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SN74HC574DWRE4

Texas Instruments

SN74HC574DWRE4 by Texas Instruments

SN74HC574DWRE4 by Texas Instruments is an 8-bit bus driver with a supply voltage of 5V, operating temperature range of -40 to 85°C, and propagation delay of 330ns. It features a 3-STATE output and is ideal for industrial applications requiring a max frequency of 24MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,863 parts In-Stock

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Digiode

USA . 376 parts In-Stock

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376

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Nova Conductors

Japan . 89 parts In-Stock

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Andel Nordic

Denmark . 513 parts In-Stock

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$5.944

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$5.706

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$5.706

513

$5.944

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$5.706

$5.706

AZTECH Wire

Italy . 478 parts In-Stock

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$10.980

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478

$10.980

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Parana Technologies

USA . 1,491 parts In-Stock

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$15.555

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$15.930

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$15.555

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DigiPath Technology Company

USA . 535 parts In-Stock

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$17.127

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535

$17.127

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ChromeModa Solutions

Germany . 1,618 parts In-Stock

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$17.477

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$14.331

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$17.477

$14.331

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IDEA Electronic Components Group

UK . 848 parts In-Stock

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$17.477

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$16.603

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$15.729

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848

$17.477

$16.603

$15.729

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Corohmni

South Africa . 231 parts In-Stock

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$28.363

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Ampacity Inc.

Singapore . 156 parts In-Stock

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$31.000

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One Stop Electronics

USA . 1,571 parts In-Stock

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$48.000

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Semicontronic

India . 992 parts In-Stock

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$54.000

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$52.650

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$52.380

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992

$54.000

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Formix International (Excess)

India . 6,039 parts In-Stock

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Corphita

USA . 4,000 parts In-Stock

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Argo Parts USA

USA . 2,292 parts In-Stock

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Microchip USA

USA . 407 parts In-Stock

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Continental Prestige Electronics

USA . 256 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the SN74HC574DWRE4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled reliability and performance. Perfect for a wide range of applications, this product ensures smooth communication between various components. Experience the value of high-quality manufacturing with Texas Instruments and elevate your projects to new heights with the SN74HC574DWRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring the reliability of the product.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 8

Having 8 bits allows for processing and transferring of data in 8-bit chunks, increasing efficiency and speed of communication.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, compatible with most electronic devices and systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can function reliably in a wide range of environments.

Propagation Delay (tpd): 330ns

Low propagation delay of 330ns ensures quick response times in signal transmission, enhancing the performance of the product.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, providing flexibility in connecting multiple devices without interference.

Maximum Frequency At Nominal Supply: 24000000 Hz

High maximum frequency of 24MHz enables fast data processing and transmission, suitable for high-speed communication applications.

Technical Specifications

Bus Driver & Transceivers SN74HC574DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

24000000 Hz

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay (tpd):

330 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74HC574DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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