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NXH80B120H2Q0SGQ0BOOST

Onsemi

NXH80B120H2Q0SGQ0BOOST by Onsemi

NXH80B120H2Q0SGQ0BOOST by Onsemi is an N-CHANNEL IGBT with 2 elements, built-in diode, and thermistor. It has a max VCEsat of 2.5V and can handle up to 41A of collector current. Ideal for power control applications requiring high voltage (1200V) and power dissipation (103W).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,820 parts In-Stock

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Vyrian

USA . 757 parts In-Stock

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757

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SupplyDigital Components

Austria . 8,178 parts In-Stock

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TANS Electronics

Latvia . 6,858 parts In-Stock

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Problanco Electronics

Mexico . 5,478 parts In-Stock

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Kulean Microsystems

USA . 1,327 parts In-Stock

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Corphita

USA . 1,016 parts In-Stock

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Corohmni

South Africa . 205 parts In-Stock

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UHIMA Technologies

Türkiye . 197 parts In-Stock

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Overview

Experience unparalleled power control with the NXH80B120H2Q0SGQ0BOOST from Onsemi. As a leading manufacturer in the industry, Onsemi is known for delivering high-quality Insulated Gate Bipolar Transistors (IGBT) that excel in various applications. This N-CHANNEL transistor boasts a COMMON DRAIN configuration with 2 elements, built-in diode, and thermistor for seamless functionality. Whether you're looking to enhance your power control systems or optimize energy efficiency, this product offers unmatched performance with a maximum VCEsat of 2.5V and maximum collector-emitter voltage of 1200V. Discover the value and benefits of the NXH80B120H2Q0SGQ0BOOST today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making this product a good choice for power control applications.

Maximum VCEsat: 2.5 V

The low VCEsat value of 2.5 V indicates minimal saturation voltage drop, leading to reduced power losses and improved overall efficiency.

Maximum Power Dissipation: 103 W

With a high maximum power dissipation of 103 W, this IGBT can handle large amounts of power, making it suitable for high-power applications.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage of 1200 V allows this IGBT to withstand high voltage levels, making it suitable for a wide range of power control applications.

Maximum Collector Current (IC): 41 A

With a maximum collector current of 41 A, this IGBT can handle high current loads, making it suitable for power control applications that require handling large currents.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH80B120H2Q0SGQ0BOOST attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X22

No. of Elements:

2

No. of Terminals:

22

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

299 ns

Nominal Turn On Time (ton):

47 ns

Maximum VCEsat:

2.5 V

Trade Compliance

NXH80B120H2Q0SGQ0BOOST Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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