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NTF2955T1G

Onsemi

NTF2955T1G by Onsemi

NTF2955T1G by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 10.4A IDM, 225mJ EAS, and 0.185 ohm RDS(on). With ENHANCEMENT MODE operation and DUAL terminal position, it offers efficient power dissipation up to 1.92W in a SMALL OUTLINE package.

Median Price

$0.816

Lifecycle Status

Suppliers In-Stock

39

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1k+

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Farnell

UK . 30,810 parts In-Stock

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$1.300

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$0.772

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$0.508

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$1.300

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Chip1Stop

Japan . 1,230 parts In-Stock

1+ parts

$1.480

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$0.693

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$0.416

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$0.383

1,230

$1.480

$0.693

$0.416

$0.383

Mouser Electronics

USA . 26,405 parts In-Stock

1+ parts

$1.710

100+ parts

$0.761

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$0.524

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26,405

$1.710

$0.761

$0.524

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DigiKey

USA . 13,918 parts In-Stock

1+ parts

$1.830

100+ parts

$0.779

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$0.614

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13,918

$1.830

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$0.614

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Element14

Singapore . 32,544 parts In-Stock

1+ parts

$2.100

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$1.050

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$0.816

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32,544

$2.100

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$0.816

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Newark

USA . 258,000 parts In-Stock

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$0.626

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$0.582

258,000

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Future Electronics

Canada . 189,000 parts In-Stock

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$0.650

10k+ parts

$0.615

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$0.615

Verical

USA . 161,965 parts In-Stock

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$0.777

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$0.524

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$0.482

161,965

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$0.482

Rochester

USA . 24,000 parts In-Stock

1+ parts

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$0.576

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$0.478

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$0.426

24,000

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$0.478

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Arrow

USA . 18,000 parts In-Stock

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$0.530

10k+ parts

$0.489

18,000

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RS (Exports)

UK . 10,084 parts In-Stock

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$0.544

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$0.524

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Master Electronics

USA . 7,000 parts In-Stock

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$0.854

1k+ parts

$0.491

10k+ parts

$0.468

7,000

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$0.491

$0.468

Distributors (In-Stock)

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Freelance Electronics

USA . 5 parts In-Stock

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$0.382

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Digiode

USA . 1,378 parts In-Stock

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$0.447

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Maritex

Poland . 908 parts In-Stock

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$0.607

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$0.348

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$0.294

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$0.607

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Component Electronics Inc.

Canada . 5 parts In-Stock

1+ parts

$0.770

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$0.580

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$0.500

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5

$0.770

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Nova Conductors

Japan . 20 parts In-Stock

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TME

Poland . 418 parts In-Stock

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$1.630

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$0.740

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$0.508

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418

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$0.463

NAC Semi

USA . 239,000 parts In-Stock

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IBS Electronics

USA . 229,000 parts In-Stock

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$1.185

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Chip Stock

USA . 119,490 parts In-Stock

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Vyrian

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Electro Sonic

Canada . 10,000 parts In-Stock

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Martec Srl

Italy . 6,242 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,467 parts In-Stock

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Flip Electronics

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Bristol Electronics

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ComSIT Distribution GmbH

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USA . 140 parts In-Stock

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A2Z Electronics, Inc.

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Speed Components Ltd

Israel . 53 parts In-Stock

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Ukraine . 10 parts In-Stock

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EMSNET

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Semicontronic

India . 51,028 parts In-Stock

1+ parts

$0.336

100+ parts

$0.328

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$0.326

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Corohmni

South Africa . 142 parts In-Stock

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Corphita

USA . 256 parts In-Stock

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Modulus Dynamics

Lithuania . 9,652 parts In-Stock

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Continental Prestige Electronics

USA . 4,304 parts In-Stock

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$0.540

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Argo Parts USA

USA . 3,637 parts In-Stock

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$0.540

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Aztec Data Supply Inc.

USA . 274 parts In-Stock

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$0.580

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Advanced Electronics

New Zealand . 150 parts In-Stock

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Ampacity Inc.

