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RHFXH162244K-01V

STMicroelectronics

RHFXH162244K-01V by STMicroelectronics

RHFXH162244K-01V by STMicroelectronics is a 4-bit bus driver with a propagation delay of just 5.2 ns, ideal for high-speed applications. It operates within a supply voltage range of 1.8V to 3.6V and features military-grade screening for reliability in harsh environments. Its compact flatpack design ensures efficient space utilization in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,620 parts In-Stock

1+ parts

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2,620

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Vyrian

USA . 2,164 parts In-Stock

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2,164

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Anansix

USA . 349 parts In-Stock

1+ parts

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349

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 199 parts In-Stock

1+ parts

$6.383

100+ parts

-

1k+ parts

$6.128

10k+ parts

$6.128

199

$6.383

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$6.128

$6.128

IDEA Electronic Components Group

UK . 2,312 parts In-Stock

1+ parts

$25.669

100+ parts

-

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$23.102

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-

2,312

$25.669

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$23.102

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MKK Technologies

India . 2,118 parts In-Stock

1+ parts

$48.269

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2,118

$48.269

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DigiPath Technology Company

USA . 2,118 parts In-Stock

1+ parts

$48.269

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2,118

$48.269

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Corphita

USA . 3,291 parts In-Stock

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3,291

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Parana Technologies

USA . 1,281 parts In-Stock

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$30.691

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1,281

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$30.691

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Overview

Elevate your designs with the RHFXH162244K-01V from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This robust bus driver & transceiver combines exceptional performance with military-grade reliability, ensuring seamless data transmission across various applications, from aerospace to industrial systems. Experience the advantage of rapid propagation delays and superior temperature resilience, making it the ideal choice for demanding environments. Unlock unparalleled value and innovation for your next project!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed materials enhances durability and thermal stability, making this product suitable for harsh environments.

Propagation Delay At Nominal Supply: 5.2 ns

With a low propagation delay, this device ensures fast signal transmission, contributing to higher overall system performance.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, saving both space and manufacturing costs.

No. of Functions: 4

The availability of multiple functions enables versatile applications, making this product suitable for complex circuit designs.

Screening Level: MIL-PRF-38535 Class V

This classification ensures high reliability and performance under stringent military standards, making it ideal for critical applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier PCB layout and integration into existing designs.

No. of Bits: 4

Providing 4 bits allows for efficient data handling, optimizing space and performance in data transmission.

Nominal Supply Voltage / Vsup (V): 2.3

A nominal supply voltage of 2.3 V allows for lower power consumption, contributing to energy efficiency in battery-operated devices.

Load Capacitance (CL): 30 pF

A low load capacitance ensures faster switching speeds and enhanced signal integrity, improving overall circuit performance.

Power Supplies (V): 2.5/3.3

The flexibility in power supply voltage accommodates a variety of applications, making integration easier across different systems.

No. of Terminals: 48

With 48 terminals, this component provides ample I/O options, supporting complex functionality in compact designs.

Package Style (Meter): FLATPACK

Flatpack packages are ideal for slim-profile designs, which are often required in modern electronics.

Maximum I (ol): 12 Amp

The ability to handle up to 12 Amps indicates high output current capacity, making it suitable for demanding applications.

Propagation Delay (tpd): 5.2 ns

Repeats the high-speed performance characteristic of this device, ensuring efficient data flow within circuits.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this product suitable for environments with extreme temperatures.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output allows for flexible interfacing in shared bus systems, enhancing connectivity options.

Minimum Operating Temperature: -55 °C

This range indicates robustness in low-temperature environments, suitable for aerospace and military applications.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility and enhances PCB layout options for engineers.

No. of Ports: 2

Having two ports allows for bi-directional communication, which is essential for various data bus applications.

Maximum Seated Height: 2.72 mm

A slim profile aids in compact circuit designs, essential for modern electronic products where space is limited.

Width: 9.65 mm

A reasonable width allows for compatibility with various PCB layouts while maintaining functionality.

Output Polarity: TRUE

True output polarity simplifies the logic design, offering intuitive interfacing with other components.

Minimum Supply Voltage (Vsup): 1.8 V

The low minimum supply voltage helps to further reduce power consumption, beneficial in portable applications.

Length: 15.75 mm

A manageable length contributes to easy integration into complex circuit boards without requiring excessive space.

Temperature Grade: MILITARY

Designed to meet military specifications, ensuring reliability and performance in the most demanding conditions.

Total Dose (V): 300k Rad(Si)

This high total dose tolerance makes it suitable for space and radiation-prone environments.

Technology: CMOS

CMOS technology offers low static power consumption and high noise immunity, ideal for modern electronic applications.

Terminal Form: FLAT

Flat terminals facilitate better soldering and connection on PCBs, enhancing durability and reliability.

Terminal Pitch: 0.635 mm

A small terminal pitch allows for higher density PCB designs, optimizing space usage.

Control Type: ENABLE LOW

Low-enable control simplifies design and integration, ensuring intuitive operation in various circuits.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows for compatibility with a wide range of power supplies, enhancing design flexibility.

Technical Specifications

Bus Driver & Transceivers RHFXH162244K-01V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

9.65 mm

Trade Compliance

RHFXH162244K-01V Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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