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IRF540NLPBF

Infineon Technologies

IRF540NLPBF by Infineon Technologies

Infineon's IRF540NLPBF is a N-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features 110A IDM, 185mJ EAS, and 0.044 ohm RDS(on). With a max power dissipation of 130W and operating temperature of 175°C, it offers reliable performance in various electronic systems.

Median Price

$1.182

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 242 parts In-Stock

1+ parts

$1.450

100+ parts

$1.040

1k+ parts

$0.887

10k+ parts

$0.869

242

$1.450

$1.040

$0.887

$0.869

Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$1.918

100+ parts

$1.822

1k+ parts

$1.822

10k+ parts

-

5,000

$1.918

$1.822

$1.822

-

Rochester

USA . 21,716 parts In-Stock

1+ parts

-

100+ parts

$0.882

1k+ parts

$0.732

10k+ parts

$0.652

21,716

-

$0.882

$0.732

$0.652

Verical

USA . 21,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.915

10k+ parts

$0.816

21,716

-

-

$0.915

$0.816

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 723 parts In-Stock

1+ parts

$0.687

100+ parts

-

1k+ parts

-

10k+ parts

-

723

$0.687

-

-

-

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$0.873

100+ parts

-

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-

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-

30

$0.873

-

-

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Vyrian

USA . 1,946 parts In-Stock

1+ parts

-

100+ parts

-

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-

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1,946

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,970 parts In-Stock

1+ parts

$0.610

100+ parts

$0.595

1k+ parts

$0.592

10k+ parts

-

1,970

$0.610

$0.595

$0.592

-

Ampacity Inc.

Singapore . 1,754 parts In-Stock

1+ parts

$0.610

100+ parts

-

1k+ parts

-

10k+ parts

-

1,754

$0.610

-

-

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Corphita

USA . 595 parts In-Stock

1+ parts

$0.651

100+ parts

-

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-

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-

595

$0.651

-

-

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Argo Parts USA

USA . 2,684 parts In-Stock

1+ parts

$0.755

100+ parts

-

1k+ parts

-

10k+ parts

-

2,684

$0.755

-

-

-

Aztec Data Supply Inc.

USA . 3,708 parts In-Stock

1+ parts

$0.908

100+ parts

-

1k+ parts

-

10k+ parts

-

3,708

$0.908

-

-

-

Continental Prestige Electronics

USA . 410 parts In-Stock

1+ parts

$1.460

100+ parts

$0.915

1k+ parts

-

10k+ parts

-

410

$1.460

$0.915

-

-

Modulus Dynamics

Lithuania . 18,835 parts In-Stock

1+ parts

$1.809

100+ parts

$1.737

1k+ parts

$1.664

10k+ parts

-

18,835

$1.809

$1.737

$1.664

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.918

100+ parts

$1.822

1k+ parts

$1.822

10k+ parts

-

5,000

$1.918

$1.822

$1.822

-

Corohmni

South Africa . 251 parts In-Stock

1+ parts

$1.945

100+ parts

-

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-

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251

$1.945

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QUARKTWIN TECHNOLOGY LTD

USA . 28,580 parts In-Stock

1+ parts

-

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28,580

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Microchip USA

USA . 9,293 parts In-Stock

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9,293

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A-Z Elektronik GmbH

Germany . 6,311 parts In-Stock

1+ parts

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6,311

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Alle Elektronik GmbH

Germany . 4,207 parts In-Stock

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4,207

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Perfect Parts

USA . 1,896 parts In-Stock

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1,896

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Robosynatics

Brazil . 200 parts In-Stock

1+ parts

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100+ parts

$11.288

1k+ parts

$11.288

10k+ parts

$11.288

200

-

$11.288

$11.288

$11.288

Lucentia Tech

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$11.288

1k+ parts

$11.288

10k+ parts

$11.288

200

-

$11.288

$11.288

$11.288

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.856

1k+ parts

$0.830

10k+ parts

$0.812

50

-

$0.856

$0.830

$0.812

Overview

Discover the Infineon Technologies IRF540NLPBF, a top-of-the-line Power Field Effect Transistor designed for high-performance switching applications. Manufactured by Infineon Technologies, known for their superior quality and reliability, this N-CHANNEL transistor offers customers unmatched value with its built-in diode, robust construction, and efficient operation. Ideal for a wide range of electronic projects, the IRF540NLPBF ensures optimal performance and durability, making it the perfect choice for any application requiring enhanced power management capabilities. Experience the difference with the Infineon Technologies IRF540NLPBF today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics such as lower on-resistance and higher current carrying capabilities compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, enhancing the reliability and efficiency of the switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation, making it ideal for efficient power management.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage of 100V ensures that the FET can handle higher voltages without breakdown, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation in various electronic devices, providing convenience for integration.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers a secure and reliable connection to the circuit board, ensuring stable performance in harsh operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage to turn on, offering better control and efficiency in switching operations.

Maximum Pulsed Drain Current (IDM): 110 A

The high pulsed drain current rating of 110A allows for handling sudden surges of current without damage, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 185 mJ

The high avalanche energy rating of 185mJ indicates the ability of the FET to withstand transient voltage spikes, ensuring reliable operation in tough conditions.

Maximum Drain Current (Abs) (ID): 33 A

The maximum drain current rating of 33A ensures that the FET can handle high currents continuously, making it suitable for power management applications.

No. of Terminals: 3

The 3-terminal configuration provides easy connectivity and control in the circuit, offering flexibility in circuit design.

Maximum Power Dissipation (Abs): 130 W

The high power dissipation rating of 130W allows the FET to handle large power loads efficiently, ensuring stable performance in demanding applications.

Package Style (Meter): IN-LINE

The in-line package style offers a compact and space-saving design, making it suitable for applications where size is a constraint.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high-speed switching and low power consumption, making the FET an energy-efficient choice for electronic devices.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C ensures reliable operation in high-temperature environments, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, ensuring stable operation over a wide range of operating conditions.

Terminal Finish: MATTE TIN OVER NICKEL

The matte tin over nickel terminal finish provides corrosion resistance and a reliable connection, ensuring long-term performance in various environmental conditions.

Maximum Drain Current (ID): 33 A

The maximum drain current rating of 33A ensures stable performance under high current loads, making it suitable for power management applications.

Maximum Drain-Source On Resistance: 0.044 ohm

The low on-resistance of 0.044 ohm minimizes power losses and heat generation, ensuring efficient power conversion in the circuit.

Terminal Position: SINGLE

The single terminal position simplifies the connection and control of the FET in the circuit, offering ease of use and installation.

Case Connection: DRAIN

The drain case connection allows for easy thermal management and heat dissipation, ensuring optimal performance in high-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable solder joints and proper thermal bonding during the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and mounting of the FET, ensuring reliable performance in the final product.

Technical Specifications

Power Field Effect Transistors (FET) IRF540NLPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

185 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

33 A

Maximum Drain Current (ID):

33 A

Maximum Drain-Source On Resistance:

.044 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

110 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF540NLPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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