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RHFXH162374K-01V

STMicroelectronics

RHFXH162374K-01V by STMicroelectronics

RHFXH162374K-01V by STMicroelectronics is a robust 8-bit bus driver with a propagation delay of just 5.5 ns, ideal for high-speed applications. It operates within a supply voltage range of 1.8 to 3.6 V and supports military-grade screening (MIL-PRF-38535 Class V). This ceramic, metal-sealed device excels in environments requiring reliability and efficiency, handling up to 8 A at max temp of 125 °C.

Median Price

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Lifecycle Status

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3

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1k+

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Digiode

USA . 601 parts In-Stock

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Vyrian

USA . 514 parts In-Stock

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Anansix

USA . 116 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 104 parts In-Stock

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$8.295

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$7.963

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$7.963

104

$8.295

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$7.963

IDEA Electronic Components Group

UK . 496 parts In-Stock

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$29.207

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$26.287

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MKK Technologies

India . 1,267 parts In-Stock

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$54.922

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$54.922

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DigiPath Technology Company

USA . 1,267 parts In-Stock

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$54.922

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$54.922

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Corphita

USA . 2,866 parts In-Stock

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Parana Technologies

USA . 922 parts In-Stock

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$34.922

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922

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$34.922

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Overview

Unlock unparalleled performance with the RHFXH162374K-01V from STMicroelectronics, a trusted name in cutting-edge technology. Designed for robust applications, this high-quality bus driver & transceiver delivers exceptional speed and reliability, ensuring optimal signal integrity even in extreme conditions. Benefit from its compact design and military-grade screening, making it perfect for aerospace, defense, and industrial automation. Elevate your projects with a product built for excellence!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction ensures high reliability, making it suitable for harsh environments.

Propagation Delay At Nominal Supply: 5.5 ns

With a low propagation delay, this device offers high-speed performance, enhancing overall system efficiency.

Surface Mount: YES

The surface mount design allows for compact PCB layouts, improving space utilization in electronic devices.

No. of Functions: 2

Having two functions adds versatility to the device, allowing it to perform multiple tasks within a single package.

Screening Level: MIL-PRF-38535 Class V

This stringent screening level signifies high reliability and is ideal for military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular shape is practical for design integration and space optimization on circuit boards.

No. of Bits: 8

An 8-bit architecture allows for efficient data handling and transfer, making it suitable for various digital applications.

Nominal Supply Voltage / Vsup (V): 2.3

A nominal supply voltage of 2.3V supports modern low-power applications, contributing to overall energy efficiency.

Load Capacitance (CL): 30 pF

Low load capacitance ensures minimal signal degradation, improving the integrity of high-speed signals.

Power Supplies (V): 2/3.3

The dual power supply capability offers flexibility in design, accommodating diverse application requirements.

No. of Terminals: 48

With 48 terminals, this device provides ample connectivity options for complex designs and integration.

Package Style (Meter): FLATPACK

Flatpack style contributes to a low profile, suitable for applications with space constraints.

Maximum I (ol): 8 Amp

An output current capability of 8 Amps allows it to drive substantial loads, making it versatile for various applications.

Propagation Delay (tpd): 6.2 ns

This minimal propagation delay ensures fast switching speeds, making it suitable for high-frequency applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit, the device can perform reliably in demanding thermal environments.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state outputs with series resistors enhance versatility in bus-oriented systems, reducing signal contention.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows synchronized operation, crucial for timing-critical applications.

Minimum Operating Temperature: -55 °C

The low minimum operational temperature ensures functionality in extreme cold conditions, perfect for outdoor or military use.

Terminal Position: DUAL

Dual terminal positions provide flexible mounting options and can simplify PCB layout and design.

No. of Ports: 2

Having two ports allows for dual-channel communication, improving data handling and processing capabilities.

Maximum Seated Height: 2.72 mm

The low seated height is advantageous for compact designs, ensuring the product fits seamlessly into tight spaces.

Width: 9.65 mm

A reasonable width makes it compatible with standard PCB layouts, facilitating easier integration into existing systems.

Output Polarity: TRUE

True output polarity simplifies interfacing with other logic devices, enhancing compatibility in digital circuits.

Minimum Supply Voltage (Vsup): 1.8 V

Compatibility with a minimum supply voltage of 1.8V supports low-power applications, contributing to overall energy savings.

Length: 15.75 mm

This size aids in compact circuit board designs, promoting efficient use of space within electronic devices.

Temperature Grade: MILITARY

The military-grade classification ensures robustness, vital for applications in harsh or critical environments.

Total Dose (V): 300k Rad(Si)

A total dose rating of 300k Rad(Si) assures reliability in radiation-prone environments, suitable for aerospace and defense.

Maximum Frequency At Nominal Supply: 190000000 Hz

Capable of operating at high frequencies enhances performance in fast-switching applications, improving overall system throughput.

Technology: CMOS

CMOS technology allows for lower power consumption and greater noise immunity, making it efficient for high-speed operations.

Terminal Form: FLAT

Flat terminals allow for easy soldering and better thermal performance, ensuring reliable connections.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm enables compatibility with standard PCB designs, simplifying manufacturing and assembly processes.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V accommodates diverse applications and provides flexibility in design.

Technical Specifications

Bus Driver & Transceivers RHFXH162374K-01V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

190000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2/3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Trigger Type:

POSITIVE EDGE

Width:

9.65 mm

Trade Compliance

RHFXH162374K-01V Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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