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BSC011N03LSTATMA1

Infineon Technologies

BSC011N03LSTATMA1 by Infineon Technologies

Infineon's BSC011N03LSTATMA1 is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 400A IDM, 0.0014 ohm RDS(on), and 190mJ EAS. Its small outline package and DUAL terminals make it suitable for high-power ENHANCEMENT MODE operations.

Median Price

$2.055

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 4,857 parts In-Stock

1+ parts

$1.960

100+ parts

$0.884

1k+ parts

$0.677

10k+ parts

-

4,857

$1.960

$0.884

$0.677

-

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

$3.010

100+ parts

$1.940

1k+ parts

-

10k+ parts

-

5,000

$3.010

$1.940

-

-

Newark

USA . 4,757 parts In-Stock

1+ parts

$3.110

100+ parts

$1.390

1k+ parts

$1.170

10k+ parts

-

4,757

$3.110

$1.390

$1.170

-

DigiKey

USA . 4,598 parts In-Stock

1+ parts

$3.560

100+ parts

$1.598

1k+ parts

$1.195

10k+ parts

$1.139

4,598

$3.560

$1.598

$1.195

$1.139

Rochester

USA . 14,600 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

$1.050

10k+ parts

$0.932

14,600

-

$1.260

$1.050

$0.932

Verical

USA . 14,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.313

10k+ parts

$1.165

14,590

-

-

$1.313

$1.165

RS (Exports)

UK . 4,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.525

4,990

-

-

-

$1.525

Element14

Singapore . 4,857 parts In-Stock

1+ parts

-

100+ parts

$2.150

1k+ parts

$1.580

10k+ parts

-

4,857

-

$2.150

$1.580

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 199 parts In-Stock

1+ parts

$0.978

100+ parts

-

1k+ parts

-

10k+ parts

-

199

$0.978

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$1.600

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$1.600

-

-

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VNN

France . 7,168 parts In-Stock

1+ parts

-

100+ parts

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7,168

-

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Vyrian

USA . 4,142 parts In-Stock

1+ parts

-

100+ parts

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4,142

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,864 parts In-Stock

1+ parts

$0.573

100+ parts

-

1k+ parts

-

10k+ parts

-

2,864

$0.573

-

-

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Continental Prestige Electronics

USA . 4,993 parts In-Stock

1+ parts

$0.735

100+ parts

-

1k+ parts

-

10k+ parts

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4,993

$0.735

-

-

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Semicontronic

India . 3,966 parts In-Stock

1+ parts

$0.880

100+ parts

$0.858

1k+ parts

$0.854

10k+ parts

-

3,966

$0.880

$0.858

$0.854

-

Ampacity Inc.

Singapore . 3,903 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

-

10k+ parts

-

3,903

$0.880

-

-

-

Corphita

USA . 578 parts In-Stock

1+ parts

$0.927

100+ parts

-

1k+ parts

-

10k+ parts

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578

$0.927

-

-

-

Argo Parts USA

USA . 4,740 parts In-Stock

1+ parts

$1.495

100+ parts

-

1k+ parts

-

10k+ parts

-

4,740

$1.495

-

-

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Modulus Dynamics

Lithuania . 14,230 parts In-Stock

1+ parts

$1.840

100+ parts

$1.766

1k+ parts

$1.693

10k+ parts

-

14,230

$1.840

$1.766

$1.693

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Corohmni

South Africa . 245 parts In-Stock

1+ parts

$1.840

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$1.840

-

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$1.895

100+ parts

$1.800

1k+ parts

$1.800

10k+ parts

-

1,000

$1.895

$1.800

$1.800

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Microchip USA

USA . 6,934 parts In-Stock

1+ parts

$8.506

100+ parts

-

1k+ parts

-

10k+ parts

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6,934

$8.506

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RC Electronics

USA . 19,622 parts In-Stock

1+ parts

-

100+ parts

$1.840

1k+ parts

$1.730

10k+ parts

$1.700

19,622

-

$1.840

$1.730

$1.700

Robosynatics

Brazil . 200 parts In-Stock

1+ parts

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100+ parts

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200

-

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Lucentia Tech

USA . 200 parts In-Stock

1+ parts

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100+ parts

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200

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Overview

Unlock the power of efficient switching with the BSC011N03LSTATMA1 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers reliable performance in a variety of applications. With a maximum pulsing drain current of 400A and a low on-resistance of 0.0014 ohm, this transistor delivers superior functionality and durability. Whether you're looking to optimize your power management system or enhance your switching capabilities, this product provides unmatched value and benefits to meet your needs. Choose excellence, choose BSC011N03LSTATMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and allows for easy handling and installation.

Polarity or Channel Type: N-CHANNEL

N-channel type offers better conductivity and efficiency compared to other types, making it a reliable choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against reverse currents, increasing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in various electronic systems.

Surface Mount: YES

Being surface mountable saves space and simplifies PCB design, making it suitable for compact and modern electronic devices.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can withstand higher voltages, making it suitable for a range of applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB and facilitates heat dissipation, enhancing performance.

Terminal Form: FLAT

Flat terminals provide a secure connection and ease of soldering, ensuring reliable electrical contact.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers precise control over the transistor’s conductivity, allowing for efficient power management.

Maximum Pulsed Drain Current (IDM): 400 A

High pulsed current rating enables the FET to handle sudden surges of power, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 190 mJ

High avalanche energy rating ensures protection against voltage spikes, making it ideal for rugged environments.

No. of Terminals: 8

Eight terminals provide flexibility in circuit connections and allow for versatile usage in various electronic designs.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact designs, making it ideal for portable devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, enhancing performance.

Transistor Element Material: SILICON

Silicon material ensures reliability and stability, making this FET suitable for long-term use in electronic devices.

Maximum Drain Current (ID): 37 A

High drain current rating allows for efficient power handling, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.0014 ohm

Low on-resistance minimizes power loss and heat generation, improving overall efficiency of the FET.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and facilitates easy connection to other components in the circuit.

Case Connection: DRAIN

Drain connection simplifies circuit configuration and ensures proper current flow, enhancing overall performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance makes it suitable for lead-free soldering processes, ensuring reliability during manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) BSC011N03LSTATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

190 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

37 A

Maximum Drain-Source On Resistance:

.0014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC011N03LSTATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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