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RHFXHR162245K05V

STMicroelectronics

RHFXHR162245K05V by STMicroelectronics

RHFXHR162245K05V by STMicroelectronics is a dual 8-bit bus driver with a low propagation delay of 4 ns, operating b/w 1.8V and 3.6V. It features a max load capacitance of 30 pF and operates in extreme temperatures from -55 °C to 125 °C. Ideal for aerospace applications, it meets MIL-PRF-38535 Class V standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,882 parts In-Stock

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3,882

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Vyrian

USA . 640 parts In-Stock

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640

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Anansix

USA . 632 parts In-Stock

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632

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 81 parts In-Stock

1+ parts

$4.069

100+ parts

-

1k+ parts

$3.906

10k+ parts

$3.906

81

$4.069

-

$3.906

$3.906

IDEA Electronic Components Group

UK . 998 parts In-Stock

1+ parts

$16.059

100+ parts

-

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$14.453

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998

$16.059

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$14.453

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MKK Technologies

India . 1,547 parts In-Stock

1+ parts

$30.197

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1,547

$30.197

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DigiPath Technology Company

USA . 1,547 parts In-Stock

1+ parts

$30.197

100+ parts

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1,547

$30.197

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Corphita

USA . 2,763 parts In-Stock

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2,763

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Parana Technologies

USA . 362 parts In-Stock

1+ parts

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$19.200

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362

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$19.200

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Overview

Elevate your designs with the RHFXHR162245K05V from STMicroelectronics, a top-tier bus driver and transceiver that guarantees unparalleled quality and reliability. Built to withstand extreme conditions, this rugged component excels in applications across aerospace, automotive, and industrial sectors. Enjoy rapid data transfer with minimal delay, while benefiting from STMicroelectronics’ commitment to innovation—ensuring you receive a product that enhances performance and longevity in any project.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 4 ns

A low propagation delay ensures fast signal transmission, making this bus driver efficient for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into various circuit boards, saving space and improving reliability.

No. of Functions: 2

Having dual functions provides versatility, allowing this device to perform multiple tasks in a single package.

Screening Level: MIL-PRF-38535 Class V

This high screening level indicates reliability and suitability for military and aerospace applications, ensuring performance in harsh conditions.

Package Shape: RECTANGULAR

The rectangular package shape is conducive to efficient thermal management and ease of placement on PCBs.

No. of Bits: 8

With an 8-bit data width, this product is capable of handling a substantial amount of data, making it ideal for modern applications.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V allows for compatibility with low-voltage designs, helping to save power.

Load Capacitance (CL): 30 pF

A low load capacitance ensures faster switching speeds, which is crucial for maintaining signal integrity in high-frequency applications.

No. of Terminals: 48

With 48 terminals available, this device can support a multitude of connections, enhancing system flexibility.

Package Style (Meter): FLATPACK

The flatpack style aids in surface mounting and is suitable for high-density circuits, making it versatile for a range of applications.

Maximum I (ol): 12 Amp

The ability to drive up to 12 Amps allows this bus driver to handle significant load currents, ideal for robust applications.

Propagation Delay (tpd): 4.9 ns

A propagation delay of only 4.9 ns further ensures fast operation, suitable for high-speed communication interfaces.

Maximum Operating Temperature: 125 °C

Operating at high temperatures ensures that the device can function in demanding environments without failure.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures makes this component ideal for extreme environments, such as aerospace applications.

Terminal Position: DUAL

The dual terminal position enhances design flexibility for PCB layout, accommodating various configurations.

No. of Ports: 2

Having two ports allows for bidirectional communication, making it suitable for a wide range of data transmission applications.

Maximum Seated Height: 2.72 mm

A low seated height contributes to space-saving designs, facilitating the development of compact devices.

Width: 9.65 mm

Narrow width enables easy placement in tight spaces, ensuring design efficiency and versatility.

Output Polarity: TRUE

True output polarity simplifies interfacing with other digital components, enhancing system compatibility.

Minimum Supply Voltage (Vsup): 1.8 V

A low minimum supply voltage broadens the range of applications, allowing use in various power-sensitive projects.

Length: 15.75 mm

Compact length supports high-density circuit designs, making it ideal for modern electronic applications.

Total Dose (V): 300k Rad(Si)

High radiation tolerance makes this device suitable for space and nuclear environments, ensuring reliability under extreme conditions.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making it suitable for battery-powered applications.

Terminal Form: FLAT

Flat terminal form allows for effective surface mounting, making the installation process simpler and more efficient.

Packing Method: TR

Tape and reel packing is ideal for automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.635 mm

A fine terminal pitch supports high-density mounting, making the device suitable for compact design layouts.

Count Direction: BIDIRECTIONAL

Bidirectional counting capabilities allow for flexible data handling and communication, enhancing its usability in various applications.

Control Type: ENABLE LOW

An enable low control type provides simple and effective activation of the device, allowing easy integration into digital systems.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6 V offers flexibility in power supply options while maintaining efficiency.

Maximum Power Supply Current (ICC): 100 mA

A maximum supply current rating of 100 mA allows the device to support a variety of applications, catering to different load requirements.

Technical Specifications

Bus Driver & Transceivers RHFXHR162245K05V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-XDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4.9 ns

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

9.65 mm

Trade Compliance

RHFXHR162245K05V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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