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NXH800A100L4Q2F2P1G

Onsemi

NXH800A100L4Q2F2P1G by Onsemi

NXH800A100L4Q2F2P1G by Onsemi is an N-CHANNEL IGBT for POWER CONTROL applications. It features a Max VCEsat of 2.3V, Max Collector-Emitter Voltage of 1000V, and Max Power Dissipation of 714W. Ideal for high-power systems requiring efficient switching with fast turn-off and turn-on times.

Median Price

$160.755

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 2 parts In-Stock

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$129.480

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$121.710

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$113.940

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2

$129.480

$121.710

$113.940

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Mouser Electronics

USA . 36 parts In-Stock

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$192.030

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36

$192.030

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Digiode

USA . 1,192 parts In-Stock

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$135.346

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Vyrian

USA . 6,799 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 680 parts In-Stock

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$128.223

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680

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Corohmni

South Africa . 134 parts In-Stock

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$142.470

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Kulean Microsystems

USA . 7,894 parts In-Stock

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Problanco Electronics

Mexico . 7,266 parts In-Stock

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SupplyDigital Components

Austria . 5,972 parts In-Stock

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TANS Electronics

Latvia . 2,201 parts In-Stock

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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Overview

onsemi NXH800A100L4Q2F2xxG 3-Level ANPC Q2Pack Modules are power-integrated modules (PIMs) containing a single A-type NPC stage containing high-performance 1000V FS4 IGBTs and 1000V rugged anti-parallel Extremefast diodes. The module includes an NTC thermistor. The high-density onsemi NXH800A100L4Q2F2xxG devices feature low switching losses to reduce system power dissipation, a low inductive layout, and low package heights. These IGBT modules operate within a wide -40°C to +175°C temperature range.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their superior performance and efficiency compared to P-CHANNEL devices.

Configuration: COMPLEX

Complex configuration allows for better control and management of power in various applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in such scenarios.

Maximum VCEsat: 2.3 V

Low VCEsat value indicates minimal voltage drop across the transistor, leading to higher efficiency.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and installation in various systems.

Nominal Turn Off Time (toff): 1121.94 ns

Fast turn-off time ensures quick switching capabilities, making it suitable for high-speed applications.

Maximum Power Dissipation (Abs): 714 W

High power dissipation capability allows for handling large power loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure and stable mounting, ideal for industrial applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures the IGBT can perform reliably in harsh environments.

Maximum Collector-Emitter Voltage: 1000 V

High maximum VCE voltage rating allows for handling high voltage applications with safety.

Transistor Element Material: SILICON

Silicon material provides excellent electrical characteristics, making the IGBT reliable and efficient.

Maximum Gate-Emitter Voltage: 20 V

The high maximum gate-emitter voltage rating ensures stable and secure gate control.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without issues.

Maximum Collector Current (IC): 309 A

High maximum collector current rating enables handling large current loads with ease.

Maximum Gate-Emitter Threshold Voltage: 6.7 V

Low gate-emitter threshold voltage ensures efficient gate control and minimal power loss.

Terminal Position: UPPER

Upper terminal position provides easy access and connection in various circuit layouts.

Case Connection: ISOLATED

Isolated case connection ensures safety and prevents short circuits for reliable operation.

Nominal Turn On Time (ton): 223.8 ns

Fast turn-on time enables quick activation of the transistor for rapid power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH800A100L4Q2F2P1G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1000 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X17

No. of Elements:

4

No. of Terminals:

17

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1121.94 ns

Nominal Turn On Time (ton):

223.8 ns

Maximum VCEsat:

2.3 V

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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