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NTJD4401NT2G

Onsemi

NTJD4401NT2G by Onsemi

NTJD4401NT2G by Onsemi is a N-CHANNEL FET with 2 elements, diode, and resistor for SWITCHING applications. Features include 0.63A max drain current, 0.375 ohm max on resistance, and 20V min breakdown voltage. Ideal for small outline packages requiring high power dissipation up to 0.55W at 150 °C.

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Vyrian

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AZTECH Wire

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TANS Electronics

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Problanco Electronics

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Kulean Microsystems

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SupplyDigital Components

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Overview

Looking for reliable and efficient small signal field effect transistors? Look no further than the NTJD4401NT2G by Onsemi. Known for their high-quality products, Onsemi delivers top-notch components that are perfect for switching applications. With a compact package style and maximum power dissipation of 0.55W, this N-channel transistor offers superior performance and reliability. Say goodbye to performance issues and hello to seamless operation with the NTJD4401NT2G. Trust Onsemi for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, making them efficient for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor offer added functionality and convenience, reducing the need for extra components in circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor is optimized for fast and efficient switching operations.

Surface Mount: YES

Surface mount capability enables easy and convenient installation on circuit boards, saving time and effort.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle relatively high voltage levels, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on circuit boards, ideal for compact electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and are easy to control, providing reliable performance in various applications.

Maximum Drain Current (Abs) (ID): 0.63 A

With a maximum drain current of 0.63A, this transistor can handle moderate current levels, suitable for many electronic circuits.

No. of Terminals: 6

Having 6 terminals allows for versatile connectivity options and enables more complex circuit designs.

Maximum Power Dissipation (Abs): 0.55 W

The maximum power dissipation of 0.55W ensures that the transistor can handle heat effectively, maintaining reliable operation even under high power conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient and suitable for compact electronic devices where size is a constraint.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making the transistor suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperature environments, ensuring stable performance in various conditions.

Transistor Element Material: SILICON

Silicon material provides good conductivity and reliability, ensuring consistent performance over the lifespan of the transistor.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance, ensuring secure connections in electronic circuits.

Maximum Drain-Source On Resistance: 0.375 ohm

With a low drain-source on resistance of 0.375 ohm, this transistor minimizes power loss and heat generation, improving overall efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly, maintaining the integrity of connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows for reliable soldering and ensures strong connections in electronic assemblies.

Maximum Feedback Capacitance (Crss): 5 pF

The low feedback capacitance of 5pF minimizes signal distortion and interference, ensuring accurate data transmission in electronic circuits.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4401NT2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.63 A

Maximum Drain Current (ID):

.63 A

Maximum Drain-Source On Resistance:

.375 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4401NT2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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