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BSC016N06NSATMA1

Infineon Technologies

BSC016N06NSATMA1 by Infineon Technologies

Infineon's BSC016N06NSATMA1 is a N-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a max IDM of 400A and EAS of 380mJ, ensuring efficient operation. With a drain-source on resistance of 0.0016 ohm and operating temperature up to 150°C, it offers high performance in a small outline package.

Median Price

$1.264

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,086 parts In-Stock

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$0.840

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$0.840

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Newark

USA . 214 parts In-Stock

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$2.600

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$1.380

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$1.150

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214

$2.600

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$1.150

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DigiKey

USA . 23,450 parts In-Stock

1+ parts

$2.990

100+ parts

$1.341

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$1.118

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$0.913

23,450

$2.990

$1.341

$1.118

$0.913

Mouser Electronics

USA . 27,197 parts In-Stock

1+ parts

$3.250

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$1.480

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Rochester

USA . 99,403 parts In-Stock

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$1.240

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Verical

USA . 64,000 parts In-Stock

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$1.147

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Avnet

USA . 60,000 parts In-Stock

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Arrow

USA . 45,000 parts In-Stock

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Future Electronics

Canada . 10,000 parts In-Stock

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Element14

Singapore . 7,534 parts In-Stock

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$2.060

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$1.600

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7,534

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RS (Exports)

UK . 4,445 parts In-Stock

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$1.236

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$0.862

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4,445

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Farnell

UK . 3,014 parts In-Stock

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$1.820

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$1.100

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 284 parts In-Stock

1+ parts

$0.819

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284

$0.819

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Maritex

Poland . 4,648 parts In-Stock

1+ parts

$1.091

100+ parts

$0.629

1k+ parts

$0.583

10k+ parts

$0.503

4,648

$1.091

$0.629

$0.583

$0.503

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.490

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300

$1.490

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Chip Stock

USA . 71,110 parts In-Stock

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Cyclops Electronics Ltd

UK . 44,017 parts In-Stock

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IBS Electronics

USA . 30,010 parts In-Stock

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NexGen Digital

USA . 29,092 parts In-Stock

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Vyrian

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NAC Semi

USA . 10,000 parts In-Stock

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Rutronik

Germany . 5,000 parts In-Stock

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VNN

France . 3,949 parts In-Stock

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Sensible Micro Corp

USA . 2,166 parts In-Stock

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Micros

Poland . 94 parts In-Stock

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LWI Electronics Inc

India . 19 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 24,944 parts In-Stock

1+ parts

$0.427

100+ parts

$0.410

1k+ parts

$0.393

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24,944

$0.427

$0.410

$0.393

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Ampacity Inc.

Singapore . 16,813 parts In-Stock

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$0.730

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$0.730

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Semicontronic

India . 16,742 parts In-Stock

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$0.730

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$0.712

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$0.708

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$0.730

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Corphita

USA . 844 parts In-Stock

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$0.776

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844

$0.776

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Advanced Electronics

New Zealand . 455 parts In-Stock

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$1.341

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$1.274

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$1.274

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455

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Argo Parts USA

USA . 3,384 parts In-Stock

1+ parts

$1.356

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Aztec Data Supply Inc.

USA . 170 parts In-Stock

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$1.584

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Corohmni

South Africa . 57 parts In-Stock

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$1.694

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Continental Prestige Electronics

USA . 7,471 parts In-Stock

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$2.480

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$1.580

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$1.230

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Microchip USA

USA . 2,024 parts In-Stock

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$7.902

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Eastek

USA . 160,000 parts In-Stock

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RC Electronics

USA . 46,442 parts In-Stock

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$2.240

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$1.990

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$1.990

Lixinc

USA . 16,887 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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S.R.D Solutions

India . 10,000 parts In-Stock

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iodParts Technologies Inc.

India . 7,130 parts In-Stock

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Robosynatics

Brazil . 6,271 parts In-Stock

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$1.687

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$1.652

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$1.652

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$1.652

$1.652

Lucentia Tech

USA . 6,271 parts In-Stock

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$1.687

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$1.652

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$1.652

6,271

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$1.652

Epart123

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 704 parts In-Stock

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Kepictronics

USA . 225 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$1.460

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$1.416

10k+ parts

$1.386

100

-

$1.460

$1.416

$1.386

Overview

Unleash the power of cutting-edge technology with the BSC016N06NSATMA1 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) is designed for high-performance switching applications. With a robust design and a maximum operating temperature of 150°C, this transistor offers unmatched reliability and efficiency. Experience seamless operation and superior functionality with the BSC016N06NSATMA1, setting new standards in the world of electronic components. Elevate your projects with this innovative solution from Infineon Technologies today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the internal components of the FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the FET simplifies circuit design and enhances efficiency by reducing the need for external components, making it a convenient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures reliable performance and fast response times for efficient power management.

Surface Mount: YES

With surface mount capability, this FET can be easily integrated into compact circuit board designs, saving space and simplifying production processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high efficiency and fast switching speeds, making this product suitable for demanding applications requiring precise control and high performance.

Maximum Power Dissipation (Abs): 139 W

With a high power dissipation rating, this FET can handle heavy loads and high temperatures without compromising performance, ensuring long-term reliability in demanding conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this FET to function reliably in harsh environments with elevated temperatures, making it a dependable choice for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) BSC016N06NSATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

380 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.0016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC016N06NSATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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