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NVMFS5113PLT1G

Onsemi

NVMFS5113PLT1G by Onsemi

NVMFS5113PLT1G by Onsemi is a P-CHANNEL power FET with a min DS breakdown voltage of 60V. It has a max pulsed drain current of 415A and an avalanche energy rating of 315mJ. This transistor is commonly used in automotive applications due to its AEC-Q101 reference standard and moisture sensitivity level of MSL1.

Median Price

$1.640

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Newark

USA . 9 parts In-Stock

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$0.459

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Element14

Singapore . 7,054 parts In-Stock

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DigiKey

USA . 3,503 parts In-Stock

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$3.540

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$1.612

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Mouser Electronics

USA . 8,273 parts In-Stock

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Rochester

USA . 47,410 parts In-Stock

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Avnet

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Verical

USA . 26,410 parts In-Stock

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Future Electronics

Canada . 24,000 parts In-Stock

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Farnell

UK . 2,693 parts In-Stock

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$0.980

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EBV Elektronik

Germany . 1,500 parts In-Stock

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Master Electronics

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Distributors (In-Stock)

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Digiode

USA . 1,884 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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TME

Poland . 1,369 parts In-Stock

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Kruse Electronics AG

Switzerland . 2,205,000 parts In-Stock

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IBS Electronics

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Chip Stock

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NAC Semi

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Vyrian

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A2Z Electronics, Inc.

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Speed Components Ltd

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Semicontronic

India . 14,246 parts In-Stock

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$0.920

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$0.897

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$0.892

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Ampacity Inc.

Singapore . 14,166 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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Corphita

USA . 1,855 parts In-Stock

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Aztec Data Supply Inc.

USA . 19,723 parts In-Stock

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$1.410

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Continental Prestige Electronics

USA . 748 parts In-Stock

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$1.435

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Argo Parts USA

USA . 297 parts In-Stock

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Modulus Dynamics

Lithuania . 25,390 parts In-Stock

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Advanced Electronics

New Zealand . 61 parts In-Stock

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$1.667

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$1.583

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$1.583

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61

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Netroflash

USA . 1,000 parts In-Stock

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$1.766

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$1.730

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Microchip USA

USA . 4,501 parts In-Stock

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GlobX GmbH

Germany . 2,221,314 parts In-Stock

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iodParts Technologies Inc.

India . 70,841 parts In-Stock

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Lixinc

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SupplyDigital Components

Austria . 5,955 parts In-Stock

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Problanco Electronics

Mexico . 3,680 parts In-Stock

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Kulean Microsystems

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,314 parts In-Stock

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Robosynatics

Brazil . 1,443 parts In-Stock

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Lucentia Tech

USA . 1,443 parts In-Stock

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Infinite Electronics LLP (Excess)

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UHIMA Technologies

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Overview

Experience the power and quality of Onsemi's NVMFS5113PLT1G. This P-CHANNEL Power Field Effect Transistor is a game-changer in the market, offering incredible benefits and advantages to customers. With its single configuration and built-in diode, this transistor provides enhanced performance and reliability. Whether you're working on automotive applications or other high-power projects, the NVMFS5113PLT1G has got you covered with its impressive 60V minimum DS breakdown voltage and maximum pulsed drain current of 415A. Trust Onsemi for top-notch quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

makes this product durable and resistant to external damage.

Polarity or Channel Type: P-CHANNEL

allows for efficient control of current flow, enhancing the performance of the device.

Configuration: SINGLE WITH BUILT-IN DIODE

provides added convenience and versatility for circuit designs where a diode is required.

Surface Mount: YES

enables easy and efficient PCB assembly, saving time and effort during manufacturing.

Minimum DS Breakdown Voltage: 60 V

ensures the product can handle high voltage applications reliably and safely.

Package Shape: RECTANGULAR

allows for easy integration into various circuit layouts, optimizing space utilization.

Terminal Form: FLAT

provides a secure and stable connection, minimizing the risk of intermittent contacts.

Operating Mode: ENHANCEMENT MODE

enables precise control of the transistor's conductivity, enhancing overall circuit performance.

No. of Elements: 1

indicates a single active component, simplifying circuit design and reducing complexity.

Maximum Pulsed Drain Current (IDM): 415 A

makes this product suitable for high-power applications where transient load demands are significant.

Avalanche Energy Rating (EAS): 315 mJ

ensures the device can withstand high-energy transients, improving overall reliability.

No. of Terminals: 5

provides ample connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

allows for space-saving PCB layouts, especially in compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

ensures excellent switching characteristics and minimal power loss.

Transistor Element Material: SILICON

provides high temperature tolerance and robustness for reliable operation.

Terminal Finish: Matte Tin (Sn) - annealed

offers corrosion resistance and strong solder joints, enhancing long-term reliability.

Maximum Drain-Source On Resistance: 0.014 ohm

ensures low power dissipation and efficient performance.

Terminal Position: DUAL

provides flexibility in PCB layout and facilitates easier routing of connections.

Moisture Sensitivity Level (MSL): 1

indicates low moisture absorption capabilities, ensuring the product's reliability in humid environments.

Case Connection: DRAIN

simplifies circuit layout and connection setup.

Maximum Time At Peak Reflow Temperature (s): 30

provides a safe and efficient reflow soldering process during manufacturing.

Peak Reflow Temperature °C: 260

ensures reliable soldering without compromising the integrity of the device.

Reference Standard: AEC-Q101

signifies compliance with automotive-grade quality and reliability standards, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5113PLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

315 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

415 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5113PLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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