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SN74LVC126ADR

Texas Instruments

SN74LVC126ADR by Texas Instruments

SN74LVC126ADR by Texas Instruments is a 4-function bus driver with 6ns propagation delay at 1.8V, suitable for automotive applications. It operates at a supply voltage of 3.3V, has a max operating temperature of 125°C, and features a 3-STATE output characteristic. This CMOS technology device comes in a small outline package with dual terminals and is designed for unidirectional control with an enable high feature.

Median Price

$0.250

Lifecycle Status

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27

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1k+

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Arrow

USA . 247 parts In-Stock

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Texas Instruments

USA . 252,600 parts In-Stock

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Mouser Electronics

USA . 11,652 parts In-Stock

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Rochester

USA . 124,471 parts In-Stock

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DigiKey

USA . 124,471 parts In-Stock

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Verical

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Chip1Stop

Japan . 2,465 parts In-Stock

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Digiode

USA . 4,970 parts In-Stock

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Nova Conductors

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Bristol Electronics

USA . 1,995 parts In-Stock

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DigiKey Marketplace

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Vyrian

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Chip Stock

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Cyclops Electronics Ltd

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ComSIT Distribution GmbH

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Velocity Electronics

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ABC Electronics Ltd.

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Sensible Micro Corp

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Semtec, LLC

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Prism Electronics

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Connect4Technologies Inc.

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Goldney Electronics S.L.

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Legend Electronics Inc.

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Semicontronic

India . 81,437 parts In-Stock

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Ampacity Inc.

Singapore . 80,991 parts In-Stock

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Corphita

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Corohmni

South Africa . 390 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,928 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Argo Parts USA

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Parana Technologies

USA . 1,799 parts In-Stock

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DigiPath Technology Company

USA . 985 parts In-Stock

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ChromeModa Solutions

Germany . 3,119 parts In-Stock

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IDEA Electronic Components Group

UK . 2,030 parts In-Stock

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iodParts Technologies Inc.

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Overview

Enhance your electronic designs with the Texas Instruments SN74LVC126ADR bus driver and transceiver. With a reputation for top-quality products, Texas Instruments delivers unmatched reliability and performance. This versatile component is ideal for a wide range of applications, offering fast propagation delays and low power consumption. Experience the value of efficient signal transmission and seamless integration into your projects. Upgrade your systems with the SN74LVC126ADR and unlock a world of possibilities in the realm of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and durability, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast signal transmission, which is essential for efficient communication in bus driver applications.

Surface Mount: YES

Surface mount technology allows for easy and space-saving integration onto circuit boards, making the product suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient and suitable for sensitive electronic components.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling the output signal, allowing for versatile operation in various bus driver applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable performance under harsh environmental conditions, making it ideal for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable for digital communication.

Technical Specifications

Bus Driver & Transceivers SN74LVC126ADR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

11.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LVC126ADR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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