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M50FLW080AK5G

STMicroelectronics

M50FLW080AK5G by STMicroelectronics

M50FLW080AK5G from STMicroelectronics is a 1M x 8 NOR Flash memory with a synchronous operating mode and a supply voltage of 3.3V. It features fast access times of 11 ns, operates b/w -20 °C to 85 °C, and is ideal for embedded applications. Its compact chip carrier design ensures efficient surface mounting in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 19,400 parts In-Stock

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Vyrian

USA . 2,778 parts In-Stock

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Digiode

USA . 2,426 parts In-Stock

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Anansix

USA . 347 parts In-Stock

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Electronics Depot

USA . 50 parts In-Stock

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50

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Prism Electronics

USA . 18 parts In-Stock

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18

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IDEA Electronic Components Group

UK . 2,331 parts In-Stock

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$4.248

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$3.823

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$3.823

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MKK Technologies

India . 783 parts In-Stock

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$7.987

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DigiPath Technology Company

USA . 783 parts In-Stock

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$7.987

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AZTECH Wire

Italy . 211 parts In-Stock

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$19.440

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QUARKTWIN TECHNOLOGY LTD

USA . 11,701 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 1,322 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 884 parts In-Stock

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Metaverse IC Inc.

Canada . 531 parts In-Stock

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Microchip USA

USA . 185 parts In-Stock

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Overview

Elevate your projects with the M50FLW080AK5G from STMicroelectronics, a leader in innovative technology. This high-quality Flash Memory offers unmatched reliability and performance for various applications, from consumer electronics to industrial automation. With its compact design and low power consumption, it ensures efficiency while delivering exceptional speed and responsiveness. Choose STMicroelectronics for superior products that drive success and innovation in every endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability and longevity in various applications.

Surface Mount: YES

Surface mount design allows for compact installations, making it suitable for space-constrained devices.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB layout and assembly processes.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer rates, resulting in better overall performance.

Nominal Supply Voltage / Vsup: 3.3 V

Standard voltage supply helps maintain compatibility with most digital circuits.

Power Supplies (V): 3.3

Designed for low power consumption, making it energy-efficient for various applications.

No. of Terminals: 32

A sufficient number of terminals supports various connection configurations.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging aids in effective heat dissipation and improves reliability.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliable operation in demanding environments.

Organization: 1MX8

This organization supports efficient data handling, increasing read/write efficiency.

Minimum Operating Temperature: -20 °C

Wide temperature range makes this product versatile for various industrial applications.

No. of Sectors/Size: 48,13

The defined sector size enhances data management, providing flexibility in storage applications.

Terminal Finish: TIN

Tin finish offers good solderability and reliability for long-term connections.

Terminal Position: QUAD

Quad terminal positioning promotes improved electrical performance and stability.

Maximum Seated Height: 3.56 mm

Low profile allows fitting into compact designs without significant height constraints.

Width: 11.43 mm

Compact width makes it suitable for tight layout designs in electronic devices.

Minimum Supply Voltage (Vsup): 3 V

Operates efficiently at lower voltages, enhancing compatibility with various battery-operated devices.

Type: NOR TYPE

NOR type architecture provides fast random access and efficient performance for read operations.

Length: 13.97 mm

Optimized length contributes to an overall compact footprint, supporting modern design practices.

Programming Voltage (V): 3

The operating programming voltage is typical for flash memory, ensuring compatibility with existing systems.

Technology: CMOS

CMOS technology ensures low power operation and high-speed processing capabilities.

Parallel or Serial: PARALLEL

Parallel data transfer enables faster read/write speeds, enhancing overall performance.

Terminal Form: J BEND

J bend terminals are easy to solder, facilitating simpler assembly in manufacturing processes.

Sector Size (Words): 4K, 64K

Flexible sector sizes allow for efficient memory management in various applications.

Maximum Supply Current: 60 mA

Moderate supply current helps in minimizing power consumption during operation.

No. of Words: 1048576 words

Large word count provides ample storage capacity for data-intensive applications.

Memory Width: 8

8-bit memory width balances performance with storage efficiency for diverse applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration into existing circuit designs.

No. of Words Code: 1M

The 1M word code supports significant data storage requirements in embedded systems.

Command User Interface: YES

User-friendly command interface simplifies integration and control in application development.

Maximum Supply Voltage (Vsup): 3.6 V

Flexible maximum supply voltage provides a cushion for voltage fluctuations in power supply.

Memory Density: 8388608 bit

High memory density supports substantial data storage, ideal for advanced embedded applications.

Memory IC Type: FLASH

Flash memory type ensures non-volatile data retention, making it suitable for persistent storage requirements.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current enhances battery life in portable devices.

Maximum Access Time: 11 ns

Fast access time enables swift data retrieval, improving overall system responsiveness.

Technical Specifications

Flash Memory M50FLW080AK5G attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

48,13

No. of Terminals:

32

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sector Size (Words):

4K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M50FLW080AK5G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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