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RHFXH162245K-01Q

STMicroelectronics

RHFXH162245K-01Q by STMicroelectronics

RHFXH162245K-01Q by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 4.9 ns, ideal for high-speed applications. It operates within a supply voltage range of 1.8V to 3.6V and supports military-grade temperature extremes from -55 °C to 125 °C. This ceramic, metal-sealed device ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,333 parts In-Stock

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1,333

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Anansix

USA . 713 parts In-Stock

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713

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Vyrian

USA . 164 parts In-Stock

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164

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Distributors (Availability)

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Andel Nordic

Denmark . 230 parts In-Stock

1+ parts

$8.004

100+ parts

-

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$7.684

10k+ parts

$7.684

230

$8.004

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$7.684

$7.684

IDEA Electronic Components Group

UK . 786 parts In-Stock

1+ parts

$15.854

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$14.269

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786

$15.854

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$14.269

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MKK Technologies

India . 2,000 parts In-Stock

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$29.813

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$29.813

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DigiPath Technology Company

USA . 2,000 parts In-Stock

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$29.813

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$29.813

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Corphita

USA . 2,494 parts In-Stock

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2,494

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Parana Technologies

USA . 105 parts In-Stock

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$18.956

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105

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$18.956

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Overview

Elevate your designs with the RHFXH162245K-01Q from STMicroelectronics, a powerhouse in bus driver and transceiver technology. Crafted from high-quality ceramic and metal-sealed materials, this robust component excels in demanding environments, ensuring reliability even at extreme temperatures. With low propagation delays and dual-port functionality, it streamlines communication in military, aerospace, and industrial applications, delivering unmatched performance and efficiency for your critical projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed packaging ensures high reliability and protection against environmental factors, making it ideal for demanding applications.

Propagation Delay at Nominal Supply: 4.9 ns

A low propagation delay allows for faster data transmission, enhancing the overall performance in high-speed applications.

Surface Mount: YES

Surface mount technology facilitates easier integration into compact circuit designs, saving space and improving manufacturability.

No. of Functions: 2

Having multiple functions in a single device reduces component count, thereby optimizing design and saving costs.

Screening Level: MIL-PRF-38535 Class Q

This military screening level ensures the product meets rigorous standards for performance and reliability, suitable for use in military applications.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient PCB layout, allowing for better flow of signals and maximizing space usage.

No. of Bits: 8

An 8-bit configuration is versatile for various data communication applications, allowing for easy integration with other components.

Nominal Supply Voltage / Vsup (V): 2.3

Operating at a nominal supply voltage of 2.3 V makes this device energy-efficient, suitable for battery-powered applications.

Load Capacitance (CL): 30 pF

A load capacitance of 30 pF is optimal for high-speed signal integrity, ensuring reliable performance in digital applications.

Power Supplies (V): 2.5/3.3

Dual power supply options make this product flexible for various applications, accommodating different circuit requirements.

No. of Terminals: 48

With 48 terminals, this device facilitates complex connections and integration capabilities with other components.

Package Style (Meter): FLATPACK

Flatpack packaging provides lower profile options, enhancing thermal performance and saving board space.

Maximum I (ol): 6 Amp

A maximum output current capability of 6 Amps allows for driving higher loads, making this product suitable for robust applications.

Propagation Delay (tpd): 4.9 ns

Reiterating the low propagation delay, this characteristic significantly enhances performance in high-speed data transfers.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance under extreme conditions, suitable for harsh environments.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistors improves flexibility in managing bus lines, preventing conflicts in data transmission.

Minimum Operating Temperature: -55 °C

The capability to function in extremely low temperatures makes this product suitable for use in cold climates and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning allows for more efficient PCB layouts and better electrical performance in tight spaces.

No. of Ports: 2

Having two ports allows for bidirectional communication, making this product versatile for various data handling operations.

Maximum Seated Height: 2.72 mm

A low seated height is beneficial for applications requiring compact designs without compromising on performance.

Width: 9.65 mm

A compact width enhances flexibility in product design and layout, fitting into more constrained spaces.

Output Polarity: TRUE

The true output polarity allows for direct compatibility with standard systems, simplifying integration and making the device user-friendly.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at a minimum supply voltage of 1.8 V contributes to lower power consumption, essential for energy-sensitive applications.

Length: 15.75 mm

A moderate length ensures compatibility with various layouts while maintaining signal integrity over a reasonable distance.

Temperature Grade: MILITARY

Designed to military standards, this temperature grading assures high reliability and performance in critical applications.

Total Dose (V): 300k Rad(Si)

The high total dose tolerance increases the product's reliability in radiation-prone environments, making it suitable for space applications.

Technology: CMOS

CMOS technology is favored for its low power consumption and high noise immunity, resulting in efficient and reliable operation.

Terminal Form: FLAT

Flat terminal design aids in better contact during assembly, contributing to enhanced performance and reliability.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm accommodates dense layouts while ensuring ease of soldering and assembly.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability enhances versatility in data processing and communication scenarios.

Control Type: COMMON CONTROL

Common control type simplifies the design architecture, reducing complexity while ensuring effective signal management.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides a wide operating range, enabling flexibility in various circuit designs.

Technical Specifications

Bus Driver & Transceivers RHFXH162245K-01Q attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

2.72 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

9.65 mm

Trade Compliance

RHFXH162245K-01Q Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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