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NVMFD5C446NLT1G

Onsemi

NVMFD5C446NLT1G by Onsemi

NVMFD5C446NLT1G by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS Breakdown Voltage, and 644A Max Pulsed Drain Current. Ideal for automotive applications due to AEC-Q101 standard compliance and 175°C Max Operating Temp.

Median Price

$2.760

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 4,500 parts In-Stock

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$2.170

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$2.170

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Arrow

USA . 13,500 parts In-Stock

1+ parts

$2.760

100+ parts

$1.937

1k+ parts

$1.721

10k+ parts

$1.671

13,500

$2.760

$1.937

$1.721

$1.671

Newark

USA . 1,500 parts In-Stock

1+ parts

$5.390

100+ parts

$2.560

1k+ parts

$2.450

10k+ parts

-

1,500

$5.390

$2.560

$2.450

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Mouser Electronics

USA . 1,583 parts In-Stock

1+ parts

$5.600

100+ parts

$2.660

1k+ parts

$2.230

10k+ parts

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1,583

$5.600

$2.660

$2.230

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DigiKey

USA . 1,284 parts In-Stock

1+ parts

$5.600

100+ parts

$2.659

1k+ parts

$2.380

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1,284

$5.600

$2.659

$2.380

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Chip1Stop

Japan . 6,000 parts In-Stock

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$2.030

6,000

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$2.030

Element14

Singapore . 3,382 parts In-Stock

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$3.410

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$3.140

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3,382

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$3.410

$3.140

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Verical

USA . 1,500 parts In-Stock

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$1.843

1,500

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$1.843

RS (Exports)

UK . 900 parts In-Stock

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$2.165

900

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$2.165

Distributors (In-Stock)

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Digiode

USA . 2,161 parts In-Stock

1+ parts

$2.062

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Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$2.568

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48

$2.568

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Flip Electronics

USA . 16,500 parts In-Stock

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Chip Stock

USA . 14,000 parts In-Stock

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Vyrian

USA . 5,035 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 8,528 parts In-Stock

1+ parts

$0.337

100+ parts

$0.337

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$0.337

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8,528

$0.337

$0.337

$0.337

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Ampacity Inc.

Singapore . 5,093 parts In-Stock

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$1.570

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5,093

$1.570

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Semicontronic

India . 4,469 parts In-Stock

1+ parts

$1.570

100+ parts

$1.531

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$1.523

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4,469

$1.570

$1.531

$1.523

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Corohmni

South Africa . 235 parts In-Stock

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$1.843

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235

$1.843

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Corphita

USA . 1,468 parts In-Stock

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$1.953

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1,468

$1.953

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

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$2.568

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$2.517

4,000

$2.568

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$2.517

Argo Parts USA

USA . 985 parts In-Stock

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$2.568

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985

$2.568

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TANS Electronics

Latvia . 8,260 parts In-Stock

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Problanco Electronics

Mexico . 6,768 parts In-Stock

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SupplyDigital Components

Austria . 5,989 parts In-Stock

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Lixinc

USA . 3,139 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kulean Microsystems

USA . 2,598 parts In-Stock

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UHIMA Technologies

Türkiye . 704 parts In-Stock

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Overview

Unleash the power of innovation with the NVMFD5C446NLT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are designed for maximum efficiency and performance. Ideal for a wide range of applications, this N-channel transistor offers enhanced functionality and reliability. Experience seamless operation and superior results with the NVMFD5C446NLT1G, providing customers with unparalleled value and benefits. Elevate your projects to new heights with this cutting-edge component from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and reliability are important factors.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have lower on-resistance and higher conductivity, making them more efficient for many power applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for versatile circuit design options and the built-in diode provides additional protection and functionality.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation rating, this FET can handle high power applications without overheating, ensuring reliability and longevity.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to withstand elevated temperatures, making it suitable for a wide range of operating environments.

Maximum Drain-Source On Resistance: 0.0039 ohm

The low on-resistance of the FET results in reduced power losses and improved efficiency in power switching applications.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 automotive industry standard ensures that the FET meets stringent quality and reliability requirements, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5C446NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

171 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

145 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.0039 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

48 pF

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

644 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFD5C446NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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