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RHFXH162244K03V

STMicroelectronics

RHFXH162244K03V by STMicroelectronics

STMicroelectronics' RHFXH162244K03V is a ceramic bus driver with 5.2ns propagation delay, suitable for military applications. It features 4 functions, operates at -55 to 125 °C, and has a load capacitance of 30pF. With TRUE output polarity and 3-STATE characteristics, it's ideal for high-reliability systems requiring low power supplies of 2.5/3.3V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,766 parts In-Stock

1+ parts

-

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4,766

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Digiode

USA . 2,540 parts In-Stock

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2,540

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Anansix

USA . 2,505 parts In-Stock

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2,505

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 204 parts In-Stock

1+ parts

$6.220

100+ parts

-

1k+ parts

$5.971

10k+ parts

$5.971

204

$6.220

-

$5.971

$5.971

IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$25.328

100+ parts

-

1k+ parts

$22.795

10k+ parts

-

1,546

$25.328

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$22.795

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$31.357

100+ parts

$28.535

1k+ parts

$25.713

10k+ parts

-

3,000

$31.357

$28.535

$25.713

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MKK Technologies

India . 4 parts In-Stock

1+ parts

$47.627

100+ parts

-

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4

$47.627

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DigiPath Technology Company

USA . 4 parts In-Stock

1+ parts

$47.627

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4

$47.627

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Component Stockers USA

USA . 271 parts In-Stock

1+ parts

$99.990

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271

$99.990

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Parana Technologies

USA . 1,632 parts In-Stock

1+ parts

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100+ parts

$30.283

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1,632

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$30.283

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Corphita

USA . 1,101 parts In-Stock

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1,101

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Overview

Unleash the power of your electronic designs with the RHFXH162244K03V from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability. This Bus Driver & Transceiver is perfect for a wide range of applications, offering customers unmatched value and performance. With its advanced technology and military-grade components, this product ensures optimal functionality and efficiency. Upgrade your projects today with the RHFXH162244K03V and experience the difference STMicroelectronics can make in your electronic designs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent protection against high temperatures and thermal shock, ensuring durability and reliability in harsh operating conditions.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Surface mount capability allows for easy and compact PCB assembly, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having multiple functions integrated into a single component reduces the need for additional components, saving cost and board space.

Screening Level: 38535V;38534K;883S

Compliance with multiple screening levels ensures high reliability and quality standards, making this product suitable for critical applications.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easier placement and alignment on the PCB, improving efficiency during assembly.

No. of Bits: 4

4-bit functionality provides sufficient data processing capability for many bus driver and transceiver applications.

Load Capacitance (CL): 30 pF

Optimized load capacitance ensures proper signal integrity and performance in high-speed applications.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages offers flexibility in system design and compatibility with different components.

No. of Terminals: 48

A higher number of terminals allows for more connections and functionalities, making this product versatile in various applications.

Package Style (Meter): FLATPACK

Flatpack package style provides a compact form factor, saving space on the PCB and enabling dense board layouts.

Maximum I (ol): 12 Amp

High output current capability allows for driving power-hungry loads without external amplification, enhancing the product's versatility.

Maximum Operating Temperature: 125 °C

Wide operating temperature range enables reliable performance in extreme environmental conditions, making this product suitable for rugged applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance when disabled, reducing power consumption and enabling bus sharing among multiple devices.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality in cold environments, enhancing the product's reliability and flexibility.

Terminal Position: DUAL

Dual terminal position facilitates easy soldering and connection to the PCB, streamlining the assembly process.

Output Polarity: TRUE

True output polarity ensures correct signal transmission and compatibility with other components, enhancing overall system reliability.

Temperature Grade: MILITARY

Military-grade temperature rating ensures robust performance in harsh environments and critical missions, making this product ideal for defense applications.

Total Dose (V): 300k Rad(Si)

High total dose radiation tolerance makes this product suitable for space and aerospace applications where exposure to radiation is a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation of the product.

Terminal Form: FLAT

Flat terminal form factor simplifies soldering and connection processes, improving manufacturability and reliability.

Packing Method: TR

TR (Tape and Reel) packing method ensures easy handling, storage, and automated assembly of the components.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting on the PCB, enabling compact designs and space-saving solutions.

Control Type: ENABLE LOW

Low enable control type simplifies the interfacing and operation of the product, enhancing user convenience and system integration.

Technical Specifications

Bus Driver & Transceivers RHFXH162244K03V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-XDFP-F48

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

4

No. of Functions:

4

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

5.2 ns

Qualification:

Not Qualified

Screening Level:

38535V;38534K;883S

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Trade Compliance

RHFXH162244K03V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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