Singapore . 52,551 parts In-Stock

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Perfect Parts

USA . 506,518 parts In-Stock

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RC Electronics

USA . 82,887 parts In-Stock

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Futuretech Components

Singapore . 20,000 parts In-Stock

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iodParts Technologies Inc.

India . 14,885 parts In-Stock

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Authorized Procurement Solutions

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Robosynatics

Brazil . 8,829 parts In-Stock

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Lucentia Tech

USA . 8,829 parts In-Stock

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$0.588

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$0.588

S.R.D Solutions

India . 8,500 parts In-Stock

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Problanco Electronics

Mexico . 6,815 parts In-Stock

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Kulean Microsystems

USA . 4,639 parts In-Stock

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TANS Electronics

Latvia . 4,627 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Austria . 741 parts In-Stock

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Infinite Electronics LLP (Excess)

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UK . 234 parts In-Stock

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India . 214 parts In-Stock

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UK . 65 parts In-Stock

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UHIMA Technologies

Türkiye . 47 parts In-Stock

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Computer Components Inc. - USA

USA . 10 parts In-Stock

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Overview

Discover the power and efficiency of the NTF2955T1G by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. With a durable plastic/epoxy package body and P-channel configuration, this single transistor with built-in diode offers enhanced performance and reliability. Ideal for various electronics projects, this transistor provides a maximum pulsed drain current of 10.4A and a minimum DS breakdown voltage of 60V. Trust in Onsemi's reputation for excellence and unlock the potential of your designs with the NTF2955T1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

The P-channel type offers lower on-resistance and higher current carrying capability compared to N-channel types, making it suitable for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching speeds and helps prevent damage from reverse voltage spikes, improving overall performance and reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching times and low power loss, ideal for efficient power management.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages safely, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient packing on circuit boards, optimizing space utilization and overall system design.

Terminal Form: GULL WING

The gull wing terminals provide mechanical strength and ease of soldering during installation, ensuring secure connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor, making it ideal for applications where precise modulation of current flow is required.

Maximum Pulsed Drain Current (IDM): 10.4 A

High pulsed drain current rating enables the FET to handle short-term peak loads without exceeding its limits, ensuring reliability in demanding conditions.

Avalanche Energy Rating (EAS): 225 mJ

The high avalanche energy rating means the FET can withstand high-energy transients without damage, making it suitable for rugged applications.

Maximum Drain Current (Abs) (ID): 2.4 A

The high maximum drain current rating allows for efficient power handling, making this FET suitable for a wide range of applications.

No. of Terminals: 4

With 4 terminals, this FET offers flexibility in circuit design and connectivity options for various applications.

Maximum Power Dissipation (Abs): 1.92 W

The high power dissipation rating allows the FET to handle heat generated during operation effectively, ensuring reliable performance under high load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact designs and applications where size is a constraint.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this FET a dependable choice for demanding applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring reliability in harsh environments.

Transistor Element Material: SILICON

Silicon material provides excellent electrical properties, making this FET suitable for high-frequency and high-power applications.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides corrosion resistance and excellent solderability, ensuring long-term reliability in various operating conditions.

Maximum Drain Current (ID): 1.7 A

High maximum drain current rating makes this FET suitable for applications requiring efficient power handling with low on-resistance.

Maximum Drain-Source On Resistance: 0.185 ohm

Low drain-source on-resistance ensures minimal power loss and heat dissipation, making this FET energy-efficient and suitable for high-current applications.

Terminal Position: DUAL

Dual terminal position allows for easier connections and flexibility in circuit design, accommodating various mounting orientations and configurations.

Case Connection: DRAIN

Drain case connection simplifies the circuit layout and helps in efficient heat dissipation, ensuring stable operation during high-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, this FET can withstand soldering processes without damage, ensuring reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows the FET to withstand reflow soldering processes without compromising its electrical properties, ensuring robust performance.

Technical Specifications

Power Field Effect Transistors (FET) NTF2955T1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

225 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2.4 A

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.185 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10.4 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF2955T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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