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74LVC4245APW

NXP Semiconductors

74LVC4245APW by NXP Semiconductors

NXP Semiconductors' 74LVC4245APW is an 8-bit bus driver with a propagation delay of 6.5 ns at 5V, suitable for automotive applications. It features a small outline package with dual terminals and operates b/w -40 to 125°C, making it ideal for bidirectional control in various electronic systems.

Median Price

$0.925

Lifecycle Status

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28

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Verical

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DF Sales Co.

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Component Sense

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Andel Nordic

Denmark . 1,164 parts In-Stock

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Advanced Electronics

New Zealand . 40 parts In-Stock

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AZTECH Wire

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Overview

Unlock seamless communication with the 74LVC4245APW by NXP Semiconductors. This high-quality bus driver & transceiver offers reliable performance and versatility for a wide range of applications. With a compact design and advanced technology, this product ensures efficient data transmission while providing ease of use. Elevate your projects with the value and benefits that only NXP Semiconductors can deliver. Experience enhanced connectivity and reliability with the 74LVC4245APW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for use in automotive applications where ruggedness is important.

Propagation Delay At Nominal Supply: 6.5 ns

Low propagation delay ensures quick signal transmission, making this product suitable for high-speed data communication in bus systems.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, ensuring compatibility with common power sources and reducing the need for additional voltage regulators.

Maximum I (ol): 24 Amp

High output current capability allows the driver to handle heavy loads, making it suitable for driving multiple bus lines or high-power transceivers.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, ensuring reliable operation in vehicles where temperature fluctuations are common.

Technical Specifications

Bus Driver & Transceivers 74LVC4245APW attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

PORT B OPERATING AT 1.5 TO 3.6 VOLTS

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

74LVC4245APW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-615-7380, 5962016157380

NIIN

016157380

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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