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RHFXH163245K01V

STMicroelectronics

RHFXH163245K01V by STMicroelectronics

RHFXH163245K01V by STMicroelectronics is a 16-bit bus driver with a ceramic, metal-sealed package, ideal for military applications. It operates b/w -55 °C to 125 °C and supports supply voltages from 1.4V to 3.6V. With a fast propagation delay of just 7.5 ns, it ensures efficient data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,723 parts In-Stock

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2,723

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Vyrian

USA . 2,130 parts In-Stock

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2,130

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Anansix

USA . 167 parts In-Stock

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167

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Distributors (Availability)

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Andel Nordic

Denmark . 283 parts In-Stock

1+ parts

$5.657

100+ parts

-

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$5.431

10k+ parts

$5.431

283

$5.657

-

$5.431

$5.431

IDEA Electronic Components Group

UK . 1,543 parts In-Stock

1+ parts

$10.426

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-

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$9.384

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1,543

$10.426

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$9.384

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MKK Technologies

India . 1,954 parts In-Stock

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$19.606

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1,954

$19.606

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DigiPath Technology Company

USA . 1,954 parts In-Stock

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$19.606

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1,954

$19.606

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Component Stockers USA

USA . 432 parts In-Stock

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$99.990

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432

$99.990

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Corphita

USA . 3,908 parts In-Stock

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3,908

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Parana Technologies

USA . 950 parts In-Stock

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$12.466

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950

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$12.466

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your designs with the RHFXH163245K01V from STMicroelectronics—a robust bus driver and transceiver tailored for high-demand applications. Crafted with unparalleled quality and precision, this MIL-PRF-38535 Class V component ensures reliability even in extreme conditions. Its versatile 16-bit architecture and superior temperature tolerance make it ideal for military, aerospace, and industrial applications. Trust STMicroelectronics for innovation that drives performance and value!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The robust ceramic and metal-sealed construction provides excellent protection against environmental factors, ensuring durability and reliability in harsh conditions.

Surface Mount: YES

This surface mount capability allows for compact PCB design and ease of integration into modern electronic systems.

Screening Level: MIL-PRF-38535 Class V

This screening level indicates high reliability and quality, making it suitable for critical military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCB layouts, which is critical for high-density applications.

No. of Bits: 16

With 16 bits, this product allows for efficient data processing, suitable for applications requiring high data throughput.

Nominal Supply Voltage / Vsup: 1.8 V

Operating at a low nominal supply voltage enhances energy efficiency, which is essential for battery-powered or low-power applications.

No. of Terminals: 48

The presence of 48 terminals provides ample connectivity options, facilitating complex interfacing scenarios.

Package Style (Meter): FLATPACK

The flatpack style improves thermal performance and minimizes profile height, ideal for space-constrained designs.

Propagation Delay (tpd): 7.5 ns

A low propagation delay indicates high-speed performance, crucial for fast signal processing applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows the product to function reliably in extreme environments.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor provides flexibility in interfacing with multiple devices, improving versatility.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures makes this product suitable for use in cold environments and harsh conditions.

Terminal Position: DUAL

The dual terminal position enhances signal integrity and distribution for effective electrical performance.

No. of Ports: 2

Having two ports allows for bi-directional data transfer, increasing the product's functionality in communication applications.

Maximum Seated Height: 2.72 mm

A low seated height allows for a more compact design, making it ideal for portable and space-restricted devices.

Width: 9.65 mm

A narrow width contributes to a compact overall size, beneficial for miniaturized electronic systems.

Output Polarity: TRUE

True output polarity simplifies interfacing with standard logic levels, ensuring compatibility with other components.

Minimum Supply Voltage (Vsup): 1.4 V

Operating at a low minimum supply voltage enhances overall power management and efficiency.

Length: 15.75 mm

Optimized length allows for easy integration into PCB designs without occupying excessive space.

Temperature Grade: MILITARY

Military grade specifications ensure ability to withstand extreme environmental conditions, ideal for defense applications.

Total Dose (V): 300k Rad(Si)

Designed to handle high radiation doses, making it suitable for space applications and environments with radiation exposure.

Technology: CMOS

CMOS technology enables low power consumption while maintaining high speed, advantageous in energy-sensitive applications.

Terminal Form: FLAT

Flat terminals provide improved soldering and connectivity in surface mount technology, ensuring reliable assembly.

Packing Method: TR

Tape and reel packing method ensures efficient handling and automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.635 mm

A compact terminal pitch allows for high-density applications while maintaining ease of routing on PCBs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage flexibility allows compatibility with a wide range of devices and systems.

Technical Specifications

Bus Driver & Transceivers RHFXH163245K01V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

7.5 ns

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Total Dose (V):

300k Rad(Si)

Width:

9.65 mm

Trade Compliance

RHFXH163245K01V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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