Loading...

NTB6448ANT4G

Onsemi

NTB6448ANT4G by Onsemi

NTB6448ANT4G by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 305A IDM. Ideal for applications requiring high power dissipation, such as motor control systems or power supplies. Features include built-in diode, 0.013 ohm RDS(on), and 175 °C max operating temp.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,130

-

-

-

-

Digiode

USA . 483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

483

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 943 parts In-Stock

1+ parts

$14.830

100+ parts

-

1k+ parts

-

10k+ parts

-

943

$14.830

-

-

-

TANS Electronics

Latvia . 7,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,630

-

-

-

-

Problanco Electronics

Mexico . 7,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,473

-

-

-

-

Kulean Microsystems

USA . 7,267 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,267

-

-

-

-

SupplyDigital Components

Austria . 6,576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,576

-

-

-

-

Corphita

USA . 2,167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,167

-

-

-

-

Corohmni

South Africa . 472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

472

-

-

-

-

UHIMA Technologies

Türkiye . 381 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

381

-

-

-

-

Overview

Enhance your power management solutions with the NTB6448ANT4G by Onsemi. Crafted with precision and expertise, this N-channel Power FET offers unparalleled quality and performance. Ideal for various applications, this single configuration transistor with built-in diode ensures efficiency and reliability. With a high breakdown voltage and low on-resistance, this FET delivers exceptional value and benefits to customers looking for superior power control. Trust in Onsemi's reputation for excellence and innovation, and experience the advantage of using the NTB6448ANT4G in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good insulation properties and can handle high temperatures, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and efficiency compared to P-channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can improve overall efficiency of the system.

Surface Mount: YES

Surface mount design offers easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, ensuring reliability in high voltage applications.

Maximum Pulsed Drain Current (IDM): 305 A

High maximum pulsed drain current allows the FET to handle large surge currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 188 W

With a high power dissipation rating, this FET can handle higher power levels without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can operate in harsh environments with elevated temperatures, making it versatile for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB6448ANT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

305 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NTB6448ANT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19