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NXH800A100L4Q2F2S2G

Onsemi

NXH800A100L4Q2F2S2G by Onsemi

NXH800A100L4Q2F2S2G by Onsemi is an N-CHANNEL IGBT for POWER CONTROL applications. It features a Max VCEsat of 2.3V, Max Collector-Emitter Voltage of 1000V, and Max Collector Current of 309A. This COMPLEX transistor has a Nominal Turn Off Time of 1121.94ns and operates b/w -40 to 175 °C temperature range.

Median Price

$143.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 36 parts In-Stock

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$143.240

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$126.655

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36

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$126.655

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Digiode

USA . 2,220 parts In-Stock

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$126.426

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Vyrian

USA . 5,384 parts In-Stock

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Corphita

USA . 2,047 parts In-Stock

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$119.772

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2,047

$119.772

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Corohmni

South Africa . 437 parts In-Stock

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$133.080

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437

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SupplyDigital Components

Austria . 6,098 parts In-Stock

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Microchip USA

USA . 4,515 parts In-Stock

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TANS Electronics

Latvia . 1,970 parts In-Stock

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Problanco Electronics

Mexico . 1,832 parts In-Stock

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Kulean Microsystems

USA . 1,803 parts In-Stock

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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Overview

Unleash the power of innovation with the NXH800A100L4Q2F2S2G from Onsemi. As a leader in Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers unmatched quality and reliability in every product. Whether you're looking to optimize power control or enhance performance, this N-CHANNEL transistor offers unparalleled efficiency with a maximum VCEsat of 2.3V and a maximum collector current of 309A. Trust Onsemi to provide cutting-edge solutions for your power management needs. Elevate your applications to new heights with the NXH800A100L4Q2F2S2G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Maximum VCEsat: 2.3 V

Low VCEsat value indicates minimal saturation voltage drop when the transistor is fully on, resulting in lower power dissipation and higher efficiency.

Maximum Power Dissipation (Abs): 714 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this IGBT can withstand elevated temperatures, ensuring reliable performance in industrial environments.

Maximum Collector-Emitter Voltage: 1000 V

High maximum VCE voltage rating enables the IGBT to handle high voltage levels, making it suitable for power control applications where high voltage is involved.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH800A100L4Q2F2S2G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1000 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-P17

No. of Elements:

4

No. of Terminals:

17

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

PIN/PEG

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1121.94 ns

Nominal Turn On Time (ton):

223.8 ns

Maximum VCEsat:

2.3 V

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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