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NXH800A100L4Q2F2S1G

Onsemi

NXH800A100L4Q2F2S1G by Onsemi

NXH800A100L4Q2F2S1G by Onsemi is an N-CHANNEL IGBT with 1000V VCEsat, 309A IC, and 714W power dissipation. Ideal for POWER CONTROL applications due to its high voltage handling capacity and low saturation voltage. Suitable for complex configurations requiring precise control in industrial settings.

Median Price

$143.240

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 36 parts In-Stock

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$143.240

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$126.655

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36

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Digiode

USA . 1,008 parts In-Stock

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$125.894

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Vyrian

USA . 8,688 parts In-Stock

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Flip Electronics

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Corphita

USA . 136 parts In-Stock

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$119.268

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Corohmni

South Africa . 302 parts In-Stock

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$132.520

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Microchip USA

USA . 9,585 parts In-Stock

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$195.675

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SupplyDigital Components

Austria . 6,785 parts In-Stock

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Kulean Microsystems

USA . 6,451 parts In-Stock

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TANS Electronics

Latvia . 3,330 parts In-Stock

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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Problanco Electronics

Mexico . 330 parts In-Stock

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Overview

Experience the power of innovation with the NXH800A100L4Q2F2S1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors that are perfect for power control applications. With a maximum VCEsat of 2.3V and a maximum collector-emitter voltage of 1000V, this transistor offers superior performance and reliability. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NXH800A100L4Q2F2S1G and unlock endless possibilities.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speed, making them ideal for power control applications.

Configuration: COMPLEX

A complex configuration allows for optimal performance in power control applications, ensuring high power dissipation and voltage handling capabilities.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers high current and voltage capabilities, making it a reliable choice for controlling power in various systems.

Maximum VCEsat: 2.3 V

With a low VCEsat value, this IGBT offers low power dissipation and high efficiency, ensuring minimal energy loss during operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement in a variety of systems, making it versatile and easy to integrate into different designs.

Nominal Turn Off Time (toff): 1121.94 ns

The fast turn off time of this IGBT ensures efficient switching and control, reducing heat generation and improving overall performance.

Maximum Power Dissipation (Abs): 714 W

With a high power dissipation capability, this IGBT can handle large power loads without overheating, ensuring reliable operation in high-power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this IGBT to operate in harsh environments with elevated temperatures, making it suitable for a wide range of applications.

Maximum Collector-Emitter Voltage: 1000 V

The high maximum collector-emitter voltage rating of this IGBT allows it to handle high voltage levels, making it suitable for high-power applications that require voltage control.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high performance and efficiency, making them a popular choice for power control applications that require fast and reliable switching.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH800A100L4Q2F2S1G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1000 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-P17

No. of Elements:

4

No. of Terminals:

17

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

PIN/PEG

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1121.94 ns

Nominal Turn On Time (ton):

223.8 ns

Maximum VCEsat:

2.3 V

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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