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BSP320SH6327XTSA1

Infineon Technologies

BSP320SH6327XTSA1 by Infineon Technologies

Infineon's BSP320SH6327XTSA1 is a N-CHANNEL Power FET with 60V DS Breakdown Voltage. It features 11.6A IDM, 0.12 ohm RDS(on), and 150°C Max Operating Temp. Ideal for automotive applications due to AEC-Q101 compliance, it offers high efficiency in compact designs with its small outline package and built-in diode configuration.

Median Price

$0.357

Lifecycle Status

EOL

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 62 parts In-Stock

1+ parts

$0.607

100+ parts

$0.530

1k+ parts

-

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62

$0.607

$0.530

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Chip1Stop

Japan . 50 parts In-Stock

1+ parts

$0.739

100+ parts

-

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-

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50

$0.739

-

-

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Element14

Singapore . 214 parts In-Stock

1+ parts

$0.799

100+ parts

$0.449

1k+ parts

$0.355

10k+ parts

-

214

$0.799

$0.449

$0.355

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Rochester

USA . 27,519 parts In-Stock

1+ parts

-

100+ parts

$0.336

1k+ parts

$0.279

10k+ parts

$0.248

27,519

-

$0.336

$0.279

$0.248

Mouser Electronics

USA . 18,361 parts In-Stock

1+ parts

-

100+ parts

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$0.250

10k+ parts

$0.247

18,361

-

-

$0.250

$0.247

Verical

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

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$0.378

10k+ parts

$0.310

16,000

-

-

$0.378

$0.310

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.265

10k+ parts

$0.237

1,000

-

-

$0.265

$0.237

RS (Exports)

UK . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.271

10k+ parts

$0.244

750

-

-

$0.271

$0.244

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 711 parts In-Stock

1+ parts

$0.261

100+ parts

-

1k+ parts

-

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711

$0.261

-

-

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Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$0.389

100+ parts

-

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98

$0.389

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Chip Stock

USA . 6,500 parts In-Stock

1+ parts

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6,500

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Rutronik

Germany . 3,000 parts In-Stock

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Vyrian

USA . 2,612 parts In-Stock

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2,612

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VNN

France . 2,256 parts In-Stock

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2,256

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Schukat

Germany . 1,200 parts In-Stock

1+ parts

-

100+ parts

$0.536

1k+ parts

$0.307

10k+ parts

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1,200

-

$0.536

$0.307

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Semi Source

USA . 990 parts In-Stock

1+ parts

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990

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TME

Poland . 118 parts In-Stock

1+ parts

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100+ parts

$0.256

1k+ parts

$0.207

10k+ parts

-

118

-

$0.256

$0.207

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,253 parts In-Stock

1+ parts

$0.209

100+ parts

-

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2,253

$0.209

-

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Semicontronic

India . 2,182 parts In-Stock

1+ parts

$0.209

100+ parts

$0.204

1k+ parts

$0.203

10k+ parts

-

2,182

$0.209

$0.204

$0.203

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Corphita

USA . 94 parts In-Stock

1+ parts

$0.248

100+ parts

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94

$0.248

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-

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Argo Parts USA

USA . 3,958 parts In-Stock

1+ parts

$0.349

100+ parts

-

1k+ parts

-

10k+ parts

$0.338

3,958

$0.349

-

-

$0.338

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.389

100+ parts

-

1k+ parts

$0.370

10k+ parts

$0.362

2,000

$0.389

-

$0.370

$0.362

Modulus Dynamics

Lithuania . 18,999 parts In-Stock

1+ parts

$0.429

100+ parts

$0.412

1k+ parts

$0.395

10k+ parts

-

18,999

$0.429

$0.412

$0.395

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Aztec Data Supply Inc.

USA . 271 parts In-Stock

1+ parts

$0.520

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-

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271

$0.520

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Continental Prestige Electronics

USA . 1,198 parts In-Stock

1+ parts

$0.714

100+ parts

$0.426

1k+ parts

$0.244

10k+ parts

$0.218

1,198

$0.714

$0.426

$0.244

$0.218

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$1.062

100+ parts

$1.009

1k+ parts

$1.009

10k+ parts

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200

$1.062

$1.009

$1.009

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Corohmni

South Africa . 43 parts In-Stock

1+ parts

$1.907

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43

$1.907

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Microchip USA

USA . 392 parts In-Stock

1+ parts

$2.080

100+ parts

$2.070

1k+ parts

$2.060

10k+ parts

$2.060

392

$2.080

$2.070

$2.060

$2.060

RC Electronics

USA . 79,958 parts In-Stock

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79,958

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QUARKTWIN TECHNOLOGY LTD

USA . 18,098 parts In-Stock

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18,098

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Allen Electronics Distributors

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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$3.483

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1,000

-

-

$3.483

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Perfect Parts

USA . 886 parts In-Stock

1+ parts

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886

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock the power and reliability of Infineon Technologies with the BSP320SH6327XTSA1 Power Field Effect Transistor (FET). As a leader in semiconductor manufacturing, Infineon delivers top-notch quality and durability. Ideal for applications requiring high performance and efficiency, this N-channel FET with built-in diode offers unmatched value to customers. With a minimum DS breakdown voltage of 60V and maximum pulsed drain current of 11.6A, this transistor is perfect for enhancing your next project. Trust in Infineon for cutting-edge technology and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor durable and resistant to external factors, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher conductivity, making them ideal for efficient power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and allows for more compact setups, optimizing overall performance.

Surface Mount: YES

Being surface mountable makes installation easier and allows for increased component density on the PCB, saving space.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes or overloads.

Package Shape: RECTANGULAR

The rectangular shape provides easy and stable mounting on the PCB, enhancing mechanical stability.

Terminal Form: GULL WING

The gull wing terminals facilitate easy soldering during assembly, ensuring a secure electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching process, leading to higher efficiency and performance.

Maximum Pulsed Drain Current (IDM): 11.6 A

The high pulsed drain current rating allows the FET to handle spikes in current without damage, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 60 mJ

The high avalanche energy rating indicates robustness against voltage surges, ensuring reliable operation in harsh conditions.

Maximum Drain Current (Abs) (ID): 2.9 A

The high maximum drain current rating indicates the FET's ability to handle continuous current flow without overheating.

No. of Terminals: 4

Having 4 terminals allows for versatile connections and configurations in the circuit, enhancing flexibility.

Maximum Power Dissipation (Abs): 1.8 W

The high power dissipation rating indicates the FET's ability to handle heat generated during operation, ensuring reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, ideal for compact designs and applications with size constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high speed and efficiency, making them suitable for a wide range of power management applications.

Maximum Operating Temperature: 150 °C

The high operating temperature rating allows the FET to function reliably in elevated temperatures, expanding its potential uses.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance and reliability, making them a popular choice in power electronics applications.

Terminal Finish: TIN

Tin terminal finish ensures good solderability and corrosion resistance, enhancing the FET's durability in various environments.

Maximum Drain-Source On Resistance: 0.12 ohm

Having a low ON-resistance improves efficiency and reduces power loss in the circuit, making the FET a high-performance choice.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting orientations, providing flexibility in circuit layout and assembly.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature ensures proper soldering and reliability during assembly, maintaining electrical connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the FET's ability to withstand the soldering process without damage, ensuring robust performance.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures the FET meets automotive-grade requirements for quality, reliability, and performance.

Technical Specifications

Power Field Effect Transistors (FET) BSP320SH6327XTSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

60 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2.9 A

Maximum Drain Current (ID):

2.9 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

11.6 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

BSP320SH6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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