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NVMFS3D6N10MCLT1G

Onsemi

NVMFS3D6N10MCLT1G by Onsemi

NVMFS3D6N10MCLT1G by Onsemi is a N-CHANNEL FET with 100V DS Breakdown Voltage, 888A IDM, and 0.0058 ohm RDS(ON). It is used in power applications requiring high drain current handling capabilities.

Median Price

$4.820

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 797 parts In-Stock

1+ parts

$4.820

100+ parts

$2.730

1k+ parts

$2.190

10k+ parts

-

797

$4.820

$2.730

$2.190

-

Chip1Stop

Japan . 618 parts In-Stock

1+ parts

$10.400

100+ parts

$4.490

1k+ parts

$3.280

10k+ parts

-

618

$10.400

$4.490

$3.280

-

Farnell

UK . 1,355 parts In-Stock

1+ parts

-

100+ parts

$1.480

1k+ parts

$1.300

10k+ parts

-

1,355

-

$1.480

$1.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.107

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.107

-

-

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Digiode

USA . 1,253 parts In-Stock

1+ parts

$3.078

100+ parts

-

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1,253

$3.078

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-

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Chip Stock

USA . 42,000 parts In-Stock

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-

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42,000

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-

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Cyclops Electronics Ltd

UK . 500 parts In-Stock

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500

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Vyrian

USA . 397 parts In-Stock

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-

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397

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,854 parts In-Stock

1+ parts

$0.527

100+ parts

$0.527

1k+ parts

$0.527

10k+ parts

-

4,854

$0.527

$0.527

$0.527

-

Ampacity Inc.

Singapore . 611 parts In-Stock

1+ parts

$1.260

100+ parts

-

1k+ parts

-

10k+ parts

-

611

$1.260

-

-

-

Semicontronic

India . 502 parts In-Stock

1+ parts

$1.260

100+ parts

$1.228

1k+ parts

$1.222

10k+ parts

-

502

$1.260

$1.228

$1.222

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Corohmni

South Africa . 255 parts In-Stock

1+ parts

$1.710

100+ parts

-

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-

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255

$1.710

-

-

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Aztec Data Supply Inc.

USA . 1,684 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

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1,684

$1.850

-

-

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Argo Parts USA

USA . 2,333 parts In-Stock

1+ parts

$2.007

100+ parts

-

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2,333

$2.007

-

-

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Corphita

USA . 1,963 parts In-Stock

1+ parts

$2.916

100+ parts

-

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1,963

$2.916

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Microchip USA

USA . 8,254 parts In-Stock

1+ parts

$11.716

100+ parts

-

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8,254

$11.716

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Kulean Microsystems

USA . 6,989 parts In-Stock

1+ parts

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6,989

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Problanco Electronics

Mexico . 5,890 parts In-Stock

1+ parts

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5,890

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TANS Electronics

Latvia . 4,518 parts In-Stock

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4,518

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SupplyDigital Components

Austria . 4,005 parts In-Stock

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4,005

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Continental Prestige Electronics

USA . 2,926 parts In-Stock

1+ parts

-

100+ parts

$2.050

1k+ parts

$1.470

10k+ parts

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2,926

-

$2.050

$1.470

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Formix International (Excess)

India . 2,630 parts In-Stock

1+ parts

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2,630

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Infinite Electronics LLP (Excess)

. 1,323 parts In-Stock

1+ parts

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1,323

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Futuretech Components

Singapore . 871 parts In-Stock

1+ parts

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871

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UHIMA Technologies

Türkiye . 796 parts In-Stock

1+ parts

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796

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.065

1k+ parts

$2.002

10k+ parts

$1.960

500

-

$2.065

$2.002

$1.960

Overview

Experience unparalleled power and efficiency with the NVMFS3D6N10MCLT1G by Onsemi, a top-tier manufacturer known for cutting-edge technology and superior quality. This Power Field Effect Transistor (FET) is designed for high-performance applications, offering customers reliability, durability, and exceptional value. With a range of features including a built-in diode, N-channel configuration, and small outline package style, this transistor ensures optimal performance in various operating conditions. Trust Onsemi to deliver excellence in every aspect, from design to functionality, making the NVMFS3D6N10MCLT1G the ideal choice for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON resistance, making them efficient for high current applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for convenient reverse polarity protection and helps in minimizing external components in the circuit design.

Surface Mount: YES

Surface mount technology makes the FET easy to install on PCBs, saving space and enabling automated manufacturing processes.

Minimum DS Breakdown Voltage: 100 V

High breakdown voltage ensures reliable performance and protection against voltage spikes in the circuit.

Maximum Pulsed Drain Current (IDM): 888 A

High pulsed drain current capability allows for handling short-duration high current loads effectively.

Maximum Power Dissipation (Abs): 139 W

High power dissipation rating indicates the FET can handle high-power applications without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range enables the FET to function reliably in various environmental conditions.

Maximum Drain-Source On Resistance: 0.0058 ohm

Low ON resistance results in minimal power loss and high efficiency in the circuit.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures that the FET meets automotive-grade reliability and quality requirements.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS3D6N10MCLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

739 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

132 A

Maximum Drain Current (ID):

132 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

29 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

888 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS3D6N10MCLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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