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NXH80T120L3Q0S3G

Onsemi

NXH80T120L3Q0S3G by Onsemi

NXH80T120L3Q0S3G by Onsemi is an N-CHANNEL IGBT with 4 elements in a bridge configuration. It has a max VCEsat of 2.4V and can handle up to 75A of collector current. Ideal for power control applications, it operates at temperatures ranging from -40 °C to 150°C.

Median Price

$58.725

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1 parts In-Stock

1+ parts

$55.300

100+ parts

-

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1

$55.300

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-

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Farnell

UK . 1 parts In-Stock

1+ parts

$64.390

100+ parts

$55.210

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-

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1

$64.390

$55.210

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DigiKey

USA . 24 parts In-Stock

1+ parts

$67.720

100+ parts

$51.672

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-

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24

$67.720

$51.672

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Element14

Singapore . 1 parts In-Stock

1+ parts

$115.130

100+ parts

$91.160

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-

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1

$115.130

$91.160

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Rochester

USA . 136 parts In-Stock

1+ parts

-

100+ parts

$51.680

1k+ parts

$46.240

10k+ parts

$43.520

136

-

$51.680

$46.240

$43.520

Verical

USA . 136 parts In-Stock

1+ parts

-

100+ parts

$58.725

1k+ parts

$52.538

10k+ parts

$49.450

136

-

$58.725

$52.538

$49.450

Future Electronics

Canada . 24 parts In-Stock

1+ parts

-

100+ parts

$48.230

1k+ parts

$47.830

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24

-

$48.230

$47.830

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Arrow

USA . 24 parts In-Stock

1+ parts

-

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$58.300

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24

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$58.300

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Chip1Stop

Japan . 24 parts In-Stock

1+ parts

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$68.500

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24

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$68.500

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Distributors (In-Stock)

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Digiode

USA . 2,045 parts In-Stock

1+ parts

$61.170

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2,045

$61.170

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Vyrian

USA . 7,494 parts In-Stock

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7,494

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NAC Semi

USA . 48 parts In-Stock

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$97.650

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48

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$97.650

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IBS Electronics

USA . 24 parts In-Stock

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100+ parts

$68.877

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24

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$68.877

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Distributors (Availability)

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Corphita

USA . 842 parts In-Stock

1+ parts

$57.951

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842

$57.951

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Corohmni

South Africa . 362 parts In-Stock

1+ parts

$61.000

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362

$61.000

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Continental Prestige Electronics

USA . 1 parts In-Stock

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$81.280

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$81.280

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Microchip USA

USA . 9,718 parts In-Stock

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$184.667

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9,718

$184.667

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TANS Electronics

Latvia . 8,303 parts In-Stock

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8,303

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SupplyDigital Components

Austria . 2,982 parts In-Stock

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Kulean Microsystems

USA . 970 parts In-Stock

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970

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UHIMA Technologies

Türkiye . 520 parts In-Stock

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520

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Perfect Parts

USA . 74 parts In-Stock

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Problanco Electronics

Mexico . 59 parts In-Stock

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Overview

Elevate your power control capabilities with the NXH80T120L3Q0S3G by Onsemi. As a leader in Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers top-quality products that excel in performance and reliability. This N-channel, 4-element bridge with built-in diode and thermistor is designed for maximum power dissipation of 188W, making it ideal for a wide range of applications. From industrial automation to renewable energy systems, this IGBT offers superior efficiency, durability, and versatility. Upgrade your power control solutions with Onsemi's NXH80T120L3Q0S3G and experience the difference in performance and value.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor enhance the functionality and protection of the IGBT, improving reliability and performance.

Maximum VCEsat: 2.4 V

Low VCEsat helps reduce power dissipation and improve energy efficiency in power control applications.

Nominal Turn Off Time (toff): 750 ns

Fast turn-off time allows for efficient control and switching of power in applications requiring precise timing.

Maximum Power Dissipation (Abs): 188 W

High power dissipation capability ensures the IGBT can handle demanding power control tasks without overheating.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating makes this IGBT suitable for applications requiring high voltage operation and reliability.

Maximum Collector Current (IC): 75 A

High collector current rating enables the IGBT to handle large current loads, making it suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH80T120L3Q0S3G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X20

No. of Elements:

4

No. of Terminals:

20

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

750 ns

Nominal Turn On Time (ton):

98 ns

Maximum VCEsat:

2.4 V

Trade Compliance

NXH80T120L3Q0S3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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