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FDB3632-F085

Onsemi

FDB3632-F085 by Onsemi

FDB3632-F085 by Onsemi is a power field effect transistor (FET) with a min DS breakdown voltage of 100V. It is an N-channel transistor with a max drain current of 12A and a max power dissipation of 310W. This transistor is commonly used for switching applications in various industries.

Median Price

$2.200

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 388 parts In-Stock

1+ parts

$2.200

100+ parts

$2.070

1k+ parts

$1.870

10k+ parts

-

388

$2.200

$2.070

$1.870

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Distributors (In-Stock)

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Flip Electronics

USA . 2,300 parts In-Stock

1+ parts

$1.972

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2,300

$1.972

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Digiode

USA . 1,937 parts In-Stock

1+ parts

$2.090

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1,937

$2.090

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Nova Conductors

Japan . 150 parts In-Stock

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$2.323

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150

$2.323

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IBS Electronics

USA . 24,800 parts In-Stock

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$1.768

10k+ parts

$1.742

24,800

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$1.768

$1.742

Chip Stock

USA . 5,670 parts In-Stock

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5,670

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Vyrian

USA . 3,075 parts In-Stock

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3,075

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Ashlea Components Ltd

UK . 101 parts In-Stock

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101

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NexGen Digital

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.789

100+ parts

$0.750

1k+ parts

$0.750

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-

1,000

$0.789

$0.750

$0.750

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Aztec Data Supply Inc.

USA . 3,514 parts In-Stock

1+ parts

$1.692

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3,514

$1.692

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Semicontronic

India . 776 parts In-Stock

1+ parts

$1.870

100+ parts

$1.823

1k+ parts

$1.814

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776

$1.870

$1.823

$1.814

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Ampacity Inc.

Singapore . 302 parts In-Stock

1+ parts

$1.870

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302

$1.870

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Corphita

USA . 1,376 parts In-Stock

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$1.980

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1,376

$1.980

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Corohmni

South Africa . 81 parts In-Stock

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$2.200

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81

$2.200

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Argo Parts USA

USA . 6,467 parts In-Stock

1+ parts

$2.323

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6,467

$2.323

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Continental Prestige Electronics

USA . 3,724 parts In-Stock

1+ parts

$2.323

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$2.277

3,724

$2.323

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$2.277

AZTECH Wire

Italy . 1,288 parts In-Stock

1+ parts

$13.827

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1,288

$13.827

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Kulean Microsystems

USA . 7,972 parts In-Stock

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7,972

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Problanco Electronics

Mexico . 6,875 parts In-Stock

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6,875

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SupplyDigital Components

Austria . 5,427 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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TANS Electronics

Latvia . 4,490 parts In-Stock

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Perfect Parts

USA . 2,591 parts In-Stock

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2,591

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Netroflash

USA . 2,000 parts In-Stock

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$2.277

1k+ parts

$2.207

10k+ parts

$2.160

2,000

-

$2.277

$2.207

$2.160

Lucentia Tech

USA . 1,000 parts In-Stock

1+ parts

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$5.840

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$5.840

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$5.840

1,000

-

$5.840

$5.840

$5.840

UHIMA Technologies

Türkiye . 929 parts In-Stock

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929

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Supply Digital

USA . 764 parts In-Stock

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764

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

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100+ parts

$5.840

1k+ parts

$5.840

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$5.840

500

-

$5.840

$5.840

$5.840

Overview

Discover the FDB3632-F085 by Onsemi, a high-quality Power Field Effect Transistor (FET) that offers exceptional performance for switching applications. With its N-CHANNEL polarity and SINGLE configuration featuring a built-in diode, this transistor stands out from the rest. Its compact RECTANGULAR shape and GULL WING terminals make it easy to install and operate. Boasting a minimum DS Breakdown Voltage of 100V and maximum Drain Current of 12A, this transistor delivers power and efficiency. Whether you're in automotive, industrial, or consumer electronics, the FDB3632-F085 is the perfect choice. Trust Onsemi, a renowned manufacturer known for their cutting-edge technology and reliability. Experience the value, benefits, and advantages this product brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material provides durability and heat resistance, making it suitable for various operating environments.

Polarity or Channel Type: N-CHANNEL

The N-Channel design ensures efficient conduction and improved power handling capabilities, making it an ideal choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

With a built-in diode, this product offers superior reverse voltage protection and simplifies circuit design, making it a convenient option for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this product provides fast and reliable switching performance, ensuring efficient power management and control.

Surface Mount: YES

The surface mount capability of this product enables easy and efficient soldering onto printed circuit boards, saving installation time and enhancing overall system compactness.

Minimum DS Breakdown Voltage: 100V

The minimum breakdown voltage of 100V ensures robustness and reliability, allowing the product to withstand high voltage loads without compromising performance.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard mounting techniques and facilitates easy integration into various electronic systems.

Terminal Form: GULL WING

The gull-wing terminal form simplifies soldering operations and provides secure connectivity, ensuring reliable electrical connections and reducing the risk of disconnection or failure.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode, this product offers excellent control and high current handling capabilities, making it suitable for power switching applications.

No. of Elements: 1

With a single element, this product provides simplicity in circuit design and offers a compact solution for space-constrained applications.

Avalanche Energy Rating (EAS): 338mJ

The high avalanche energy rating of 338mJ ensures the product can handle momentary high-energy pulses without damage, providing enhanced durability and protection for the system.

Maximum Drain Current (Abs) (ID): 12A

The maximum drain current of 12A allows the product to handle high-power loads efficiently, ensuring optimal performance and reliability.

No. of Terminals: 2

With two terminals, this product offers straightforward installation and connection, making it easy to integrate into existing circuits or systems.

Maximum Power Dissipation (Abs): 310W

The high maximum power dissipation capability of 310W ensures efficient heat dissipation, allowing the product to handle high-power applications reliably.

Package Style (Meter): SMALL OUTLINE

With a small outline package style, this product offers excellent space utilization and compatibility with compact designs, making it suitable for miniaturized electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology, this product provides superior performance, high switching speeds, and low power consumption, making it an excellent choice for efficient power management.

Maximum Operating Temperature: 175 °C

The maximum operating temperature of 175°C ensures reliable performance even in challenging thermal conditions, making this product suitable for various environments.

Transistor Element Material: SILICON

The silicon transistor element material guarantees excellent electrical properties, reliability, and stability, making it a preferred choice for power field effect transistors.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides exceptional solderability, corrosion resistance, and ensures reliable electrical connections, making it ideal for long-lasting and robust applications.

Maximum Drain-Source On Resistance: 0.009 ohm

The low drain-source on resistance of 0.009 ohm minimizes power losses and improves efficiency, making this product suitable for high-performance applications.

Terminal Position: SINGLE

With a single terminal position, this product simplifies installation and connection, ensuring ease of use and compatibility with various system designs.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level of 1 ensures the product's resistance to moisture and humidity, enhancing its reliability and enabling it to withstand a wide range of operating conditions.

Case Connection: DRAIN

The case connection on the drain enhances thermal dissipation and provides effective heat management, ensuring reliable and stable operation.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product can withstand soldering processes without compromising performance or reliability.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures efficient soldering and proper bonding, ensuring secure and durable connections.

Reference Standard: AEC-Q101

Complying with the AEC-Q101 industry standard, this product meets stringent automotive requirements, ensuring high reliability and performance in automotive and other demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) FDB3632-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

338 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB3632-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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