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NVMFD5C650NLT1G

Onsemi

NVMFD5C650NLT1G by Onsemi

NVMFD5C650NLT1G by Onsemi is an N-channel Power FET with 60V DS breakdown voltage and 502A max pulsed drain current. It features a separate configuration with built-in diode, suitable for applications requiring high power dissipation such as automotive electronics. Operating in enhancement mode, it offers low on-resistance of 0.0058 ohm and can withstand temperatures from -55 to 175°C.

Median Price

$6.160

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 5,691 parts In-Stock

1+ parts

$3.260

100+ parts

$1.870

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-

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5,691

$3.260

$1.870

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DigiKey

USA . 1,925 parts In-Stock

1+ parts

$5.610

100+ parts

$2.685

1k+ parts

$2.613

10k+ parts

$2.135

1,925

$5.610

$2.685

$2.613

$2.135

Newark

USA . 5,200 parts In-Stock

1+ parts

$6.160

100+ parts

$3.810

1k+ parts

$2.820

10k+ parts

-

5,200

$6.160

$3.810

$2.820

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Mouser Electronics

USA . 17,621 parts In-Stock

1+ parts

$6.430

100+ parts

$3.100

1k+ parts

$2.440

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-

17,621

$6.430

$3.100

$2.440

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Element14

Singapore . 5,691 parts In-Stock

1+ parts

$6.520

100+ parts

$4.190

1k+ parts

$3.370

10k+ parts

$3.080

5,691

$6.520

$4.190

$3.370

$3.080

Chip1Stop

Japan . 1,300 parts In-Stock

1+ parts

$15.600

100+ parts

$6.410

1k+ parts

$4.140

10k+ parts

-

1,300

$15.600

$6.410

$4.140

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Verical

USA . 1,500 parts In-Stock

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-

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$2.249

1,500

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$2.249

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.874

100+ parts

-

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500

$2.874

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Digiode

USA . 883 parts In-Stock

1+ parts

$3.097

100+ parts

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883

$3.097

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Chip Stock

USA . 3,257 parts In-Stock

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3,257

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Vyrian

USA . 2,896 parts In-Stock

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Connector Distribution Corp

USA . 1,006 parts In-Stock

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1,006

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Right Parts Inc.

USA . 1,006 parts In-Stock

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1,006

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 124 parts In-Stock

1+ parts

$1.240

100+ parts

-

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124

$1.240

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Ampacity Inc.

Singapore . 3,051 parts In-Stock

1+ parts

$1.920

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3,051

$1.920

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Semicontronic

India . 2,660 parts In-Stock

1+ parts

$1.920

100+ parts

$1.872

1k+ parts

$1.862

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2,660

$1.920

$1.872

$1.862

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Corohmni

South Africa . 279 parts In-Stock

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$2.262

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279

$2.262

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Continental Prestige Electronics

USA . 6,352 parts In-Stock

1+ parts

$2.628

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$2.575

6,352

$2.628

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$2.575

Argo Parts USA

USA . 3,760 parts In-Stock

1+ parts

$2.628

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3,760

$2.628

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Bastille Electronics

Australia . 45 parts In-Stock

1+ parts

$2.874

100+ parts

$2.730

1k+ parts

$2.594

10k+ parts

$2.558

45

$2.874

$2.730

$2.594

$2.558

Corphita

USA . 176 parts In-Stock

1+ parts

$2.934

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176

$2.934

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Kulean Microsystems

USA . 8,335 parts In-Stock

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Robosynatics

Brazil . 8,101 parts In-Stock

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Lucentia Tech

USA . 8,101 parts In-Stock

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$0.555

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$0.543

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$0.543

8,101

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$0.555

$0.543

$0.543

iodParts Technologies Inc.

India . 5,430 parts In-Stock

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TANS Electronics

Latvia . 5,285 parts In-Stock

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Problanco Electronics

Mexico . 3,699 parts In-Stock

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SupplyDigital Components

Austria . 3,176 parts In-Stock

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Microchip USA

USA . 1,995 parts In-Stock

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UHIMA Technologies

Türkiye . 205 parts In-Stock

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Overview

Elevate your power management systems with the NVMFD5C650NLT1G by Onsemi. This Power FET offers reliable performance and durability thanks to Onsemi's reputation for top-notch quality. Perfect for a wide range of applications, this N-Channel transistor provides enhanced efficiency and control. With a high breakdown voltage and dual elements with built-in diode configuration, customers can trust in the value and benefits that this product brings to their projects. Experience seamless operation and improved functionality with the NVMFD5C650NLT1G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps protect the internal components of the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better conductivity and efficiency compared to P-channel transistors, making this product a good choice for high-performance applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for more flexibility in circuit design and provides additional functionality with the built-in diode, making it a versatile choice for different uses.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the circuit design.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation rating, this transistor can handle demanding applications without overheating or failing, ensuring reliable performance.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5C650NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

186 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

111 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

502 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFD5C650NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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