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IRF7304TRPBF

Infineon Technologies

IRF7304TRPBF by Infineon Technologies

IRF7304TRPBF by Infineon Technologies is a P-CHANNEL FET with 20V DS Breakdown Voltage and 3.6A ID. It features a built-in diode, 0.09 ohm RDS(on), and operates in enhancement mode. Ideal for power management applications requiring high drain current capabilities in compact designs.

Median Price

$0.793

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 2,000 parts In-Stock

1+ parts

$0.793

100+ parts

$0.753

1k+ parts

$0.753

10k+ parts

-

2,000

$0.793

$0.753

$0.753

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.733

100+ parts

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10

$0.733

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Digiode

USA . 598 parts In-Stock

1+ parts

$0.753

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598

$0.753

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TEDSS.com

USA . 450 parts In-Stock

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$1.160

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$0.460

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450

$1.160

$0.460

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Vyrian

USA . 1,639 parts In-Stock

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1,639

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LIBRA Elektronik GmbH

Germany . 1,249 parts In-Stock

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Inventory MP

USA . 103 parts In-Stock

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Bristol Electronics

USA . 103 parts In-Stock

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Prism Electronics

USA . 85 parts In-Stock

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NexGen Digital

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 74 parts In-Stock

1+ parts

$0.439

100+ parts

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74

$0.439

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Continental Prestige Electronics

USA . 5,960 parts In-Stock

1+ parts

$0.440

100+ parts

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$0.432

5,960

$0.440

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-

$0.432

Argo Parts USA

USA . 2,489 parts In-Stock

1+ parts

$0.440

100+ parts

-

1k+ parts

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$0.427

2,489

$0.440

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-

$0.427

Ampacity Inc.

Singapore . 1,918 parts In-Stock

1+ parts

$0.670

100+ parts

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1,918

$0.670

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Semicontronic

India . 1,700 parts In-Stock

1+ parts

$0.670

100+ parts

$0.653

1k+ parts

$0.650

10k+ parts

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1,700

$0.670

$0.653

$0.650

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Corphita

USA . 142 parts In-Stock

1+ parts

$0.714

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142

$0.714

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$0.793

100+ parts

$0.753

1k+ parts

$0.753

10k+ parts

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2,000

$0.793

$0.753

$0.753

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Aztec Data Supply Inc.

USA . 4,411 parts In-Stock

1+ parts

$0.795

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4,411

$0.795

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Modulus Dynamics

Lithuania . 13,133 parts In-Stock

1+ parts

$1.651

100+ parts

$1.585

1k+ parts

$1.519

10k+ parts

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13,133

$1.651

$1.585

$1.519

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Component Stockers USA

USA . 35,000 parts In-Stock

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$3.450

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$3.450

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Perfect Parts

USA . 67,540 parts In-Stock

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Kepictronics

USA . 14,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,053 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Microchip USA

USA . 8,084 parts In-Stock

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Futuretech Components

Singapore . 8,000 parts In-Stock

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Lixinc

USA . 6,241 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,937 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,291 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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S.R.D Solutions

India . 1,800 parts In-Stock

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GreenTree Electronics

Israel . 164 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

1+ parts

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$0.719

1k+ parts

$0.697

10k+ parts

$0.682

100

-

$0.719

$0.697

$0.682

Overview

Unleash the power of innovation with the IRF7304TRPBF by Infineon Technologies. Crafted with precision and expertise, this P-CHANNEL power FET offers unparalleled performance and reliability. Whether you're designing cutting-edge electronics or enhancing existing systems, this transistor's built-in diode and enhancement mode operation provide seamless integration and optimal efficiency. Elevate your projects with the quality and value that only Infineon Technologies can deliver. Upgrade to the IRF7304TRPBF and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components, making it a reliable choice for various applications.

Polarity or Channel Type: P-CHANNEL

P-Channel FETs offer lower conduction losses and higher efficiency, making them suitable for applications requiring high performance and power savings.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with 2 elements and a built-in diode simplifies circuit design and allows for more flexibility in various applications.

Surface Mount: YES

The surface mount feature enables easy and convenient installation on PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20V ensures safe operation within the specified limits, making it suitable for low voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on PCBs and ensures uniform heat dissipation, contributing to the overall performance of the product.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering, enhancing the reliability of the product in demanding operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and high efficiency, making them ideal for power management applications that require quick response times.

No. of Elements: 2

Having 2 elements allows for increased functionality and versatility in circuit design, making the product suitable for a wide range of applications.

No. of Terminals: 8

The 8 terminals provide multiple connection points and enable complex circuit configurations, offering flexibility and customization options to suit specific application requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs and ensures efficient heat dissipation, making it a practical choice for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high input impedance and low power consumption, providing energy-efficient performance suitable for battery-powered devices.

Transistor Element Material: SILICON

Silicon material in the transistor element ensures reliable and consistent performance over a wide temperature range, making it a durable choice for long-term use.

Maximum Drain Current (ID): 3.6 A

The high maximum drain current rating of 3.6A allows for handling higher power levels, making it suitable for applications that require robust and efficient power management.

Maximum Drain-Source On Resistance: 0.09 ohm

The low drain-source on resistance of 0.09 ohm minimizes power losses and improves efficiency, making it an optimal choice for high-current applications that demand low voltage drops.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit connections and allows for easy integration into various circuit layouts, offering versatility and ease of implementation.

Technical Specifications

Power Field Effect Transistors (FET) IRF7304TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

3.6 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

IRF7304TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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