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RHFXHR162245K-01V

STMicroelectronics

RHFXHR162245K-01V by STMicroelectronics

RHFXHR162245K-01V by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 4.9 ns, ideal for high-speed applications. It operates within a supply voltage range of 1.8V to 3.6V and withstands extreme temperatures from -55 °C to 125 °C. This military-grade device features a ceramic, metal-sealed package for enhanced reliability in demanding environments.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 998 parts In-Stock

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998

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Vyrian

USA . 259 parts In-Stock

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Anansix

USA . 105 parts In-Stock

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105

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Distributors (Availability)

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Andel Nordic

Denmark . 1,200 parts In-Stock

1+ parts

$7.495

100+ parts

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$7.195

10k+ parts

$7.195

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$7.495

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$7.195

$7.195

IDEA Electronic Components Group

UK . 2,172 parts In-Stock

1+ parts

$24.066

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$21.660

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2,172

$24.066

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$21.660

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MKK Technologies

India . 685 parts In-Stock

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$45.255

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685

$45.255

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DigiPath Technology Company

USA . 685 parts In-Stock

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$45.255

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685

$45.255

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Parana Technologies

USA . 1,599 parts In-Stock

1+ parts

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$28.775

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1,599

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$28.775

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Corphita

USA . 557 parts In-Stock

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557

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Overview

Unlock unparalleled performance with the RHFXHR162245K-01V from STMicroelectronics, a leader in quality and innovation. This advanced bus driver and transceiver is expertly designed for reliable operation in demanding applications, ensuring rapid data transmission with minimal propagation delay. Its robust construction meets stringent military standards, making it ideal for aerospace and defense projects. Elevate your designs with unmatched efficiency and durability that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed co-fired package material provides excellent thermal stability and protects against environmental factors, ensuring reliable performance in demanding applications.

Propagation Delay At Nominal Supply: 4.9 ns

With a low propagation delay of 4.9 ns, this product ensures high-speed data transmission, making it ideal for time-sensitive applications.

Surface Mount: YES

The surface mount capability allows for easier integration into compact designs, improving manufacturing efficiency and saving space on circuit boards.

No. of Functions: 2

With two functions, this device enhances versatility, allowing for more complex operations without needing additional components.

Screening Level: MIL-PRF-38535 Class V

This high screening level ensures that the product meets stringent military standards, providing durability and reliability in harsh environments.

Package Shape: RECTANGULAR

The rectangular shape of the package supports efficient layout and space usage on PCBs, aiding in compact electronic designs.

No. of Bits: 8

An 8-bit interface facilitates substantial data handling and communication, making it suitable for various digital applications.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage of 2.3 V allows for lower power consumption, enhancing energy efficiency in battery-powered devices.

Load Capacitance (CL): 30 pF

A low load capacitance of 30 pF reduces signal degradation, allowing for reliable transmission of high-frequency signals.

Power Supplies (V): 2.5/3.3

The dual power supply compatibility (2.5/3.3 V) allows the product to be used in a wider range of applications and systems.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options, facilitating integration into complex systems and improving overall circuit functionality.

Package Style (Meter): FLATPACK

The flatpack package style makes it suitable for automated assembly processes, reducing production costs and improving yield.

Maximum I (ol): 6 Amp

A maximum output current of 6 Amps supports high power requirements, making it an excellent choice for power-intensive applications.

Propagation Delay (tpd): 4.9 ns

The consistent propagation delay reinforces the product's suitability for fast-paced digital circuits and high-performance applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-temperature environments, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output configuration with a series resistor allows for flexible interfacing, enabling multiple devices to communicate over the same bus.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, the product is designed for extreme conditions and can be used in aerospace and military applications.

Terminal Position: DUAL

The dual terminal position enhances layout options and simplifies PCB design, allowing for more compact configurations.

No. of Ports: 2

Having two ports facilitates bidirectional communication, enhancing versatility and design flexibility for various applications.

Maximum Seated Height: 2.72 mm

The low maximum seated height of 2.72 mm helps in achieving a compact design, making it suitable for space-constrained applications.

Width: 9.65 mm

A narrow width of 9.65 mm allows for efficient component placement in high-density PCB layouts.

Output Polarity: TRUE

True output polarity simplifies design integration, providing straightforward signal handling in various applications.

Minimum Supply Voltage (Vsup): 1.8 V

The capability to operate at a minimum supply voltage of 1.8 V extends application possibilities to low-voltage devices, enhancing versatility.

Length: 15.75 mm

This compact length makes the product suitable for devices where space is at a premium, such as portable electronics.

Temperature Grade: MILITARY

Designed to military standards, this product ensures high reliability and ruggedness in demanding and extreme environments.

Total Dose (V): 300k Rad(Si)

With a total radiation dose tolerance of 300k Rad(Si), this component is well-suited for space and nuclear applications where radiation exposure is a concern.

Technology: CMOS

The CMOS technology provides low power consumption and high speed, making it an ideal choice for modern digital applications.

Terminal Form: FLAT

The flat terminal form supports effective surface mounting and minimizes signal delay, contributing to overall performance.

Terminal Pitch: 0.635 mm

The smaller terminal pitch of 0.635 mm allows for high-density assembly, maximizing the functionality of compact devices.

Count Direction: BIDIRECTIONAL

Bidirectional count direction enhances the capability to handle complex data flows in communication systems.

Control Type: COMMON CONTROL

The common control type simplifies overall system design and integration, making it easier to manage operations across multiple devices.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage compatibility of 3.6 V ensures that the device can handle a wide range of system voltages, offering flexibility in design.

Technical Specifications

Bus Driver & Transceivers RHFXHR162245K-01V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

9.65 mm

Trade Compliance

RHFXHR162245K-01V Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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