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SN74HCT541DWRE4

Texas Instruments

SN74HCT541DWRE4 by Texas Instruments

SN74HCT541DWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 29 ns at 5V. It features a 3-STATE output and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring fast signal transmission and control over two ports.

Median Price

$1.560

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,000 parts In-Stock

1+ parts

$1.560

100+ parts

$0.604

1k+ parts

$0.412

10k+ parts

$0.281

2,000

$1.560

$0.604

$0.412

$0.281

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$0.268

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.268

-

-

-

Digiode

USA . 3,316 parts In-Stock

1+ parts

$0.560

100+ parts

-

1k+ parts

-

10k+ parts

-

3,316

$0.560

-

-

-

Chip Stock

USA . 97,615 parts In-Stock

1+ parts

-

100+ parts

-

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97,615

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-

-

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Vyrian

USA . 1,593 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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1,593

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,461 parts In-Stock

1+ parts

$0.268

100+ parts

-

1k+ parts

-

10k+ parts

$0.263

5,461

$0.268

-

-

$0.263

Argo Parts USA

USA . 1,716 parts In-Stock

1+ parts

$0.268

100+ parts

-

1k+ parts

-

10k+ parts

$0.260

1,716

$0.268

-

-

$0.260

Corphita

USA . 4,627 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

-

4,627

$0.531

-

-

-

Ampacity Inc.

Singapore . 1,810 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,810

$0.800

-

-

-

Semicontronic

India . 1,552 parts In-Stock

1+ parts

$0.800

100+ parts

$0.780

1k+ parts

$0.776

10k+ parts

-

1,552

$0.800

$0.780

$0.776

-

Andel Nordic

Denmark . 2,122 parts In-Stock

1+ parts

$8.277

100+ parts

-

1k+ parts

$7.946

10k+ parts

$7.946

2,122

$8.277

-

$7.946

$7.946

Parana Technologies

USA . 1,974 parts In-Stock

1+ parts

$17.895

100+ parts

-

1k+ parts

$18.065

10k+ parts

-

1,974

$17.895

-

$18.065

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DigiPath Technology Company

USA . 2,271 parts In-Stock

1+ parts

$19.705

100+ parts

-

1k+ parts

-

10k+ parts

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2,271

$19.705

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-

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ChromeModa Solutions

Germany . 3,462 parts In-Stock

1+ parts

$20.107

100+ parts

$16.488

1k+ parts

-

10k+ parts

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3,462

$20.107

$16.488

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IDEA Electronic Components Group

UK . 822 parts In-Stock

1+ parts

$20.107

100+ parts

$19.102

1k+ parts

$18.096

10k+ parts

-

822

$20.107

$19.102

$18.096

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Corohmni

South Africa . 323 parts In-Stock

1+ parts

$25.511

100+ parts

-

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323

$25.511

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Microchip USA

USA . 2,376 parts In-Stock

1+ parts

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2,376

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Perfect Parts

USA . 616 parts In-Stock

1+ parts

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616

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Overview

Enhance the efficiency and reliability of your electronic systems with the SN74HCT541DWRE4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers seamless communication between different components, ensuring optimal performance. Whether you're designing a complex circuit or a simple interface, this product guarantees smooth data transmission and minimal signal distortion. Trust in Texas Instruments' legacy of innovation and quality to bring value and peace of mind to your projects. Elevate your designs with the SN74HCT541DWRE4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use in various environments.

Propagation Delay At Nominal Supply: 29 ns

Fast response time ensures efficient communication and data transfer.

Surface Mount: YES

Easy to install and saves space on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Common voltage level for compatibility with existing systems.

Load Capacitance (CL): 150 pF

Optimized for efficient power consumption and signal integrity.

Output Characteristics: 3-STATE

Allows for flexible control of output signals.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with wide temperature ranges.

Technology: CMOS

Low power consumption and noise immunity for reliable performance.

Technical Specifications

Bus Driver & Transceivers SN74HCT541DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74HCT541DWRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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