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NTF2955T3

Onsemi

NTF2955T3 by Onsemi

NTF2955T3 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 10.4A IDM, 225mJ EAS, and 0.185 ohm RDS(on). Its small outline package and high temp rating make it suitable for various electronic designs.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,948 parts In-Stock

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Digiode

USA . 405 parts In-Stock

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Kulean Microsystems

USA . 7,260 parts In-Stock

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Problanco Electronics

Mexico . 2,791 parts In-Stock

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TANS Electronics

Latvia . 2,402 parts In-Stock

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Corphita

USA . 2,130 parts In-Stock

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SupplyDigital Components

Austria . 1,564 parts In-Stock

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UHIMA Technologies

Türkiye . 659 parts In-Stock

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Corohmni

South Africa . 206 parts In-Stock

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Overview

Unleash the power of innovation with the NTF2955T3 by Onsemi. Designed with precision and reliability, this P-CHANNEL Power Field Effect Transistor (FET) is perfect for a wide range of switching applications. With a maximum operating temperature of 150 °C, this single configuration transistor offers enhanced performance and efficiency. Say goodbye to overheating and hello to seamless functionality with the NTF2955T3. Trust Onsemi's expertise and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the FET, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where P-channel FETs are required, offering different circuit design options and flexibility.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with a built-in diode for reverse current protection, simplifying the circuitry and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance and fast response times.

Surface Mount: YES

Ideal for surface mount applications, saving space on the PCB and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle high voltage applications safely and reliably.

Package Shape: RECTANGULAR

A common and practical package shape for easy handling and mounting on the PCB.

Terminal Form: GULL WING

Gull wing terminals provide reliable electrical connections and easy soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to use and control, offering better efficiency and performance in switching applications.

Maximum Pulsed Drain Current (IDM): 10.4 A

High pulsed drain current rating allows the FET to handle temporary overloads without damage.

Avalanche Energy Rating (EAS): 225 mJ

Good avalanche energy rating ensures the FET can withstand high energy spikes and transient events without failure.

Maximum Drain Current (Abs) (ID): 2.4 A

Capable of handling continuous drain currents up to 2.4 A, suitable for moderate power applications.

Maximum Power Dissipation (Abs): 1.92 W

Efficient power dissipation capability ensures the FET can operate within its specified limits without overheating.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space on the PCB and facilitates high-density circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance for improved efficiency in switching applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, the FET can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon material provides good reliability and performance characteristics for the transistor element.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability and reliable electrical connections during assembly.

Maximum Drain Current (ID): 1.7 A

Capable of handling continuous drain currents up to 1.7 A, suitable for low to moderate power applications.

Maximum Drain-Source On Resistance: 0.185 ohm

Low drain-source on resistance ensures minimal power loss and efficient switching operation.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting and connection options, catering to different PCB layouts.

Case Connection: DRAIN

Case connection to drain terminal simplifies the circuit design and ensures proper grounding for the FET.

Technical Specifications

Power Field Effect Transistors (FET) NTF2955T3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

225 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2.4 A

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.185 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10.4 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF2955T3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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