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NVMFS6H818NWFT1G

Onsemi

NVMFS6H818NWFT1G by Onsemi

NVMFS6H818NWFT1G by Onsemi is a Power FET with 80V DS Breakdown Voltage, 900A IDM, and 0.0037 ohm RDS(on). It is an N-CHANNEL MOSFET in PLASTIC/EPOXY package used for automotive applications due to AEC-Q101 compliance.

Median Price

$2.794

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,500 parts In-Stock

1+ parts

$2.166

100+ parts

$1.578

1k+ parts

$1.450

10k+ parts

-

1,500

$2.166

$1.578

$1.450

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Farnell

UK . 1,450 parts In-Stock

1+ parts

$2.640

100+ parts

$1.510

1k+ parts

$1.200

10k+ parts

$1.150

1,450

$2.640

$1.510

$1.200

$1.150

Arrow

USA . 1,500 parts In-Stock

1+ parts

$2.898

100+ parts

$1.926

1k+ parts

$1.408

10k+ parts

$1.408

1,500

$2.898

$1.926

$1.408

$1.408

DigiKey

USA . 1,453 parts In-Stock

1+ parts

$4.040

100+ parts

$1.866

1k+ parts

$1.680

10k+ parts

$1.372

1,453

$4.040

$1.866

$1.680

$1.372

Mouser Electronics

USA . 445 parts In-Stock

1+ parts

$4.040

100+ parts

$1.870

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$1.570

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445

$4.040

$1.870

$1.570

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Newark

USA . 140 parts In-Stock

1+ parts

$4.460

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$2.470

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140

$4.460

$2.470

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Verical

USA . 1,500 parts In-Stock

1+ parts

-

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$1.926

1k+ parts

$1.408

10k+ parts

$1.408

1,500

-

$1.926

$1.408

$1.408

Element14

Singapore . 1,450 parts In-Stock

1+ parts

-

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$2.690

1k+ parts

$2.160

10k+ parts

$1.960

1,450

-

$2.690

$2.160

$1.960

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.788

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-

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50

$1.788

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Digiode

USA . 697 parts In-Stock

1+ parts

$2.058

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$2.058

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Vyrian

USA . 1,814 parts In-Stock

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1,814

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 343 parts In-Stock

1+ parts

$0.370

100+ parts

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343

$0.370

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Semicontronic

India . 1,628 parts In-Stock

1+ parts

$1.160

100+ parts

$1.131

1k+ parts

$1.125

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1,628

$1.160

$1.131

$1.125

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Ampacity Inc.

Singapore . 1,420 parts In-Stock

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$1.160

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$1.160

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Corohmni

South Africa . 443 parts In-Stock

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$1.370

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443

$1.370

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Continental Prestige Electronics

USA . 3,393 parts In-Stock

1+ parts

$1.788

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$1.752

3,393

$1.788

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$1.752

Argo Parts USA

USA . 2,409 parts In-Stock

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$1.788

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2,409

$1.788

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.788

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$1.752

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2,000

$1.788

$1.752

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Corphita

USA . 2,341 parts In-Stock

1+ parts

$1.949

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2,341

$1.949

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Microchip USA

USA . 9,165 parts In-Stock

1+ parts

$10.589

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9,165

$10.589

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iodParts Technologies Inc.

India . 802,736 parts In-Stock

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802,736

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Problanco Electronics

Mexico . 5,096 parts In-Stock

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SupplyDigital Components

Austria . 4,689 parts In-Stock

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TANS Electronics

Latvia . 1,484 parts In-Stock

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UHIMA Technologies

Türkiye . 973 parts In-Stock

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973

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Kulean Microsystems

USA . 482 parts In-Stock

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482

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Overview

Discover the NVMFS6H818NWFT1G by Onsemi, a powerful N-CHANNEL Power Field Effect Transistor with a built-in diode that offers top-notch quality and reliability. Ideal for various applications, this FET provides exceptional performance and efficiency. With a maximum pulsed drain current of 900 A and a low on-resistance of 0.0037 ohm, this transistor delivers high power dissipation and robustness. Whether you're looking to enhance your electronic designs or optimize power management systems, the NVMFS6H818NWFT1G is the perfect solution that combines superior technology with lasting value. Elevate your projects with this innovative component from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, making the product long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow in the specified direction, enhancing the performance of the transistor.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, reducing component count and saving space.

Minimum DS Breakdown Voltage: 80 V

Can handle high voltages effectively, making it suitable for various applications where voltage fluctuation may occur.

Surface Mount: YES

Enables easy and secure installation on circuit boards, increasing efficiency during assembly.

Operating Mode: ENHANCEMENT MODE

Enhances control over the transistor's conductivity, improving overall performance in different operational conditions.

Maximum Pulsed Drain Current (IDM): 900 A

Capable of handling high peak currents, ensuring reliable operation even under demanding conditions.

Avalanche Energy Rating (EAS): 731 mJ

Can withstand high energy levels before breakdown, making it suitable for applications with potential voltage spikes.

Maximum Power Dissipation (Abs): 136 W

Efficiently dissipates heat generated during operation, preventing overheating and ensuring long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high switching speeds and low power consumption, making it ideal for applications requiring fast response times.

Maximum Operating Temperature: 175 °C

Can operate effectively in high-temperature environments, expanding the range of potential applications.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a reliable and corrosion-resistant finish for stable electrical connections, ensuring long-term performance.

Maximum Drain Current (ID): 20 A

Capable of handling substantial current loads, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.0037 ohm

Minimizes power loss and improves efficiency by offering low resistance during operation.

Case Connection: DRAIN

Allows for easy connection and integration into existing circuit designs, enhancing overall usability.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during assembly, reducing the risk of component failure.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the soldering process, ensuring proper bonding to the circuit board.

Reference Standard: AEC-Q101

Meets industry standards for quality and reliability, ensuring consistent performance in demanding automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6H818NWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

731 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.0037 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6H818NWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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