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NXH80T120L3Q0P3G

Onsemi

NXH80T120L3Q0P3G by Onsemi

NXH80T120L3Q0P3G by Onsemi is an N-CHANNEL IGBT with 4 elements in a bridge configuration. It has a max VCEsat of 2.4V and can handle up to 75A collector current. Ideal for power control applications, it operates at temperatures ranging from -40 °C to 150°C.

Median Price

$47.490

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 248 parts In-Stock

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-

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$47.490

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$42.490

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$39.990

248

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$47.490

$42.490

$39.990

Verical

USA . 248 parts In-Stock

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-

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$59.362

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$53.112

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$49.987

248

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$59.362

$53.112

$49.987

DigiKey

USA . 120 parts In-Stock

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$36.040

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$36.040

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Flip Electronics (Authorized)

USA . 120 parts In-Stock

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Digiode

USA . 63 parts In-Stock

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$55.262

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Vyrian

USA . 5,347 parts In-Stock

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Flip Electronics

USA . 120 parts In-Stock

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120

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Distributors (Availability)

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Corohmni

South Africa . 280 parts In-Stock

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$41.590

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280

$41.590

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Corphita

USA . 2,359 parts In-Stock

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$52.353

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2,359

$52.353

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TANS Electronics

Latvia . 6,717 parts In-Stock

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SupplyDigital Components

Austria . 6,006 parts In-Stock

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Problanco Electronics

Mexico . 4,493 parts In-Stock

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Kulean Microsystems

USA . 1,147 parts In-Stock

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UHIMA Technologies

Türkiye . 12 parts In-Stock

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Overview

Unlock the power of innovation with the NXH80T120L3Q0P3G by Onsemi! Crafted by a trusted manufacturer, this Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and performance. Ideal for power control applications, this N-CHANNEL transistor boasts a configuration that includes a bridge, 4 elements with built-in diode and thermistor. With features like a fast turn-off time and high maximum operating temperature, this product delivers exceptional value and reliability. Experience the benefits of advanced technology and efficiency with the NXH80T120L3Q0P3G - your ultimate solution for power management needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are commonly used in high power applications due to their superior conduction characteristics.

Maximum VCEsat: 2.4 V

Lower VCEsat value indicates lower power dissipation and higher efficiency in power control applications.

Nominal Turn Off Time (toff): 750 ns

Fast turn-off time allows for precise control in power switching applications, improving overall system performance.

Maximum Power Dissipation (Abs): 188 W

Higher power dissipation capability allows the IGBT to handle larger loads and operate in high power environments.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can reliably function in harsh environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating ensures the IGBT can handle high voltage applications without breakdown.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage allows for precise control of the IGBT, ensuring proper switching in power control applications.

Maximum Collector Current (IC): 75 A

High collector current rating enables the IGBT to handle high current loads without damage.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH80T120L3Q0P3G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X20

No. of Elements:

4

No. of Terminals:

20

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

750 ns

Nominal Turn On Time (ton):

98 ns

Maximum VCEsat:

2.4 V

Trade Compliance

NXH80T120L3Q0P3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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