & transceiver simplifies system integration and control, providing a standardized and streamlined approach.

Moisture Sensitivity Level (MSL): 1

With an MSL level of 1, this product is moisture resistant and suitable for various environments, ensuring long-term reliability and performance.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of handling a maximum supply voltage of 5.5V, this bus driver & transceiver offers a wide operating voltage range, enhancing compatibility with different power supply configurations.

Maximum Power Supply Current (ICC): 30 mA

With a maximum power supply current of 30 mA, this product operates with low power consumption, making it energy-efficient and suitable for battery-powered applications.

Technical Specifications

Bus Driver & Transceivers SN74ABT245BDWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ABT245BDWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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