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NXH80T120L2Q0PG

Onsemi

NXH80T120L2Q0PG by Onsemi

NXH80T120L2Q0PG by Onsemi is an IGBT with VCEsat of 2.8V, Pdiss of 146W, and VCEmax of 1200V. Ideal for high-power applications requiring a max IC of 65A and operating temperatures up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,929 parts In-Stock

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Digiode

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.857

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$1.690

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$1.523

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Microchip USA

USA . 316 parts In-Stock

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$3.497

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AZTECH Wire

Italy . 297 parts In-Stock

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$21.490

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Problanco Electronics

Mexico . 6,719 parts In-Stock

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SupplyDigital Components

Austria . 5,398 parts In-Stock

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Corphita

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Kulean Microsystems

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Corohmni

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TANS Electronics

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UHIMA Technologies

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Overview

Boost your electronic devices' performance with the NXH80T120L2Q0PG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that guarantee reliability and efficiency. With a maximum VCEsat of 2.8V and a collector-emitter voltage of 1200V, this IGBT offers superior power dissipation and temperature resistance, making it ideal for a wide range of applications. Unlock the full potential of your projects with the NXH80T120L2Q0PG and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Maximum VCEsat: 2.8 V

Low VCEsat value indicates lower voltage drop across the transistor, leading to higher efficiency and reduced power losses in the circuit.

Maximum Power Dissipation (Abs): 146 W

High maximum power dissipation capability ensures the IGBT can handle high power applications without overheating or failing prematurely.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance allows for reliable performance even in demanding operating conditions, increasing the overall lifespan of the IGBT.

Maximum Collector-Emitter Voltage: 1200 V

High maximum collector-emitter voltage rating enables the IGBT to be used in high-voltage applications with a wide range of industrial and commercial uses.

Maximum Gate-Emitter Voltage: 20 V

Low gate-emitter voltage ensures easy and efficient switching of the IGBT, making it suitable for high-speed applications where fast switching is required.

Maximum Collector Current (IC): 65 A

High maximum collector current rating allows the IGBT to handle high levels of current, making it suitable for power electronics applications requiring high current capabilities.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH80T120L2Q0PG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum VCEsat:

2.8 V

Trade Compliance

NXH80T120L2Q0PG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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