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M50FW080K5G

STMicroelectronics

M50FW080K5G by STMicroelectronics

M50FW080K5G from STMicroelectronics is a NOR flash memory with 1M words capacity, operating at 3.3V. It features a fast access time of 11 ns and supports asynchronous mode. Ideal for embedded applications, it operates b/w -20 °C to 85 °C in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 23,900 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 9,067 parts In-Stock

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Vyrian

USA . 8,983 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,396 parts In-Stock

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1,396

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Semtec, LLC

USA . 387 parts In-Stock

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387

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Digiode

USA . 324 parts In-Stock

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324

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Anansix

USA . 98 parts In-Stock

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98

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Electronics Depot

USA . 50 parts In-Stock

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50

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Bristol Electronics

USA . 13 parts In-Stock

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13

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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10

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Atlantic Semiconductor

USA . 8 parts In-Stock

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8

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Inventory MP

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,640 parts In-Stock

1+ parts

$4.285

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$3.857

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$4.285

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$3.857

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MKK Technologies

India . 1,047 parts In-Stock

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$8.058

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1,047

$8.058

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DigiPath Technology Company

USA . 1,047 parts In-Stock

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$8.058

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1,047

$8.058

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AZTECH Wire

Italy . 418 parts In-Stock

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$19.570

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418

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Kepictronics

USA . 11,850 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,947 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,298 parts In-Stock

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Corphita

USA . 2,781 parts In-Stock

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Parana Technologies

USA . 1,536 parts In-Stock

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$5.124

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Microchip USA

USA . 413 parts In-Stock

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Overview

Unlock limitless possibilities with the M50FW080K5G Flash Memory from STMicroelectronics! Renowned for their exceptional quality and innovative technology, STMicroelectronics delivers a reliable, high-performance solution perfect for diverse applications, from consumer electronics to industrial systems. Enhance your designs with fast access times and robust operation under varying conditions, ensuring efficiency and durability. Empower your projects with the trusted excellence of ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring reliability in various applications.

Surface Mount: YES

Facilitates efficient PCB design and saves space for compact electronic devices.

Package Shape: RECTANGULAR

Optimizes space on the PCB while maintaining a structured design.

Operating Mode: ASYNCHRONOUS

Allows for faster access times and easier integration with various systems.

Nominal Supply Voltage / Vsup (V): 3.3

Common voltage rating, providing compatibility with a wide range of devices.

Power Supplies (V): 3.3

Standard power requirements make it suitable for various applications.

No. of Terminals: 32

Provides multiple connections for data and power, enhancing functionality.

Package Style (Meter): CHIP CARRIER

Ideal for high-density applications, facilitating easier installation.

Maximum Operating Temperature: 85 'C

Suitable for high-temperature environments, ensuring reliable performance.

Organization: 1MX8

Provides efficient data organization, facilitating easier access and management.

Minimum Operating Temperature: -20 'C

Enables operation in colder environments, extending usability.

No. of Sectors/Size: 16

Multiple sectors improve data management and organization.

Terminal Finish: MATTE TIN

Enhanced durability and resistance to corrosion, ensuring reliable connections.

Terminal Position: QUAD

Facilitates easier connection and optimal layout in multi-terminal configurations.

Maximum Seated Height: 3.56 mm

Compact size enhances compatibility with low-profile designs.

Width: 11.43 mm

Compact width makes it suitable for tight spaces in electronic designs.

Minimum Supply Voltage (Vsup): 3 V

Flexibility in power requirements allows for integration in various systems.

Type: NOR TYPE

Provides fast read speeds and flexibility in memory applications.

Length: 13.97 mm

Compact length ensures it can fit into smaller electronic devices.

Programming Voltage (V): 3

Standard programming voltage enables easy integration into existing systems.

Technology: CMOS

Low power consumption and high-density integration make it energy efficient.

Parallel or Serial: PARALLEL

Allows faster data access and transfer rates, enhancing performance.

Terminal Form: J BEND

Ensures secure connections and facilitates easier mounting on PCBs.

Sector Size (Words): 64K

Allows for efficient data management and storage within sectors.

Maximum Supply Current: 60 mA

Relatively low power consumption ensures minimal impact on battery life.

No. of Words: 1048576 words

Substantial memory capacity caters to a wide range of applications.

Memory Width: 8

Provides efficient data transfer and communication between components.

Terminal Pitch: 1.27 mm

Standard pitch size allows for easy placement and soldering on PCBs.

No. of Words Code: 1M

Indicates a significant memory space for storage applications.

Command User Interface: YES

User-friendly interface simplifies programming and control of the device.

Maximum Supply Voltage (Vsup): 3.6 V

Higher voltage tolerance ensures compatibility with a variety of applications.

Memory Density: 8388608 bit

High density allows for extensive data storage in compact form factors.

Memory IC Type: FLASH

Non-volatile memory type retains data without power, enhancing reliability.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current minimizes power consumption in idle states.

Maximum Access Time: 11 ns

Fast access time improves system responsiveness and performance.

Technical Specifications

Flash Memory M50FW080K5G attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

16

No. of Terminals:

32

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M50FW080K5G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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