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BSC900N20NS3GATMA1

Infineon Technologies

BSC900N20NS3GATMA1 by Infineon Technologies

BSC900N20NS3GATMA1 by Infineon Technologies is a power FET with N-channel polarity. It has a min DS breakdown voltage of 200V and can handle a max pulsed drain current of 61A. This transistor is commonly used for switching applications.

Median Price

$1.096

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Chip1Stop

Japan . 7,192 parts In-Stock

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$1.090

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$0.914

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$1.090

$0.914

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Arrow

USA . 2,080 parts In-Stock

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$1.096

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$0.788

1k+ parts

$0.576

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-

2,080

$1.096

$0.788

$0.576

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DigiKey

USA . 2,665 parts In-Stock

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$2.520

100+ parts

$1.100

1k+ parts

$0.808

10k+ parts

$0.633

2,665

$2.520

$1.100

$0.808

$0.633

Element14

Singapore . 7,698 parts In-Stock

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$3.160

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$2.270

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$1.440

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$1.410

7,698

$3.160

$2.270

$1.440

$1.410

Verical

USA . 7,192 parts In-Stock

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-

100+ parts

$1.285

1k+ parts

$0.944

10k+ parts

$0.792

7,192

-

$1.285

$0.944

$0.792

Farnell

UK . 5,197 parts In-Stock

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-

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$0.850

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$0.640

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$0.615

5,197

-

$0.850

$0.640

$0.615

Rochester

USA . 4,788 parts In-Stock

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-

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$0.860

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$0.714

10k+ parts

$0.636

4,788

-

$0.860

$0.714

$0.636

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Digiode

USA . 462 parts In-Stock

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$0.669

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462

$0.669

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Nova Conductors

Japan . 50 parts In-Stock

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$1.365

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50

$1.365

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Vyrian

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Chip Stock

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VNN

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Bristol Electronics

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Semicontronic

India . 33,146 parts In-Stock

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$0.399

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$0.389

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$0.387

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33,146

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Ampacity Inc.

Singapore . 32,701 parts In-Stock

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$0.399

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32,701

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Corphita

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$0.634

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Corohmni

South Africa . 300 parts In-Stock

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$0.692

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Aztec Data Supply Inc.

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$0.840

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709

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Modulus Dynamics

Lithuania . 3,775 parts In-Stock

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$0.947

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$0.909

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$0.871

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3,775

$0.947

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Advanced Electronics

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$0.970

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$0.922

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$0.922

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150

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$0.922

$0.922

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Continental Prestige Electronics

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$1.101

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$1.079

6,726

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$1.079

Argo Parts USA

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$1.365

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$1.297

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$1.232

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$1.215

1,633

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$1.297

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$1.215

Microchip USA

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$1.815

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$1.778

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16,947

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$1.778

RC Electronics

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iodParts Technologies Inc.

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Overview

Discover the power and reliability of Infineon Technologies' BSC900N20NS3GATMA1, a high-quality Power Field Effect Transistor (FET) designed for various switching applications. With its N-channel configuration and built-in diode, this transistor offers enhanced performance and efficiency. The small outline package and surface mount compatibility make it versatile and easy to use. Benefit from its impressive 200V minimum DS breakdown voltage and maximum pulsed drain current of 61A. Whether you need to optimize power management or improve system performance, the BSC900N20NS3GATMA1 is the ideal solution. Trust Infineon Technologies for cutting-edge technology and top-notch manufacturing expertise. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Minimum DS Breakdown Voltage: 200 V

Allows for high voltage operation, making it suitable for applications requiring switching tasks in higher power circuits.

Maximum Pulsed Drain Current (IDM): 61 A

Capable of handling high current pulses, ideal for applications where sudden surges in power are common.

Maximum Operating Temperature: 150 °C

Can operate efficiently in high-temperature environments, expanding its range of applications.

Maximum Drain-Source On Resistance: 0.09 ohm

Low on-resistance ensures minimal power loss and efficient performance.

Avalanche Energy Rating (EAS): 100 mJ

Capable of withstanding high-energy events such as voltage spikes or transients, contributing to overall system reliability.

Technical Specifications

Power Field Effect Transistors (FET) BSC900N20NS3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

15.2 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

61 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC900N20NS3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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