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SS9014

Onsemi

SS9014 by Onsemi

SS9014 by Onsemi is a NPN BJT transistor with max VCEsat of 0.3V, hFE of 60, and fT of 270MHz. Ideal for amplifier applications due to its max IC of 0.1A and max VCE of 45V. Package style is cylindrical with through-hole terminals, suitable for various electronic designs.

Median Price

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Lifecycle Status

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3

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1k+

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Digiode

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Vyrian

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Bristol Electronics

USA . 342 parts In-Stock

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Problanco Electronics

Mexico . 7,714 parts In-Stock

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TANS Electronics

Latvia . 4,971 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

USA . 4,214 parts In-Stock

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Supply Digital

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Corphita

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UHIMA Technologies

Türkiye . 243 parts In-Stock

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Corohmni

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Overview

Unlock the power of amplification with the SS9014 by Onsemi, a top-quality NPN transistor perfect for a range of applications. Manufactured by industry leader Onsemi, this small signal bipolar junction transistor boasts a single configuration and a maximum VCEsat of just 0.3V. Ideal for amplifier use, this transistor offers customers superior performance, reliability, and value. Whether you're working on audio equipment, signal processing, or telecommunications devices, the SS9014 delivers exceptional results every time. Trust Onsemi to provide the best in semiconductor technology with the SS9014 transistor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand a wide range of operating temperatures, making the transistor suitable for various environments.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifier circuits, making this transistor ideal for audio applications.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for easy integration into different electronic systems.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring reliable and efficient performance in amplifying signals.

Maximum VCEsat: 0.3 V

The low VCEsat value indicates low saturation voltage, resulting in minimal power loss and efficient operation.

No. of Terminals: 3

Having 3 terminals allows for easy circuit connections and enables versatility in circuit design.

Maximum Power Dissipation (Abs): 0.45 W

With a high power dissipation rating, this transistor can handle high power loads without overheating.

Maximum Collector-Emitter Voltage: 45 V

The high collector-emitter voltage rating provides a safety margin for the transistor to handle voltage spikes and surges.

Nominal Transition Frequency (fT): 270 MHz

The high transition frequency allows for fast switching speeds, making the transistor suitable for high-frequency applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) SS9014 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

3.5 pF

Maximum Collector-Emitter Voltage:

45 V

Configuration:

Minimum DC Current Gain (hFE):

60

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

.45 W

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.3 V

Trade Compliance

SS9014 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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