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S29GL01GT10TFI030

Infineon Technologies

S29GL01GT10TFI030 by Infineon Technologies

S29GL01GT10TFI030 by Infineon Technologies is a 64MX16 Flash Memory with 1073741824 bit memory density. It operates at -40 to 85 °C, with a supply voltage range of 2.7V to 3.6V. Ideal for industrial applications requiring fast access time and high memory capacity in a compact SMALL OUTLINE package.

Median Price

$9.700

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,820 parts In-Stock

1+ parts

$9.686

100+ parts

$8.726

1k+ parts

$8.463

10k+ parts

-

1,820

$9.686

$8.726

$8.463

-

Verical

USA . 1,820 parts In-Stock

1+ parts

$9.686

100+ parts

$8.726

1k+ parts

$8.463

10k+ parts

-

1,820

$9.686

$8.726

$8.463

-

Mouser Electronics

USA . 228 parts In-Stock

1+ parts

$15.590

100+ parts

$13.380

1k+ parts

$13.370

10k+ parts

-

228

$15.590

$13.380

$13.370

-

DigiKey

USA . 746 parts In-Stock

1+ parts

$17.620

100+ parts

$15.121

1k+ parts

$14.157

10k+ parts

-

746

$17.620

$15.121

$14.157

-

Flip Electronics (Authorized)

USA . 9,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,540

-

-

-

-

Rochester

USA . 342 parts In-Stock

1+ parts

-

100+ parts

$9.700

1k+ parts

$8.680

10k+ parts

$8.170

342

-

$9.700

$8.680

$8.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 47 parts In-Stock

1+ parts

$12.840

100+ parts

-

1k+ parts

-

10k+ parts

-

47

$12.840

-

-

-

Digiode

USA . 254 parts In-Stock

1+ parts

$14.620

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$14.620

-

-

-

Flip Electronics

USA . 9,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,540

-

-

-

-

Vyrian

USA . 3,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,140

-

-

-

-

Chip Stock

USA . 501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

501

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,822 parts In-Stock

1+ parts

$2.190

100+ parts

$2.102

1k+ parts

$2.015

10k+ parts

-

4,822

$2.190

$2.102

$2.015

-

Semicontronic

India . 2,707 parts In-Stock

1+ parts

$9.160

100+ parts

$8.931

1k+ parts

$8.885

10k+ parts

-

2,707

$9.160

$8.931

$8.885

-

Ampacity Inc.

Singapore . 3,536 parts In-Stock

1+ parts

$12.320

100+ parts

-

1k+ parts

-

10k+ parts

-

3,536

$12.320

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$12.583

100+ parts

-

1k+ parts

$12.080

10k+ parts

-

2,000

$12.583

-

$12.080

-

Continental Prestige Electronics

USA . 4,077 parts In-Stock

1+ parts

$12.840

100+ parts

-

1k+ parts

-

10k+ parts

$12.583

4,077

$12.840

-

-

$12.583

Corphita

USA . 984 parts In-Stock

1+ parts

$13.851

100+ parts

-

1k+ parts

-

10k+ parts

-

984

$13.851

-

-

-

Component Stockers USA

USA . 719 parts In-Stock

1+ parts

$14.170

100+ parts

$11.200

1k+ parts

-

10k+ parts

-

719

$14.170

$11.200

-

-

Microchip USA

USA . 1,252 parts In-Stock

1+ parts

$40.964

100+ parts

-

1k+ parts

-

10k+ parts

-

1,252

$40.964

-

-

-

Argo Parts USA

USA . 2,335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,335

-

-

-

-

Overview

Unlock the power of reliable, high-quality flash memory with the S29GL01GT10TFI030 by Infineon Technologies. Designed for industrial applications, this flash memory offers unparalleled performance and durability. With a wide operating temperature range and a compact design, it is perfect for a variety of embedded systems. Trust in Infineon's expertise and innovation to bring value and peace of mind to your projects. Experience faster access times and seamless data storage with this top-of-the-line flash memory solution. Elevate your products with the S29GL01GT10TFI030 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and provides good protection to the flash memory chip, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, making it suitable for automated manufacturing processes.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent and parallel data transfers, improving overall performance and efficiency of the flash memory.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this flash memory chip compatible with a wide range of devices and ensures efficient power consumption.

No. of Terminals: 56

Having 56 terminals provides ample connectivity options, enabling seamless integration with various circuit designs and configurations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this flash memory chip can withstand harsh environments and extreme conditions.

Memory IC Type: FLASH

Being a flash memory chip, it offers high-speed data access, low power consumption, and non-volatile storage, making it ideal for storing critical data in electronic devices.

Maximum Access Time: 100 ns

Having a fast maximum access time of 100 ns ensures quick read and write operations, enhancing the overall performance of the flash memory chip.

Technical Specifications

Flash Memory S29GL01GT10TFI030 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

100 ns

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

2.7

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

14 mm

Trade Compliance

S29GL01GT10TFI030 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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