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RHFXH162374K-01Q

STMicroelectronics

RHFXH162374K-01Q by STMicroelectronics

RHFXH162374K-01Q by STMicroelectronics is a robust CMOS bus driver with a 5.5 ns propagation delay and operates at supply voltages of 2.3V to 3.6V. It features dual functions, supporting up to 8A output current, ideal for military applications. Its ceramic, metal-sealed package ensures reliability in extreme temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,431 parts In-Stock

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3,431

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Digiode

USA . 2,527 parts In-Stock

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Anansix

USA . 355 parts In-Stock

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355

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Distributors (Availability)

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Andel Nordic

Denmark . 215 parts In-Stock

1+ parts

$5.144

100+ parts

-

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$4.938

10k+ parts

$4.938

215

$5.144

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$4.938

$4.938

IDEA Electronic Components Group

UK . 1,624 parts In-Stock

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$8.329

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-

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$7.496

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1,624

$8.329

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$7.496

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MKK Technologies

India . 588 parts In-Stock

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$15.662

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$15.662

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DigiPath Technology Company

USA . 588 parts In-Stock

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$15.662

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588

$15.662

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Corphita

USA . 3,806 parts In-Stock

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Parana Technologies

USA . 586 parts In-Stock

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$9.958

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Overview

Elevate your electronic designs with the RHFXH162374K-01Q from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust bus driver & transceiver offers exceptional performance and reliability for various applications, ensuring seamless communication in demanding environments. With superior thermal stability and military-grade screening, it enhances system efficiency while delivering significant power savings. Choose STMicroelectronics for unmatched quality and performance!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed cofired body provides excellent thermal stability and reliability, making this product suited for harsh environments.

Propagation Delay At Nominal Supply: 5.5 ns

The fast propagation delay contributes to high-speed data transfer, allowing for efficient communication in fast systems.

Surface Mount: YES

Surface mount capability enables easy integration into compact circuit layouts, allowing for space-saving designs.

No. of Functions: 2

Having two functions increases versatility, allowing for multiple operations within a single chip.

Screening Level: MIL-PRF-38535 Class Q

This screening level ensures high reliability and performance for military applications, making it a secure choice for critical systems.

Package Shape: RECTANGULAR

The rectangular package shape supports easier PCB layout design and optimizes space utilization.

No. of Bits: 8

An 8-bit architecture allows for sufficient data width suitable for a variety of applications, from simple control to complex data processing.

Nominal Supply Voltage / Vsup (V): 2.3

A low nominal supply voltage enhances energy efficiency, making it suitable for battery-operated devices.

Load Capacitance (CL): 30 pF

This load capacitance value facilitates compatibility with different loads, ensuring consistent performance across applications.

Power Supplies (V): 2/3.3

Support for multiple supply voltages provides flexibility in design, accommodating a variety of system architectures.

No. of Terminals: 48

A larger number of terminals allows for more connections, increasing the product's functionality and integration potential.

Package Style (Meter): FLATPACK

Flatpack style aids in space conservation on PCBs, ideal for compact electronic designs.

Maximum I (ol): 8 Amp

With a high output current capability, this product is suitable for driving substantial loads, enhancing its applicability.

Propagation Delay (tpd): 6.2 ns

A minimal propagation delay further enhances performance in high-speed applications, allowing for quicker data transfer.

Maximum Operating Temperature: 125 °C

High tolerance to temperature extremes ensures operation in demanding environments, enhancing reliability.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output capability provides flexibility in design for multiple outputs, which is ideal for bus systems.

Trigger Type: POSITIVE EDGE

Positive edge triggering is common in digital circuits, ensuring compatibility with standard timing requirements.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for use in extreme cold environments, increasing deployment options.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in mounting and PCB layout, facilitating diverse design implementations.

No. of Ports: 2

Two ports enhance connectivity and enable communication between more devices in a bus system.

Maximum Seated Height: 2.72 mm

The compact height allows for low-profile applications, making it ideal for space-constrained designs.

Width: 9.65 mm

A moderate width provides a balance between manageable size and connection capability.

Output Polarity: TRUE

True output polarity indicates clear logic levels, which can simplify design considerations.

Minimum Supply Voltage (Vsup): 1.8 V

A very low minimum supply voltage increases compatibility with modern low-power devices.

Length: 15.75 mm

This length allows for easy placement on PCBs while maximizing connection possibilities.

Temperature Grade: MILITARY

Military grade specifications ensure that this product meets rigorous standards, making it dependable for critical applications.

Total Dose (V): 300k Rad(Si)

High total dose tolerance makes this device suitable for use in radiation-prone environments, such as space applications.

Maximum Frequency At Nominal Supply: 190000000 Hz

The high maximum frequency capability supports advanced high-speed applications, making it suitable for modern communication protocols.

Technology: CMOS

CMOS technology ensures low power consumption and high density, making it efficient for various applications.

Terminal Form: FLAT

Flat terminals improve solderability and provide a stable connection in surface mount applications.

Terminal Pitch: 0.635 mm

A standard terminal pitch facilitates compatibility with common PCB layouts, easing the design process.

Maximum Supply Voltage (Vsup): 3.6 V

A relatively high maximum supply voltage expands the range of compatible systems, increasing versatility.

Technical Specifications

Bus Driver & Transceivers RHFXH162374K-01Q attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

190000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2/3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

2.72 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Trigger Type:

POSITIVE EDGE

Width:

9.65 mm

Trade Compliance

RHFXH162374K-01Q Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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