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RHFXHR162245K-01Q

STMicroelectronics

RHFXHR162245K-01Q by STMicroelectronics

RHFXHR162245K-01Q by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 4.9 ns, ideal for high-speed applications. It operates within a supply voltage range of 1.8V to 3.6V and withstands temperatures from -55 °C to 125 °C. This military-grade device features a ceramic, metal-sealed package for enhanced reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,624 parts In-Stock

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2,624

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Digiode

USA . 1,709 parts In-Stock

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1,709

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Anansix

USA . 1,560 parts In-Stock

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1,560

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 96 parts In-Stock

1+ parts

$6.383

100+ parts

-

1k+ parts

$6.128

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$6.128

96

$6.383

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$6.128

$6.128

IDEA Electronic Components Group

UK . 1,263 parts In-Stock

1+ parts

$22.774

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-

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$20.496

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1,263

$22.774

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$20.496

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MKK Technologies

India . 890 parts In-Stock

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$42.824

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890

$42.824

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DigiPath Technology Company

USA . 890 parts In-Stock

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$42.824

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890

$42.824

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Parana Technologies

USA . 1,537 parts In-Stock

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$27.229

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1,537

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$27.229

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Corphita

USA . 1,174 parts In-Stock

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Overview

Elevate your designs with the RHFXHR162245K-01Q from STMicroelectronics, a trusted name in semiconductor innovation. This robust bus driver and transceiver combines exceptional reliability with rapid signal propagation, ideal for demanding military applications. Its ceramic and metal-sealed package ensures durability under extreme conditions, while its efficient design supports seamless data communication. Choose RHFXHR162245K-01Q for superior performance and peace of mind in every project!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This high-quality material enhances durability and reliability, making it ideal for harsh environments.

Propagation Delay At Nominal Supply: 4.9 ns

A low propagation delay allows for faster signal transmission, improving overall system performance.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

No. of Functions: 2

Multiple functions in one package reduce component count and save board space.

Screening Level: MIL-PRF-38535 Class Q

Meets military standards for reliability, ensuring high performance in demanding applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and allows for easy placement and soldering.

No. of Bits: 8

An 8-bit configuration provides adequate data handling for a variety of applications.

Nominal Supply Voltage / Vsup: 2.3 V

Lower supply voltage improves power efficiency, making it suitable for battery-operated devices.

Load Capacitance (CL): 30 pF

Low load capacitance allows for better signal integrity and faster switching speeds.

Power Supplies (V): 2.5/3.3

Compatible with widely used power supply levels, enhancing versatility for different applications.

No. of Terminals: 48

A higher number of terminals provides flexibility in circuit design and connectivity options.

Package Style (Meter): FLATPACK

Flatpack design allows for low-profile applications, making it suitable for space-constrained environments.

Maximum I (ol): 6 Amp

High output current capability supports demanding applications and reduces the need for additional components.

Propagation Delay (tpd): 4.9 ns

Fast propagation ensures timely data transmission, enhancing system responsiveness.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliability in extreme conditions.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output allows more flexible circuit design and reduces conflicts in data bus systems.

Minimum Operating Temperature: -55 °C

This low temperature capability ensures functioning in frigid environments, suitable for military and aerospace use.

Terminal Position: DUAL

Dual terminal positioning offers ease of access and improved solderability.

No. of Ports: 2

Multiple ports enhance data management and connectivity options in your system.

Maximum Seated Height: 2.72 mm

A low profile allows for slim designs, accommodating modern, compact electronics needs.

Width: 9.65 mm

Narrow width allows for efficient PCB layout and minimizes space usage.

Output Polarity: TRUE

True output polarity caters to specific signal requirements in certain applications.

Minimum Supply Voltage (Vsup): 1.8 V

Supports operation at lower voltages, further enhancing power efficiency and expanding application range.

Length: 15.75 mm

Compact length supports fitment in densely populated circuit boards while keeping device size manageable.

Temperature Grade: MILITARY

Designed to withstand harsh environmental conditions, this grade ensures reliability for critical applications.

Total Dose (V): 300k Rad(Si)

High radiation tolerance makes it suitable for space and nuclear applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing operational efficiency.

Terminal Form: FLAT

Flat terminals ensure better contact and ease of installation onto PCBs.

Terminal Pitch: 0.635 mm

Standard terminal pitch facilitates compatibility with common PCB layouts and reduces design complexity.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability supports various applications, enhancing flexibility in data communication.

Control Type: COMMON CONTROL

Common control type simplifies design processes and enhances the ease of integration into existing systems.

Maximum Supply Voltage (Vsup): 3.6 V

This maximum voltage allows compatibility with higher voltage systems while maintaining reliability.

Technical Specifications

Bus Driver & Transceivers RHFXHR162245K-01Q attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

2.72 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

9.65 mm

Trade Compliance

RHFXHR162245K-01Q Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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