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BSC067N06LS3GXT

Infineon Technologies

BSC067N06LS3GXT by Infineon Technologies

BSC067N06LS3GXT by Infineon is a N-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a max IDM of 200A and 0.0067 ohm RDS(on), operating in enhancement mode up to 150°C. This MOSFET comes in a small outline package with built-in diode, suitable for high-power electronic designs.

Median Price

$0.443

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 25,000 parts In-Stock

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$0.443

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$0.443

Distributors (In-Stock)

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Vyrian

USA . 19,543 parts In-Stock

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19,543

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VNN

France . 2,833 parts In-Stock

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2,833

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Digiode

USA . 696 parts In-Stock

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696

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 19,805 parts In-Stock

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$0.350

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19,805

$0.350

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Semicontronic

India . 24,997 parts In-Stock

1+ parts

$0.377

100+ parts

$0.368

1k+ parts

$0.366

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-

24,997

$0.377

$0.368

$0.366

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Modulus Dynamics

Lithuania . 15,593 parts In-Stock

1+ parts

$0.666

100+ parts

$0.639

1k+ parts

$0.613

10k+ parts

-

15,593

$0.666

$0.639

$0.613

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Aztec Data Supply Inc.

USA . 42,421 parts In-Stock

1+ parts

$0.770

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$0.770

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Corohmni

South Africa . 238 parts In-Stock

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$1.143

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238

$1.143

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$1.149

100+ parts

$1.092

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$1.092

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600

$1.149

$1.092

$1.092

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Continental Prestige Electronics

USA . 5,846 parts In-Stock

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Argo Parts USA

USA . 635 parts In-Stock

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Corphita

USA . 434 parts In-Stock

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434

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Robosynatics

Brazil . 350 parts In-Stock

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$38.869

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$38.869

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$38.869

350

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$38.869

$38.869

$38.869

Lucentia Tech

USA . 350 parts In-Stock

1+ parts

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$38.869

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$38.869

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$38.869

350

-

$38.869

$38.869

$38.869

Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock the power of efficient and reliable switching with the BSC067N06LS3GXT from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications. With a single configuration and built-in diode, this N-CHANNEL transistor boasts enhanced performance and durability. Experience the benefits of fast and smooth operation, maximum pulsing drain current of 200 A, and a low drain-source on resistance of 0.0067 ohm. Trust in Infineon to provide high-value solutions that meet your power management needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides good insulation and protection for the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher mobility, resulting in better efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for faster switching and protects the circuit from reverse voltage spikes, enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast response times and efficient operation.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages without malfunction or damage.

Surface Mount: YES

Surface mount technology allows for easier and more compact PCB assembly, saving space and reducing manufacturing costs.

Maximum Pulsed Drain Current (IDM): 200 A

High pulsed drain current capacity allows for handling large current spikes without impacting performance or reliability.

Avalanche Energy Rating (EAS): 47 mJ

A higher avalanche energy rating ensures greater protection against voltage spikes and improves the overall durability of the FET.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand harsh environmental conditions and operate reliably in challenging situations.

Maximum Drain Current (ID): 15 A

Capable of handling high drain currents, making it suitable for a wide range of applications that require efficient power handling.

Maximum Drain-Source On Resistance: 0.0067 ohm

Low ON resistance results in minimal power loss and improved efficiency during operation.

Technical Specifications

Power Field Effect Transistors (FET) BSC067N06LS3GXT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

47 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.0067 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

200 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC067N06LS3GXT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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